WO2011149043A1 - 圧電振動デバイスの封止部材、および圧電振動デバイス - Google Patents
圧電振動デバイスの封止部材、および圧電振動デバイス Download PDFInfo
- Publication number
- WO2011149043A1 WO2011149043A1 PCT/JP2011/062181 JP2011062181W WO2011149043A1 WO 2011149043 A1 WO2011149043 A1 WO 2011149043A1 JP 2011062181 W JP2011062181 W JP 2011062181W WO 2011149043 A1 WO2011149043 A1 WO 2011149043A1
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- WIPO (PCT)
- Prior art keywords
- sealing member
- base
- vibration device
- piezoelectric vibration
- main surface
- Prior art date
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
Definitions
- the present invention relates to a sealing member for a piezoelectric vibration device and a piezoelectric vibration device.
- the piezoelectric vibration device is a device in which an excitation electrode of a piezoelectric vibrating piece that performs piezoelectric vibration is hermetically sealed, and examples thereof include a crystal oscillator.
- Quartz oscillator is composed of a box-shaped base made of ceramic material and a single plate lid made of metal material. In the internal space of the package, the piezoelectric vibrating piece and the IC chip are held and joined to the base. Then, the piezoelectric resonator element and the IC chip in the internal space of the package are hermetically sealed by bonding the base and the lid (for example, see Patent Document 1).
- a base in which two box-shaped bodies formed by integrally firing ceramic materials are used is used.
- a piezoelectric vibrating piece is mounted on one box-shaped body of the base, and an IC chip is mounted on the other box-shaped body.
- the back surface (other main surface) of the base there are external terminals that are electrically connected to an external circuit board, and inspection terminals that measure and inspect the characteristics of the crystal vibrating piece along the outer periphery of the other main surface. Is formed.
- the corresponding region corresponding to the wall portion of the base of the box-shaped body is formed into a flat surface, but other regions (specifically, formed on one main surface of the base).
- the region of the other main surface corresponding to the cavity is formed into a convex or concave curved surface warped by the residual stress of the base.
- a crystal oscillator as shown in Patent Document 1 is mounted on an external circuit board using a conductive bonding material such as solder while holding the crystal oscillator.
- the conductive bonding material is pressed by the force of pressing the crystal oscillator and spreads on the flat surface of the other main surface of the base (on the corresponding region of the other main surface corresponding to the wall).
- the external terminal and the inspection terminal formed side by side along the outer periphery that is the flat surface of the other main surface are connected by the conductive bonding material, and a short circuit occurs between the external terminal and the inspection terminal.
- the present invention provides a short circuit between an external terminal and an inspection terminal when a piezoelectric vibration device is connected to an external circuit board using a conductive bonding material such as solder.
- An object of the present invention is to provide a piezoelectric vibration device sealing member and a piezoelectric vibration device that prevent the above-described problem.
- a sealing member for a piezoelectric vibrating device includes a sealing member for a piezoelectric vibrating device in which a vibration region of a piezoelectric vibrating piece is hermetically sealed by a plurality of sealing members.
- a convex portion is formed on one main surface of the base material constituting the stop member, and the other main surface of the base material has a flat surface corresponding to the convex portion, and a region other than the flat surface is a curved surface.
- a plurality of external terminals for connecting to an external circuit board are formed on the flat surface, and a plurality of inspection terminals for inspecting the piezoelectric vibrating piece are formed on the curved surface.
- the sealing member when the sealing member is connected to an external circuit board using a conductive bonding material such as solder, it is possible to prevent a short circuit from occurring between the external terminal and the inspection terminal.
- the other main surface of the base material is formed such that a region corresponding to the convex portion is the flat surface, a region other than the flat surface is the curved surface, and the plurality of external terminals are the Since the plurality of inspection terminals are formed on the curved surface, the conductive bonding material such as solder is attached to the other main surface when the sealing member is connected to an external circuit board. It expands on the corresponding area that is a flat surface, and does not expand to areas other than the corresponding area that is the curved surface. As a result, the external terminal formed on the flat surface is not connected to the inspection terminal formed on the curved surface, and a short circuit is prevented from occurring between the external terminal and the inspection terminal. It becomes possible.
- the inspection terminal is formed in a region other than the corresponding region corresponding to the convex portion of the other main surface, the top surface of the convex portion is made of a conductive material in order to join a plurality of sealing members. Even when the bonding layer is formed, a large capacity is not formed by the bonding layer and the inspection terminal. As a result, it is possible to suppress a decrease in the negative resistance of the piezoelectric vibration device, and it is possible to suppress a decrease in capacitance in a piezoelectric vibration device having a variable capacitance.
- a plurality of vias penetrating both main surfaces of the base material may be formed, and the arrangement of the plurality of vias may be inclined with respect to any side of the other main surface.
- the convex portion may be a wall portion that is a part of the outer shape of the sealing member.
- the convex portion is the wall portion that becomes a part of the outer shape of the sealing member
- the external terminal can be formed in an outer shape with high strength of the sealing member.
