JP6004705B2 - 接着フィルム付きチップの形成方法 - Google Patents
接着フィルム付きチップの形成方法 Download PDFInfo
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- JP6004705B2 JP6004705B2 JP2012083780A JP2012083780A JP6004705B2 JP 6004705 B2 JP6004705 B2 JP 6004705B2 JP 2012083780 A JP2012083780 A JP 2012083780A JP 2012083780 A JP2012083780 A JP 2012083780A JP 6004705 B2 JP6004705 B2 JP 6004705B2
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- adhesive film
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- 239000002313 adhesive film Substances 0.000 title claims description 95
- 238000000034 method Methods 0.000 title claims description 27
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 90
- 239000010410 layer Substances 0.000 description 24
- 230000001681 protective effect Effects 0.000 description 13
- 230000011218 segmentation Effects 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 5
- 238000002679 ablation Methods 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical & Material Sciences (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
光源 :LD励起Qスイッチ Nd:YVO4パルスレーザ
波長 :1064nm
繰り返し周波数 :100kHz
平均出力 :1W
集光スポット径 :φ1μm
加工送り速度 :100mm/秒
光源 :LD励起Qスイッチ Nd:YAGパルスレーザ
波長 :355nm(YAGレーザーの第3高調波)
出力 :3〜3.75W
繰り返し周波数 :10kHz
加工送り速度 :100〜200mm/秒
30 接着フィルム
31 分割溝
60 エキスパンドシート
73 改質層
74 改質層
75 分割溝
W ウェーハ
Wa 表面
Wb 裏面
Wc 円形凹部
Wd 環状凸部
Claims (2)
- 裏面に接着フィルムが貼着された接着フィルム付きチップを形成する接着フィルム付きチップの形成方法であって、
交差する複数の分割予定ラインが設定されたウェーハに該分割予定ラインに沿った分割起点を形成する分割起点形成ステップと、
該分割起点形成ステップを実施した後、ウェーハの裏面に接着フィルムを貼着する接着フィルム貼着ステップと、
該接着フィルム貼着ステップを実施した後、該接着フィルムに該分割予定ラインに沿った分割溝をレーザービームの照射または切削ブレードで形成する接着フィルム分割溝形成ステップと、
該接着フィルム分割溝形成ステップを実施した後、ウェーハに貼着された該接着フィルム上にエキスパンドシートを貼着するエキスパンドシート貼着ステップと、
該エキスパンドシート貼着ステップを実施した後、該エキスパンドシートをエキスパンドすることによりウェーハに外力を付与してウェーハと該接着フィルムとを個々のチップへと分割し、裏面に接着フィルムが貼着された接着フィルム付きチップを複数形成する分割ステップと、
該分割起点形成ステップを実施する前に、ウェーハの裏面を研削して円形凹部を形成するとともに、該円形凹部を囲繞する環状凸部を形成する研削ステップと、
を備え、
該分割起点形成ステップでは、レーザービームをウェーハの裏面に照射して分割起点となる改質層を形成するとともに、ウェーハの外周余剰領域に円形の改質層を形成しないことを特徴とする接着フィルム付きチップの形成方法。 - 前記分割ステップでは、該エキスパンドシートをエキスパンドする前に、ウェーハの表面から該外周余剰領域に円形の改質層又は分割溝を形成することを特徴とする請求項1に記載の接着フィルム付きチップの形成方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012083780A JP6004705B2 (ja) | 2012-04-02 | 2012-04-02 | 接着フィルム付きチップの形成方法 |
TW102109042A TWI606506B (zh) | 2012-04-02 | 2013-03-14 | Method for forming a follow-up film wafer |
DE201310205644 DE102013205644A1 (de) | 2012-04-02 | 2013-03-28 | Herstellverfahren für Chips mit Haftfolien |
KR1020130034420A KR101938426B1 (ko) | 2012-04-02 | 2013-03-29 | 접착 필름을 갖는 칩의 형성 방법 |
CN201310110400.3A CN103367219B (zh) | 2012-04-02 | 2013-04-01 | 带粘接膜的芯片的形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012083780A JP6004705B2 (ja) | 2012-04-02 | 2012-04-02 | 接着フィルム付きチップの形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013214600A JP2013214600A (ja) | 2013-10-17 |
JP6004705B2 true JP6004705B2 (ja) | 2016-10-12 |
Family
ID=49155005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012083780A Active JP6004705B2 (ja) | 2012-04-02 | 2012-04-02 | 接着フィルム付きチップの形成方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6004705B2 (ja) |
KR (1) | KR101938426B1 (ja) |
CN (1) | CN103367219B (ja) |
