JP5938514B2 - 粘着剤組成物 - Google Patents
粘着剤組成物 Download PDFInfo
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- JP5938514B2 JP5938514B2 JP2015500359A JP2015500359A JP5938514B2 JP 5938514 B2 JP5938514 B2 JP 5938514B2 JP 2015500359 A JP2015500359 A JP 2015500359A JP 2015500359 A JP2015500359 A JP 2015500359A JP 5938514 B2 JP5938514 B2 JP 5938514B2
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- pressure
- sensitive adhesive
- adhesive film
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- Prior art date
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- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
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- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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- H—ELECTRICITY
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- H10K50/84—Passivation; Containers; Encapsulations
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
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- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
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- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
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- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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Description
1.透明性評価
実施例または比較例の粘着剤組成物で粘着層の厚さが約50μmとなるように粘着フィルムを製造した。製造された粘着フィルムの粘着層をガラスに転写した。その後、ガラスを基準としてヘイズメーター(NDH−5000)を利用してJIS K 7105法に基づいて光透過度及びヘイズを測定した。
実施例または比較例の粘着剤組成物で粘着層の厚さが約100μmとなるように粘着フィルムを製造した。次に、粘着層を多孔性フィルムとラミネートし、基材フィルムを剥離し、試験片を準備した。その後、100°F及び100%の相対湿度に上記試験片を位置させた状態で、上記試験片の厚さ方向に対する透湿度を測定した。上記透湿度は、ASTM F1249の規定によって測定した。
実施例または比較例の粘着剤組成物を粘着層の厚さが約500μmであり、粘着層の両面に基材フィルムが存在する構造で粘着フィルムを製造した。製造された粘着フィルムを直径約8mmの円形状にカットし、試験片を準備した。その後、振動数1Hzの条件でtemperature sweep方法で50℃での上記試験片の貯蔵弾性率を測定した。
実施例または比較例の粘着剤組成物で粘着層の厚さが約50μmとなるように粘着フィルムを製造した。製造された粘着フィルムにおいて粘着層をガラスに付着し、試験片を準備した。その後、試験片を85℃及び85%相対湿度の恒温恒湿チャンバに位置させた状態で、粘着層で気泡の発生、濁度の変化及び/または粘着層の界面浮き上り現象が発生するかを観察した。
実施例または比較例の粘着剤組成物で粘着層の厚さが約50μmとなるように粘着フィルムを製造した。製造された粘着層を離型処理されないPET基材フィルムとラミネーションし、幅が1インチ、長さが20cmとなるようにカットした。次いで、粘着フィルムの離型処理された基材フィルムを剥離し、粘着層をガラスに転写し、試験片を準備した。次に、texture analyzerを利用して試験片の180度接着力を測定した。
(1)粘着剤組成物の製造
ビス(水素化タロー)ジメチル4級アンモニウムイオンで改質されたナノクレイ(商品名:Cloisite93A、製造社:Southern Clay Products)をキシレンに5重量%で添加した後、インペラを利用して混合した。そして、ウルトラソニケータを利用して約1時間分散させて分散液を製造した。
上記で製造した粘着剤組成物をバーコーターを利用して離型PET基材フィルム上に塗布した。次いで、塗布された粘着剤組成物の層を約120℃のオーブンで約30分間乾燥し、粘着フィルムを製造した。
ビス(水素化タロー)ジメチル4級アンモニウムイオンで改質されたナノクレイの代わりに、改質されないナノクレイを使用したことを除いて、実施例1と同一に粘着剤組成物及び粘着フィルムを製造した。
分散液においてキシレンの代わりにメチルエチルケトン(MEK)を使用したことを除いて、実施例1と同一に粘着剤組成物及び粘着フィルムを製造した。