- the sealing member can be mounted on an external circuit board in a mechanically and electrically stable state.
- an insulating portion made of an insulating material covering the inspection terminal may be provided.
- the insulating portion can prevent the inspection terminal from being exposed after manufacturing the piezoelectric vibration device, and prevents the inspection terminal from being connected to a terminal of another electronic device or the like. It becomes possible.
- a pair of recognition portions for image recognition as electrodes may be formed on one main surface of the substrate.
- a pillow portion that is for a piezoelectric vibrating piece and for image recognition may be formed on one main surface of the substrate.
- the piezoelectric vibrating piece can be mounted on the sealing member using the pillow portion as a mounting reference when mounting the piezoelectric vibrating piece on the sealing member.
- the mounting displacement of the piezoelectric vibrating reed on the sealing member is reduced, and it is possible to improve productivity such as suppressing the yield.
- a piezoelectric vibrating device is characterized in that the sealing member according to the present invention and the piezoelectric vibrating piece are provided.
- the sealing member according to the present invention since the sealing member according to the present invention and the piezoelectric vibrating piece are provided, the effect of the sealing member according to the present invention is provided, and a conductive bonding material such as solder is provided on an external circuit board. It is possible to prevent a short circuit from occurring between the external terminal and the inspection terminal when the piezoelectric vibration device is connected using.
- the integrated circuit element is provided in the sealing member, the gap between the sealing member and the integrated circuit element is 50 ⁇ m or less, and the gap between the sealing member and the piezoelectric vibrating piece is the sealing It may be wider than the gap between the member and the integrated circuit element.
- the gap between the sealing member and the integrated circuit element is 50 ⁇ m or less, and the gap between the sealing member and the piezoelectric vibrating piece is wider than the gap between the sealing member and the integrated circuit element. Therefore, it becomes possible to prevent the piezoelectric vibrating piece from coming into contact with the sealing member because the integrated circuit element becomes a barrier.
- a piezoelectric vibration device when connected to an external circuit board using a conductive bonding material such as solder, it is possible to prevent a short circuit from occurring between the external terminal and the inspection terminal. Become.
- FIG. 1 is a schematic side view of a crystal oscillator that exposes an internal space according to the first embodiment.
- FIG. 2 is a schematic plan view of the base according to the first embodiment in a state where the crystal resonator element and the IC chip are mounted.
- FIG. 3 is a schematic plan view of a base (bottom) showing an electrode pattern according to the first embodiment.
- FIG. 4 is a schematic rear view of the base according to the first embodiment.
- FIG. 5 is a schematic side view of a crystal oscillator that exposes the internal space according to the second embodiment.
- FIG. 6 is a schematic plan view of the base according to the second embodiment in a state where the crystal resonator element and the IC chip are mounted.
- FIG. 1 is a schematic side view of a crystal oscillator that exposes an internal space according to the first embodiment.
- FIG. 2 is a schematic plan view of the base according to the first embodiment in a state where the crystal resonator element and the IC chip are mounted.
- FIG. 7 is a schematic plan view of a base (bottom portion) showing an electrode pattern according to the second embodiment.
- FIG. 8 is a schematic rear view of the base according to the second embodiment.
- FIG. 9 is a schematic side view of a crystal oscillator that exposes an internal space according to the third embodiment.
- FIG. 10 is a schematic plan view of the base according to the third embodiment in a state where the crystal vibrating piece and the IC chip are mounted.
- FIG. 11 is a schematic plan view of a base (bottom part) showing an electrode pattern according to the third embodiment.
- FIG. 12 is a schematic rear view of the base according to the third embodiment.
- FIG. 13 is a schematic plan view of a base (bottom) showing an electrode pattern according to another embodiment.
- the crystal oscillator 1 includes a crystal vibrating piece 2 (piezoelectric vibrating piece) that performs piezoelectric vibration, and a one-chip integrated circuit that constitutes an oscillation circuit together with the crystal vibrating piece 2.
- An IC chip 3 (electronic component element) that is an element, and a base 4 (sealing member) for holding and mounting the crystal vibrating piece 2 and the IC chip 3 and hermetically sealing the crystal vibrating piece 2 and the IC chip 3
- a lid 6 (sealing member) that is arranged corresponding to the base 4 and hermetically seals the crystal vibrating piece 2 and the IC chip 3 held and mounted on the base 4.
- a package is constituted by a base 4 and a lid 6, and the base 4 and the lid 6 are joined by a joining material (not shown) to form an airtightly sealed internal space 11.
- the IC chip 3 is electromechanically ultrasonically bonded to the base 4 using the conductive bump 71 on the base 4 by the FCB (Flip Chip Bonding) method.
- the crystal vibrating piece 2 is electromechanically bonded to the base 4 using a conductive bonding material 72.
- metal bumps such as Au bumps are used for the conductive bumps 71.
- a conductive resin adhesive such as silicone, a metal bump such as Au, or a plating bump is used.