DE (1) | DE102013205644A1 (ja) |
TW (1) | TWI606506B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6235396B2 (ja) * | 2014-03-28 | 2017-11-22 | 株式会社ディスコ | ウエーハの加工方法 |
JP6385131B2 (ja) * | 2014-05-13 | 2018-09-05 | 株式会社ディスコ | ウェーハの加工方法 |
JP6366351B2 (ja) * | 2014-05-13 | 2018-08-01 | 株式会社ディスコ | ウェーハの加工方法 |
DE102015100827A1 (de) | 2015-01-21 | 2016-07-21 | Infineon Technologies Ag | Verfahren zum Bearbeiten eines Halbleitersubstrats und Halbleiterchips |
JP6482425B2 (ja) * | 2015-07-21 | 2019-03-13 | 株式会社ディスコ | ウエーハの薄化方法 |
JP2018014450A (ja) * | 2016-07-22 | 2018-01-25 | 株式会社ディスコ | ウェーハの加工方法 |
JP6814646B2 (ja) * | 2017-01-23 | 2021-01-20 | 株式会社ディスコ | 光デバイスウェーハの加工方法 |
JP6956788B2 (ja) * | 2017-07-06 | 2021-11-02 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理システム |
JP6918420B2 (ja) * | 2017-09-14 | 2021-08-11 | 株式会社ディスコ | ウェーハの加工方法 |
DE102019204457B4 (de) | 2019-03-29 | 2024-01-25 | Disco Corporation | Substratbearbeitungsverfahren |
JP7366490B2 (ja) | 2019-04-19 | 2023-10-23 | 株式会社ディスコ | チップの製造方法 |
JP7407561B2 (ja) * | 2019-10-30 | 2024-01-04 | 株式会社ディスコ | ウェーハの加工方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1140520A (ja) | 1997-07-23 | 1999-02-12 | Toshiba Corp | ウェーハの分割方法及び半導体装置の製造方法 |
JP2000182995A (ja) | 1998-12-14 | 2000-06-30 | Mitsumi Electric Co Ltd | 半導体装置の製造方法 |
US6668349B1 (en) * | 2000-04-14 | 2003-12-23 | Hitachi, Ltd. | Data recording/readback method and data recording/readback device for the same |
JP4109823B2 (ja) | 2000-10-10 | 2008-07-02 | 株式会社東芝 | 半導体装置の製造方法 |
JP4509720B2 (ja) * | 2002-03-12 | 2010-07-21 | 浜松ホトニクス株式会社 | レーザ加工方法 |
JP2005223283A (ja) | 2004-02-09 | 2005-08-18 | Disco Abrasive Syst Ltd | ウエーハの分割方法 |
JP2005332982A (ja) * | 2004-05-20 | 2005-12-02 | Renesas Technology Corp | 半導体装置の製造方法 |
US7550367B2 (en) * | 2004-08-17 | 2009-06-23 | Denso Corporation | Method for separating semiconductor substrate |
JP2006086509A (ja) * | 2004-08-17 | 2006-03-30 | Denso Corp | 半導体基板の分断方法 |
JP4754278B2 (ja) * | 2005-06-23 | 2011-08-24 | リンテック株式会社 | チップ体の製造方法 |
JP2008028325A (ja) * | 2006-07-25 | 2008-02-07 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2009283925A (ja) * | 2008-04-22 | 2009-12-03 | Hitachi Chem Co Ltd | ダイシングテープ一体型接着シート、ダイシングテープ一体型接着シートの製造方法、及び半導体装置の製造方法 |
JP5357669B2 (ja) * | 2009-08-28 | 2013-12-04 | 株式会社ディスコ | ウエーハの加工方法 |
JP5451335B2 (ja) * | 2009-11-20 | 2014-03-26 | リンテック株式会社 | マウント装置およびマウント方法 |
-
2012
- 2012-04-02 JP JP2012083780A patent/JP6004705B2/ja active Active
-
2013
- 2013-03-14 TW TW102109042A patent/TWI606506B/zh active
- 2013-03-28 DE DE201310205644 patent/DE102013205644A1/de active Pending
- 2013-03-29 KR KR1020130034420A patent/KR101938426B1/ko active IP Right Grant
- 2013-04-01 CN CN201310110400.3A patent/CN103367219B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN103367219A (zh) | 2013-10-23 |
KR101938426B1 (ko) | 2019-01-14 |
JP2013214600A (ja) | 2013-10-17 |
TW201349319A (zh) | 2013-12-01 |
DE102013205644A1 (de) | 2013-10-02 |
KR20130111994A (ko) | 2013-10-11 |
CN103367219B (zh) | 2017-04-19 |
TWI606506B (zh) | 2017-11-21 |
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