ビス(水素化タロー)ジメチル4級アンモニウムイオンで改質されたナノクレイの代わりに、改質されたシリカ(Hydrophobic Fumed Silica、R972、Evonik)を使用したことを除いて、実施例1と同一に粘着剤組成物及び粘着フィルムを製造した。
分散液を使用しないことを除いて、実施例1と同一に粘着剤組成物及び粘着フィルムを製造した。
22 粘着層
31 基板
32 封止層
33 有機電子素子
34 基板またはガスバリアー層
Claims (17)
- ポリイソブチレン樹脂であるバインダー樹脂、及びジメチルベンジル水素化タロー4級アンモニウムイオン、ビス(水素化タロー)ジメチル4級アンモニウムイオン、メチルタロービス−2−ヒドロキシエチル4級アンモニウムイオン、ジメチル水素化タロー2−エチルヘキシル4級アンモニウムイオンまたはジメチル脱水素化タロー4級アンモニウムイオンを含む有機改質剤で改質されたナノクレイを含む、粘着剤組成物を含み、3.5g/m 2 ・day未満の透湿度(WVTR)を有する、粘着フィルム。
- ナノクレイは、層状のシリケートである、請求項1に記載の粘着フィルム。
- 粘着剤組成物は、屈折率が1.4以上である溶媒をさらに含む、請求項1に記載の粘着フィルム。
- 溶媒は、n−プロピルアセテート、n−ブチルアセテート、シクロヘキサン、メチルシクロヘキサン、ベンゼン、トルエン、エチルベンゼン、キシレンまたは1,2,3−トリメチルベンゼンを含む、請求項3に記載の粘着フィルム。
- 有機改質剤で改質されたナノクレイをバインダー樹脂100重量部に対して5〜30重量部で含む、請求項1に記載の粘着フィルム。
- 粘着剤組成物は、多官能性アクリレートまたはエポキシ化合物をさらに含む、請求項1に記載の粘着フィルム。
- 粘着剤組成物は、開始剤をさらに含む、請求項6に記載の粘着フィルム。
- 可視光線領域で90%以上の光透過度を有する、請求項1に記載の粘着フィルム。
- ヘイズが3%未満である、請求項1に記載の粘着フィルム。
- 150℃の温度で1時間の有機成分の揮発量が1000ppm未満である、請求項1に記載の粘着フィルム。
- 有機改質剤で改質されたナノクレイと溶媒の分散液をバインダー樹脂を含む溶液に混合し、粘着剤組成物を製造する段階と;
上記粘着剤組成物を基材フィルムに塗布する段階と;を備える、請求項1に記載の粘着フィルムの製造方法。 - 粘着剤組成物を製造する段階前に、ナノクレイを有機改質剤で処理し、有機改質剤で改質されたナノクレイを製造する段階をさらに備える、請求項11に記載の粘着フィルムの製造方法。
- 粘着剤組成物を製造する段階は、分散液の固形分の含量が1重量%〜15重量%となるように有機改質剤で改質されたナノクレイを溶媒に添加することを含む、請求項11に記載の粘着フィルムの製造方法。
- 粘着剤組成物を製造する段階は、物理的分散処理方法によって有機改質剤で改質されたナノクレイと溶媒を混合することを含む、請求項11に記載の粘着フィルムの製造方法。
- 粘着剤組成物を製造する段階で、有機改質剤で改質されたナノクレイと溶媒は、分散後、常温での粘度が100cPs〜1000cPsとなるように混合することを含む、請求項11に記載の粘着フィルムの製造方法。
- 粘着剤組成物を製造する段階は、分散液の固形分がバインダー樹脂100重量部に対して5〜30重量部となるようにバインダー樹脂を含む溶液に分散液を添加することを含む、請求項11に記載の粘着フィルムの製造方法。
- 有機電子素子が形成された基板と;上記有機電子素子の前面を封止する、請求項1に記載の粘着フィルムと;を備える有機電子デバイス。
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-
2013
- 2013-03-12 EP EP13761595.1A patent/EP2810999B1/en active Active
- 2013-03-12 JP JP2015500359A patent/JP5938514B2/ja active Active
- 2013-03-12 KR KR1020130026102A patent/KR101478429B1/ko active IP Right Grant
- 2013-03-12 WO PCT/KR2013/001978 patent/WO2013137621A1/ko active Application Filing
- 2013-03-12 CN CN201380014144.6A patent/CN104169386B/zh active Active
- 2013-03-12 TW TW102108654A patent/TWI488930B/zh active
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Also Published As
Publication number | Publication date |
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CN104169386A (zh) | 2014-11-26 |
KR20130105445A (ko) | 2013-09-25 |
EP2810999A1 (en) | 2014-12-10 |
WO2013137621A1 (ko) | 2013-09-19 |
TWI488930B (zh) | 2015-06-21 |
EP2810999A4 (en) | 2015-11-04 |
TW201406893A (zh) | 2014-02-16 |
US20140377554A1 (en) | 2014-12-25 |
EP2810999B1 (en) | 2019-09-11 |
JP2015515513A (ja) | 2015-05-28 |
CN104169386B (zh) | 2016-10-26 |
KR101478429B1 (ko) | 2014-12-31 |
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