- Ag brazing, Ni plating, Sn alloy such as Au and Sn, glass material or the like is used as the bonding material.
- the quartz crystal resonator element 2 is made of an AT-cut quartz crystal substrate, and the outer shape thereof is a single plate rectangular parallelepiped with both main surfaces 211 and 212 formed in a substantially rectangular shape as shown in FIG.
- the quartz crystal resonator element 2 is configured by integrally forming a vibrating portion 22 that constitutes a vibrating region and a joint portion 23 that is joined to the electrode pads 511 and 512 of the base 4 that are external electrodes.
- the vibration part 22 and the joint part 23 have the same thickness. In the present embodiment, the vibration part 22 and the joint part 23 have the same thickness. However, the present invention is not limited to this, and the vibration part 22 may be thinned to cope with higher frequencies. Good.
- the quartz crystal resonator element 2 includes a pair of excitation electrodes 24 that excites, a pair of terminal electrodes 25 that are electromechanically joined to the electrode pads 511 and 512 of the base 4, and a pair of excitation electrodes 24.
- An extraction electrode 26 to be drawn out to 25 is formed.
- the pair of excitation electrodes 24 is routed by the extraction electrode 26 and electrically connected to the pair of terminal electrodes 25.
- the pair of excitation electrodes 24 are formed corresponding to the center in plan view of both main surfaces 211 and 212 of the vibration part 22.
- the pair of excitation electrodes 24 is composed of, for example, a Cr—Au film formed by laminating Cr and Au in this order from the substrate side.
- the pair of terminal electrodes 25 are formed on the other main surface 212 of the joint portion 23.
- the pair of terminal electrodes 25 are formed in the vicinity including one side of the substrate in the longitudinal direction.
- the pair of terminal electrodes 25 is formed of, for example, a Cr—Au film formed by laminating Cr and Au in this order from the substrate side, like the excitation electrode 24.
- the pair of extraction electrodes 26 are formed on the vibration part 22 and the joint part 23, and are formed on both main surfaces 211 and 212 of the crystal vibrating piece 2 from the vibration part 22 to the joint part 23 without corresponding (opposing) each other.
- These extraction electrodes 26 are composed of, for example, a Cr—Au film formed by laminating Cr and Au in this order from the substrate side, like the excitation electrode 24.
- the base 4 is made of a ceramic material such as alumina, and extends upward from the bottom 41 along the outer periphery of the bottom 41 and the main surface 43 of one main surface 43 of the base 4 as shown in FIGS. It is formed into a box-shaped body composed of a wall portion 42 (a convex portion referred to in the present invention).
- the base 4 is formed in a concave shape by laminating a plurality of ceramic annular plates (corresponding to the wall 42) and a conductive material of the electrode 5 (see below) on a single ceramic plate (corresponding to the bottom 41). It is integrally fired into a sectional view shape.
- the top surface of the wall portion 42 of the base 4 is a joint surface with the lid 6, and a first joint layer (not shown) for joining with the lid 6 is provided on the joint surface.
- the first bonding layer has a laminated structure of a plurality of layers.
- a metallized layer (not shown) made of W or Mo, a Ni film made of Ni, and Au made of Au.
- a film is laminated in order.
- the metallized layer is integrally formed at the time of firing the ceramic after printing the metallized material, and the Ni film and the Au film are formed by a plating technique.
- a cavity 44 having a rectangular shape in plan view surrounded by the bottom 41 and the wall 42 is formed on one main surface 43 of the base 4, and the crystal vibrating piece 2 and the IC chip 3 are arranged on the bottom surface 441 of the cavity 44. Installed.
- castellations 46 are formed at the four corners of the rear surface of the casing 4 (other main surface 45) of the base 4, respectively.
- These castellations 46 are arc-shaped cutouts (semi-arc-shaped recesses), and are formed in a state extending in the vertical direction (X direction which is the height direction of the base 4 shown in FIG. 1) on the side surface 47 of the casing. Has been.
- two vias 48 are formed in the base 4 for leading the excitation electrode 24 of the crystal vibrating piece 2 from the inside of the cavity 44 to the outside of the cavity 44.
- the via 48 is filled with a conductive member 481 made of Cu, W, Mo, or the like.
- the two vias 48 are formed through both main surfaces 43 and 45 of the base 4. These vias 48 are inclined with respect to any side of the base 4 and are inclined with respect to the short side direction of the base (see the line L1 shown in FIG. 4) at an angle ⁇ (5 ° to 30 °) (FIG. 4). 2), and is arranged at a position that is point-symmetric about the center point 451 of the other main surface 45. Further, the two vias 48 are formed in a region other than the corresponding region corresponding to the wall portion 42 formed on the one main surface 43 of the other main surface 45 (hereinafter, this corresponding region is referred to as a wall corresponding region 491). Has been. That is, the two vias 48 are formed in a region of the other main surface 45 corresponding to the bottom surface 441 of the cavity 44 formed in the one main surface 43 (hereinafter, this corresponding region is referred to as a cavity corresponding region 492).
