JP5900582B1 - 圧電振動デバイス - Google Patents
圧電振動デバイス Download PDFInfo
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- JP5900582B1 JP5900582B1 JP2014236089A JP2014236089A JP5900582B1 JP 5900582 B1 JP5900582 B1 JP 5900582B1 JP 2014236089 A JP2014236089 A JP 2014236089A JP 2014236089 A JP2014236089 A JP 2014236089A JP 5900582 B1 JP5900582 B1 JP 5900582B1
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/202—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement
- H10N30/2023—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using longitudinal or thickness displacement combined with bending, shear or torsion displacement having polygonal or rectangular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
- H03H9/0552—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement the device and the other elements being mounted on opposite sides of a common substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0595—Holders; Supports the holder support and resonator being formed in one body
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
- H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
2 ベース
3 水晶振動素子
4 サーミスタ
5 蓋
6 金属製リング
7 水晶搭載用パッド
8 導電性接着剤
11 サーミスタ搭載用パッド
20 基板部
21 第1枠部
22 第2枠部
9a〜9d 外部接続端子
9e〜9h 無電極の土手領域
Claims (4)
- 一主面に圧電振動素子を収容する第1凹部が形成されるとともに、他主面に電子部品を収容する第2凹部が形成された平面視略矩形のベースと、
前記ベースの他主面の4隅に形成された4つの外部接続端子とを備えた圧電振動デバイスにおいて、
前記各外部接続端子は、前記ベースの短辺方向沿って伸びる第1部分と、前記ベースの長辺方向に沿って伸びる第2部分とが、前記ベースの角部で接続された構成になっており、
前記各外部接続端子は、前記第2凹部の外周縁から離隔した位置に設けられ、
前記外部接続端子のうち少なくとも一つには、当該外部接続端子の前記第1部分の端部から、前記ベースの短辺方向の中央に向けて突出する突出部が形成され、当該突出部は、前記ベースの外周縁および前記第2凹部の外周縁から離隔した位置に設けられ、
前記ベースは、基板部と、当該基板部の一主面の外周部から上方に伸びる第1枠部と、前記基板部の他主面の外周部から下方に伸びる第2枠部とを備え、
前記第1凹部は、前記第1枠部と前記基板部の一主面とで囲まれ、前記第2凹部は、前記第2枠部と前記基板部の他主面とで囲まれており、
前記各外部接続端子は、略L字形状に形成されており、当該外部接続端子の内側縁部と前記第2枠部の内周縁との間には、外部接続端子電極の形成されない無電極の土手領域が形成され、
前記突出部は、前記第2枠部の外周縁および内周縁から離隔した位置に設けられ、
前記各外部接続端子の前記第2枠部の内周縁に向いた内側縁部は、前記第2枠部の前記内周縁から前記第2枠部の前記外周縁のうち長辺の両端方向へのみ離隔するようにずらした状態で形成されていることを特徴とする圧電振動デバイス。 - 請求項1に記載の圧電振動デバイスであって、
前記電子部品は、前記ベースに導電性接合材によって接合されていることを特徴とする圧電振動デバイス。 - 請求項1または2に記載の圧電振動デバイスであって、
前記電子部品は、長辺および短辺を有する平面視略矩形であり、
前記電子部品の長辺が前記ベースの短辺方向に平行な状態で、当該電子部品が前記第2凹部に収容されていることを特徴とする圧電振動デバイス。 - 請求項1〜3のいずれか1つに記載の圧電振動デバイスであって、
前記外部接続端子は、前記圧電振動素子と電気的に接続される一対の圧電振動素子用外部接続端子、および、前記電子部品と電気的に接続される一対の電子部品用外部接続端子を含み、
前記突出部は、前記圧電振動素子用外部接続端子の一方に設けられていることを特徴とする圧電振動デバイス。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014236089A JP5900582B1 (ja) | 2014-11-21 | 2014-11-21 | 圧電振動デバイス |
US15/527,795 US20180309044A1 (en) | 2014-11-21 | 2015-09-29 | Piezoelectric resonator device |
CN201580062270.8A CN107005221A (zh) | 2014-11-21 | 2015-09-29 | 压电振动器件 |
PCT/JP2015/077489 WO2016080075A1 (ja) | 2014-11-21 | 2015-09-29 | 圧電振動デバイス |
TW104133036A TWI662725B (zh) | 2014-11-21 | 2015-10-07 | Piezoelectric vibration device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2014236089A JP5900582B1 (ja) | 2014-11-21 | 2014-11-21 | 圧電振動デバイス |
Publications (2)
Publication Number | Publication Date |
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JP5900582B1 true JP5900582B1 (ja) | 2016-04-06 |
JP2016100737A JP2016100737A (ja) | 2016-05-30 |