- a pair of electrode pads 511 and 512 that are electromechanically joined to the excitation electrodes 24 of the crystal vibrating piece 2 and the terminals 31 of the IC chip 3 are used as the electrodes 5 of the base 4. Electrically using connection pads 521, 522, 523, 524, 525, 526 to be electrically connected and an external device such as an external circuit board (not shown) using a conductive bonding material (not shown) such as solder. External terminals 531, 532, 533, and 534 to be connected and inspection terminals 541 and 542 for measuring and inspecting the characteristics of the crystal vibrating piece 2 are formed.
- the electrode pads 511, 512 and the connection pads 521, 522, 523, 524, 525, 526 are the bottom surface of the cavity 44 on one main surface 43 (specifically, on the bottom 41 of the base 4) that is in the same plane. 441 is formed.
- the external terminals 531, 532, 533, and 534 are formed in the wall portion corresponding region 491 (the outer periphery of the other main surface 45) of the other main surface 45, and part of the external terminals 531, 532, 533, and 534 It is formed at 492 (center position excluding the outer periphery of the other main surface 45). Specifically, the external terminals 531, 532, 533, and 534 are formed at each corner of the other main surface 45 and the castellation 46. In the present embodiment, a part of the external terminals 531, 532, 533, and 534 is formed at the cavity facing position 492, but the present invention is not limited to this, and the wall corresponding region of the other main surface 45. It may be formed in 491 (outer periphery of other main surface 45), and may be formed only in the wall part corresponding region 491 of other main surface 45.
- the inspection terminals 541 and 542 are formed only in the cavity corresponding region 492 of the other main surface 45 (the central region excluding the outer periphery of the other main surface 45). Specifically, the inspection terminals 541 and 542 are formed side by side along the short side direction of the other main surface 45 on the middle position of the long side of the other main surface 45. In addition, vias 48 are formed under the inspection terminals 541 and 542, respectively.
- the electrode pads 511, 512, the connection pads 521, 522, and the inspection terminals 541, 542 having the above configuration are electrically connected by the via 48 and the wiring pattern 55, and the connection pads 523, 524, 525, 526 and the external terminal 531 are connected. , 532, 533, and 534 are electrically connected by the wiring pattern 55.
- a pillow portion 56 for the crystal vibrating piece 2 that is continuous with the wiring pattern 55 is formed.
- the electrode 5 of the base 4 is formed by printing a metallized material such as W or Mo and firing it integrally with the base 4.
- the electrode pads 511, 512, the connection pads 521, 522, 523, 524, 525, 526, the external terminals 531, 532, 533, 534, and the inspection terminals 541, 542 have Ni plating on the metallized upper part. Formed, and Au plating is formed on the upper part.
- an electrolytic plating method or an electroless plating method can be given as a construction method of plating formation here.
- the lid 6 is formed from a metal material and is formed as a single rectangular parallelepiped as shown in FIG.
- a bonding material (not shown) such as Ag brazing for bonding to the base 4 is formed on the lower surface of the lid 6.
- the lid 6 is joined to the base 4 by seam welding to constitute a package of the crystal oscillator 1 by the lid 6 and the base 4.
- the IC chip 3 is disposed on the bottom surface 441 of the cavity 44 of the base 4, and the IC chip 3 is connected to the connection pads 521 by the FCB method via the conductive bumps 71. Electromechanically ultrasonically bonded to 522, 523, 524, 525, 526.
- the crystal vibrating piece 2 is arranged on the bottom surface 441 of the cavity 44 of the base 4 while being arranged on the IC chip 3, and the crystal vibrating piece 2 is electromechanically connected to the electrode pads 511 and 512 via the conductive bonding material 72. Be joined.
- a lid 6 is disposed on the base 4 on which the IC chip 3 and the crystal vibrating piece 2 are mounted on the bottom surface 441 of the coplanar cavity 44, and then the package (base 4, lid 6 is sealed by seam sealing in a nitrogen atmosphere. ) Is scanned along the short side in plan view to melt the first bonding layer and the bonding material, and then the seam roller (in the plan view long side of the package (base 4 and lid 6) ( The first bonding layer and the bonding material are melted by scanning. By this seam sealing, the bonding material formed on the lid 6 and the first bonding layer of the base 4 are bonded, and as shown in FIG. 1, the crystal oscillator 2 and the IC chip 3 are hermetically sealed. 1 is manufactured.
- the crystal oscillator 1 manufactured here is mounted on an external circuit board with a conductive bonding material such as solder.
- the gap between the lid 6 and the IC chip 3 is about 50 ⁇ m or less, and the gap between the lid 6 and the crystal vibrating piece 2 is smaller than the gap between the lid 6 and the IC chip 3. Is also wide.
- the gap between the lid 6 and the IC chip 3 is 50 ⁇ m, and the gap between the lid 6 and the crystal vibrating piece 2 is 100 ⁇ m.
- the base 4 is configured by only two layers including the bottom portion 41 and the wall portion 42. Can respond to low profile.
- the crystal oscillator 1 (base 4) when the crystal oscillator 1 (base 4) is connected to an external circuit board using a conductive bonding material such as solder, a short circuit occurs between the external terminals 531, 532, 533, 534 and the inspection terminals 541, 542. Can be prevented.
- the other main surface 45 of the base 4 has a wall portion corresponding region 491 corresponding to the wall portion 42 as a flat surface, and a cavity corresponding region 492 other than the flat surface as a curved surface. Since 531, 532, 533 and 534 are formed on a flat surface and the inspection terminals 541 and 542 are formed on the curved surface, when the crystal oscillator 1 (base 4) is connected to an external circuit board, solder or the like is used.
- the conductive bonding material spreads on the wall-corresponding region 491 that is a flat surface of the other main surface 45 and does not spread on the cavity-corresponding region 492 that is a curved surface.
- the external terminals 531, 532, 533, 534 formed on the flat surface and the inspection terminals 541, 542 formed on the curved surface are not connected, and the external terminals 531, 532, 533, 534 and the inspection terminals are not connected. It is possible to prevent a short circuit from occurring between 541 and 542.
- the height dimension in the X direction from the flat surface of the wall corresponding region 491 to the apex of the curved surface of the cavity corresponding region 492 is about 30 ⁇ m or less.
- the inspection terminals 541 and 542 are formed in the cavity corresponding region 492 of the other main surface 45, the first bonding layer made of a conductive material is formed on the top surface of the wall portion 42 in order to bond the base 4 and the lid 6. Even in the case of forming the capacitor, the first bonding layer and the inspection terminals 541 and 542 do not form a large capacity. As a result, it is possible to suppress the negative resistance of the crystal oscillator 1 from decreasing, and it is possible to suppress the capacitance from decreasing in the crystal oscillator 1 having a variable capacitance.
- the above-described effect is obtained by forming at least a part of the external terminals 531, 532, 533, 534 in the wall portion corresponding region 491 of the other main surface 45.
- the via 48 is not limited to the one for leading out the inspection terminal, but may be formed for leading out the external terminals 531, 532, 533, and 534 that are partially extended to the cavity corresponding region 492.
- the convex portion is the wall portion 42 that becomes a part of the outer shape of the base 4
- the external terminals 531, 532, 533, and 534 can be formed on the outer shape of the base 4 having high strength.
- the base 4 can be mounted on an external circuit board in a mechanically and electrically stable state.
- the distance between the base 4 and the base 4 is larger than that of the vertically disposed structure (laminated structure).
- the distance is the same as the distance between the IC chip 3 and the base 4. Therefore, heat from the outside (for example, heat from the mounting substrate through the base 4) is similarly transmitted to the crystal vibrating piece 2 and the IC chip 3.
- the quartz crystal vibrating piece 2 and the IC chip 3 are disposed on the base 4 having the same thickness.
- the crystal oscillator 1 is effective not only in SPXO but also in TCXO, for example.
- the gap between the lid 6 and the IC chip 3 is 50 ⁇ m, and the gap between the lid 6 and the crystal vibrating piece 2 is 100 ⁇ m. Even if it occurs, the IC chip 3 plays a role of supporting the lid 6, and the crystal vibrating piece 2 can be prevented from coming into contact with the lid 6.
- the crystal oscillator is applied as the piezoelectric vibration device.
- the present invention is not limited to this, and is a piezoelectric vibration device that hermetically seals the excitation electrode of the piezoelectric vibration piece that performs piezoelectric vibration.
- a piezoelectric vibrator, a piezoelectric filter, or an elastic surface device may be used.
- the two vias 48 are formed in the base 4, but the present invention is not limited to this, and the number of vias 48 can be arbitrarily set.
- the package of the crystal oscillator 1 is constituted by the base 4 formed with the convex portion and the lid 6 of a single plate, but the present invention is not limited to this. As long as the convex portion is formed, an oscillator package having a sandwich structure in which the base 4, the crystal vibrating piece 2 and the lid 6 are laminated may be used.
- the present invention is applied to the base 4, but the present invention is not limited to this, and the convex portion (wall portion 42) and the electrode 5 are provided on the lid 6, and the present invention is applied to the lid 6. May be applied.
- the bonding material is formed on the lid 6 before the base 4 and the lid 6 are bonded.
- the present invention is not limited to this, and the bonding material may be formed on the base 4. Good.
- the vibration part 22 and the joint part 23 have the same thickness.
- the present invention is not limited to this, and the vibration part 22 may be thinned to cope with higher frequencies. .
- the inspection terminals 541 and 542 are formed side by side along the short side direction of the base 4, but the present invention is not limited to this, and is arranged along the long side direction of the base 4. May be formed.
- the wall part 42 is applied to the convex part, it is not limited to this, If it is a convex part formed in the one main surface 43 of the base 4, it will be in another form.