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JP2014236089A Active JP5900582B1 (ja) | 2014-11-21 | 2014-11-21 | 圧電振動デバイス |
Country Status (5)
Country | Link |
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US (1) | US20180309044A1 (ja) |
JP (1) | JP5900582B1 (ja) |
CN (1) | CN107005221A (ja) |
TW (1) | TWI662725B (ja) |
WO (1) | WO2016080075A1 (ja) |
Cited By (1)
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TWI838927B (zh) * | 2021-10-26 | 2024-04-11 | 日商大真空股份有限公司 | 帶溫度感測器的晶體振動裝置 |
Families Citing this family (9)
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JP2018046057A (ja) | 2016-09-12 | 2018-03-22 | 株式会社東芝 | 半導体パッケージ |
CN108111139B (zh) * | 2016-11-25 | 2023-10-31 | 四川明德亨电子科技有限公司 | 一种smd石英谐振器及其加工设备及方法 |
JP2019047309A (ja) * | 2017-09-01 | 2019-03-22 | 株式会社村田製作所 | 圧電振動子 |
JP7021919B2 (ja) * | 2017-11-27 | 2022-02-17 | 京セラ株式会社 | 圧電振動デバイス及び圧電振動デバイスの製造方法 |
CN111224635B (zh) * | 2018-11-27 | 2024-01-19 | 京瓷株式会社 | 压电器件以及电子设备 |
JP7211081B2 (ja) * | 2018-12-28 | 2023-01-24 | セイコーエプソン株式会社 | 振動デバイス |
JP6760430B1 (ja) * | 2019-03-27 | 2020-09-23 | 株式会社大真空 | 水晶振動デバイス |
JP2021117070A (ja) * | 2020-01-24 | 2021-08-10 | セイコーエプソン株式会社 | 振動デバイス、電子機器、及び移動体 |
JPWO2023210735A1 (ja) * | 2022-04-28 | 2023-11-02 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010268193A (ja) * | 2009-05-14 | 2010-11-25 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2013070224A (ja) * | 2011-09-22 | 2013-04-18 | Seiko Epson Corp | 容器、振動デバイス及び電子機器 |
JP2014146882A (ja) * | 2013-01-28 | 2014-08-14 | Kyocera Crystal Device Corp | 水晶振動子 |
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JP2010232806A (ja) * | 2009-03-26 | 2010-10-14 | Seiko Epson Corp | 圧電振動子、圧電発振器、電子機器、及び圧電振動子の製造方法 |
WO2011149043A1 (ja) * | 2010-05-28 | 2011-12-01 | 株式会社大真空 | 圧電振動デバイスの封止部材、および圧電振動デバイス |
JP2013055573A (ja) * | 2011-09-06 | 2013-03-21 | Seiko Epson Corp | 圧電デバイス、及び電子機器 |
JP6618675B2 (ja) * | 2014-07-30 | 2019-12-11 | セイコーエプソン株式会社 | 振動デバイス、電子機器及び移動体 |
-
2014
- 2014-11-21 JP JP2014236089A patent/JP5900582B1/ja active Active
-
2015
- 2015-09-29 CN CN201580062270.8A patent/CN107005221A/zh active Pending
- 2015-09-29 WO PCT/JP2015/077489 patent/WO2016080075A1/ja active Application Filing
- 2015-09-29 US US15/527,795 patent/US20180309044A1/en not_active Abandoned
- 2015-10-07 TW TW104133036A patent/TWI662725B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010268193A (ja) * | 2009-05-14 | 2010-11-25 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶発振器 |
JP2013070224A (ja) * | 2011-09-22 | 2013-04-18 | Seiko Epson Corp | 容器、振動デバイス及び電子機器 |
JP2014146882A (ja) * | 2013-01-28 | 2014-08-14 | Kyocera Crystal Device Corp | 水晶振動子 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI838927B (zh) * | 2021-10-26 | 2024-04-11 | 日商大真空股份有限公司 | 帶溫度感測器的晶體振動裝置 |
Also Published As
Publication number | Publication date |
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WO2016080075A1 (ja) | 2016-05-26 |
TW201626608A (zh) | 2016-07-16 |
TWI662725B (zh) | 2019-06-11 |
CN107005221A (zh) | 2017-08-01 |
US20180309044A1 (en) | 2018-10-25 |
JP2016100737A (ja) | 2016-05-30 |
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