- the step portion may be applied to the convex portion.
- the gap between the lid 6 and the IC chip 3 is 50 ⁇ m, and the gap between the lid 6 and the crystal vibrating piece 2 is 100 ⁇ m.
- the gap between the chip 3 is 50 ⁇ m or less, and the gap between the lid 6 and the crystal vibrating piece 2 only needs to be wider than the gap between the lid 6 and the IC chip 3. Therefore, there may be no gap between the lid 6 and the IC chip 3 (0 ⁇ m), and the lid 6 and the crystal vibrating piece 2 may have a gap.
- the lower surface of the lid 6 facing the base 4 may be a flat surface, and the upper surface of the IC chip 3 may be in contact with the lower surface of the lid 6.
- the lid 6 may be curved toward the base 4 side, or the lower surface of the lid 6 may be formed into a curved surface, and the upper surface of the IC chip 3 may be in contact with the lower surface of the lid 6.
- the heat of the IC chip 3 can be efficiently radiated to the outside of the oscillator 1 through the lid 6, which is effective for stable operation of the oscillator 1 and is also optimal for EMI countermeasures. .
- the crystal oscillator 1 according to the second embodiment will be described with reference to the drawings.
- the crystal oscillator 1 according to the second embodiment is different from the first embodiment in the base 4. Therefore, the operation effect and modification by the same structure have the same operation effect and modification as Embodiment 1 mentioned above. Therefore, in the second embodiment, the configuration of the base 4 different from the first embodiment will be described, and the description of the same configuration will be omitted.
- a pair of electrode pads 511 and 512 that are electromechanically bonded to the excitation electrodes 24 of the crystal vibrating piece 2 and the terminals 31 of the IC chip 3 are electrically connected.
- Connection pads 521, 522, 523, 524, 525, and 526 are electrically connected to an external device such as an external circuit board (not shown) using a conductive bonding material (not shown) such as solder.
- the external terminals 531, 532, 533, and 534 that perform the inspection and the inspection terminals 541 and 542 that measure and inspect the characteristics of the crystal vibrating piece 2 are formed.
- the electrode pads 511, 512 and the connection pads 521, 522, 523, 524, 525, 526 are the bottom surface of the cavity 44 on one main surface 43 (specifically, on the bottom 41 of the base 4) that is in the same plane. 441 is formed.
- the external terminals 531, 532, 533, and 534 are formed in the wall portion corresponding region 491 (the outer periphery of the other main surface 45) of the other main surface 45, and part of the external terminals 531, 532, 533, and 534 It is formed at 492 (center position excluding the outer periphery of the other main surface 45). Specifically, the external terminals 531, 532, 533, and 534 are formed at each corner of the other main surface 45 and the castellation 46. In the present embodiment, a part of the external terminals 531, 532, 533, and 534 is formed at the cavity facing position 492, but the present invention is not limited to this, and the wall corresponding region of the other main surface 45. It may be formed in 491 (outer periphery of other main surface 45), and may be formed only in the wall part corresponding region 491 of other main surface 45.
- the inspection terminals 541 and 542 are formed only in the cavity corresponding region 492 (the central region excluding the outer periphery of the other main surface 45) of the other main surface 45, and the shape thereof is circular in plan view as shown in FIG. . Specifically, the inspection terminals 541 and 542 are formed side by side along the short side direction of the other main surface 45 on the middle position of the long side of the other main surface 45. In addition, vias 48 are formed under the inspection terminals 541 and 542, respectively, and the vias 48 are arranged at positions displaced from the centers of the inspection terminals 541 and 542. An insulating portion 81 made of an insulating material such as a resist is provided so as to cover the inspection terminals 541 and 542.
- this insulating portion 81 it is possible to prevent the inspection terminals 541 and 542 from being exposed after the crystal oscillator 1 is manufactured, and to prevent the inspection terminals 541 and 542 from being connected to terminals such as other electronic devices. Further, as shown in the third embodiment below, it is not necessary to form the base 4 in a concave shape (recessed portion 82) (see FIG. 9), and the inspection terminals 541 and 542 can be connected to other types without reducing the strength of the base 4. Connection to terminals such as electronic devices can be prevented. Note that the insulating portion 81 is not limited to the present embodiment, and the material and shape can be arbitrarily set as long as they can cover the inspection terminals 541 and 542.
- the electrode pads 511, 512, the connection pads 521, 522, and the inspection terminals 541, 542 having the above configuration are electrically connected by the via 48 and the wiring pattern 55, and the connection pads 523, 524, 525, 526 and the external terminal 531 are connected. , 532, 533, and 534 are electrically connected by the wiring pattern 55.
- the image recognition in the manufacturing process of the crystal oscillator 1 is performed on the wiring pattern 55 that connects the connection pad 523 and the external terminal 531 and on the wiring pattern 55 that connects the connection pad 524 and the external terminal 532.
- a pair of recognition parts 57 are formed. As shown in FIGS. 6 and 7, some of these recognition portions 57 are exposed in the cavity 44 and are formed along the short side direction of the base.
- These recognition units 57 can be accurately mounted on the base 4 as a reference for mounting the crystal vibrating piece 2 and the IC chip 3 on the base 4. As a result, it is possible to improve productivity such as reducing the mounting deviation of the crystal vibrating piece 2 and the IC chip 3 to the base 4 and suppressing the yield.
- the recognition unit 57 is not limited to the present embodiment, and may have another shape as long as it has a pair of shapes.
- a pillow portion 56 for the crystal vibrating piece 2 is formed along the wiring pattern 55 that connects the connection pad 523 and the external terminal 531 and is separated from the wiring pattern 55.
- the pillow portion 56 is formed together with the wiring pattern 55.
- the pillow part 56 also plays a role of recognition similar to the recognition part 57 described above. That is, one end edge 561 of the pillow portion 56 and the end edge 5111 of the electrode pad 511, and the other end edge 562 of the pillow portion 56 and the end edge 5121 of the electrode pad 512 are formed along the short side direction of the base 4.
- the pillow part 56 and the electrode pads 511 and 512 are accurately mounted on the base 4 as a mounting standard when the crystal vibrating piece 2 and the IC chip 3 are mounted on the base 4. Can do. As a result, it is possible to improve productivity such as reducing the mounting deviation of the crystal vibrating piece 2 and the IC chip 3 to the base 4 and suppressing the yield.
- the crystal oscillator 1 according to the third embodiment will be described with reference to the drawings.
- the crystal oscillator 1 according to the third embodiment is different from the first embodiment in the base 4. Therefore, the operation effect and modification by the same structure have the same operation effect and modification as Embodiment 1 mentioned above. Therefore, in the present third embodiment, the configuration of the base 4 different from the first embodiment will be described, and the description of the same configuration will be omitted.
- a pair of electrode pads 511 and 512 that are electromechanically joined to the excitation electrodes 24 of the crystal vibrating piece 2 and terminals 31 of the IC chip 3 are electrically connected.
- Connection pads 521, 522, 523, 524, 525, and 526 are electrically connected to an external device such as an external circuit board (not shown) using a conductive bonding material (not shown) such as solder.
- the external terminals 531, 532, 533, and 534 that perform the inspection and the inspection terminals 541 and 542 that measure and inspect the characteristics of the crystal vibrating piece 2 are formed.
- the electrode pads 511, 512 and the connection pads 521, 522, 523, 524, 525, 526 are the bottom surface of the cavity 44 on one main surface 43 (specifically, on the bottom 41 of the base 4) that is in the same plane. 441 is formed.
- the external terminals 531, 532, 533, and 534 are formed in the wall portion corresponding region 491 (the outer periphery of the other main surface 45) of the other main surface 45, and part of the external terminals 531, 532, 533, and 534 It is formed at 492 (center position excluding the outer periphery of the other main surface 45). Specifically, the external terminals 531, 532, 533, and 534 are formed at each corner of the other main surface 45 and the castellation 46. In the present embodiment, a part of the external terminals 531, 532, 533, and 534 is formed at the cavity facing position 492, but the present invention is not limited to this, and the wall corresponding region of the other main surface 45. It may be formed in 491 (outer periphery of other main surface 45), and may be formed only in the wall part corresponding region 491 of other main surface 45.
- the inspection terminals 541 and 542 are formed only in the cavity corresponding region 492 (the central region excluding the outer periphery of the other main surface 45) of the other main surface 45, and the shape thereof is circular in plan view as shown in FIG. .
- the inspection terminals 541 and 542 are formed side by side along the short side direction of the other main surface 45 on the middle position of the long side of the other main surface 45.
- vias 48 are formed under the inspection terminals 541 and 542, respectively, and the vias 48 are arranged at positions displaced from the centers of the inspection terminals 541 and 542.
- the inspection terminals 541 and 542 are formed in a recess 82 formed on the other main surface 45 of the base 4.
- the inspection terminals 541, 542 can be arranged above the external terminals 531, 532, 533, 534 in the X direction, and the external terminals 531, 532, 533, 534 are arranged. It is possible to prevent the inspection terminals 541 and 542 from being connected to a terminal such as another electronic device when the terminal is connected to the terminal such as another electronic device. Further, according to the third embodiment, there is no need to perform resist processing as in the second embodiment (see FIG. 8). Therefore, compared with the second embodiment, the resist processing steps can be reduced, and the same effect can be obtained at low cost.
- the concave portion 82 is not limited to the present embodiment, and the shape is not limited as long as the inspection terminals 541 and 542 can be arranged in the concave portion 82.
- the electrode pads 511, 512, the connection pads 521, 522, and the inspection terminals 541, 542 having the above configuration are electrically connected by the via 48 and the wiring pattern 55, and the connection pads 523, 524, 525, 526 and the external terminal 531 are connected. , 532, 533, and 534 are electrically connected by the wiring pattern 55.
- the image recognition in the manufacturing process of the crystal oscillator 1 is performed on the wiring pattern 55 that connects the connection pad 523 and the external terminal 531 and on the wiring pattern 55 that connects the connection pad 524 and the external terminal 532.
- a pair of recognition parts 57 are formed. As shown in FIGS. 10 and 11, a part of these recognition portions 57 are exposed in the cavity 44 and formed along the short side direction of the base.
- These recognition units 57 can be accurately mounted on the base 4 as a reference for mounting the crystal vibrating piece 2 and the IC chip 3 on the base 4. As a result, it is possible to improve productivity such as reducing the mounting deviation of the crystal vibrating piece 2 and the IC chip 3 to the base 4 and suppressing the yield.
- the recognition unit 57 is not limited to the present embodiment, and may have another shape as long as it has a pair of shapes.
- two pillow portions 58 and 59 for the crystal vibrating piece 2 that are continuous with the wiring pattern 55 are formed on the wiring pattern 55 that connects the connection pad 523 and the external terminal 531. These pillow portions 58 and 59 are formed together with the wiring pattern 55. In addition, these pillow parts 58 and 59 also play a role of recognition similar to the recognition part 57 described above. That is, the edge 581 of one pillow part 58 and the edge 5111 of the electrode pad 511 are formed along the short side direction of the base 4, and the edge 591 of the other pillow part 59 and the edge 5121 of the electrode pad 512 are formed.
- the pillow portions 58 and 59 and the electrode pads 511 and 512 are used as a mounting reference when the crystal vibrating piece 2 and the IC chip 3 are mounted on the base 4.
- the piece 2 and the IC chip 3 can be accurately mounted on the base 4. As a result, it is possible to improve productivity such as reducing the mounting deviation of the crystal vibrating piece 2 and the IC chip 3 to the base 4 and suppressing the yield.
- two pillow portions 58 and 59 for the crystal vibrating piece 2 that are continuous to the wiring pattern 55 are formed on the wiring pattern 55 that connects the connection pad 523 and the external terminal 531.
- the pillow for the crystal vibrating piece 2 along the wiring pattern 55 that connects the connection pad 523 and the external terminal 531 and that is separated from the wiring pattern 55 Two portions 58 and 59 may be formed. Even in this case, it has the same effect as the pillow portions 58 and 59 shown in FIG. Further, in this case, two pillow parts 58 and 59 for the crystal vibrating piece 2 are formed along the wiring pattern 55 that connects the connection pad 523 and the external terminal 531 and is separated from the wiring pattern 55.
- the quartz crystal resonator element 2 can be held away from the wiring pattern 55, and a short circuit between the wiring pattern 55 and the excitation electrode 24 can be prevented.
- the present invention can be applied to a piezoelectric vibration device such as a crystal oscillator.
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
本実施の形態にかかる水晶発振器1には、図1,2に示すように、圧電振動を行う水晶振動片2(圧電振動片)と、水晶振動片2とともに発振回路を構成する1チップ集積回路素子であるICチップ3(電子部品素子)と、これら水晶振動片2およびICチップ3を保持・搭載し、水晶振動片2およびICチップ3を気密封止するためのベース4(封止部材)と、ベース4と対応して配置され、ベース4に保持・搭載した水晶振動片2およびICチップ3を気密封止するための蓋6(封止部材)と、が設けられている。
次に、本実施の形態2にかかる水晶発振器1を図面を用いて説明する。なお、本実施の形態2にかかる水晶発振器1は、上記の実施の形態1に対して、ベース4が異なる。そのため、同一構成による作用効果及び変形例は、上記した実施の形態1と同様の作用効果及び変形例を有する。そこで、本実施の形態2では、上記の実施の形態1と異なるベース4の構成について説明し、同一の構成についての説明を省略する。
次に、本実施の形態3にかかる水晶発振器1を図面を用いて説明する。なお、本実施の形態3にかかる水晶発振器1は、上記の実施の形態1に対して、ベース4が異なる。そのため、同一構成による作用効果及び変形例は、上記した実施の形態1と同様の作用効果及び変形例を有する。そこで、本実施の形態3では、上記の実施の形態1と異なるベース4の構成について説明し、同一の構成についての説明を省略する。
11 内部空間
2 水晶振動片(圧電振動片)
211 一主面
212 他主面
22 振動部
23 接合部
24 励振電極
25 端子電極
26 引出電極
3 ICチップ(電子部品素子)
31 端子
4 ベース(封止部材)
41 底部
42 壁部
43 一主面
44 キャビティ
441 底面
45 他主面
451 中心点
46 キャスタレーション
47 筐体側面
48 ビア
481 導通部材
491 壁部対応領域
492 キャビティ対応領域
5 電極
511 電極パッド
5111 端縁
512 電極パッド
5121 の端縁
521,522,523,524,525,526 接続パッド
531,532,533,534 外部端子
541,542 検査端子
55 配線パターン
56 枕部
561 一端縁
562 他端縁
57 認識部
58 枕部
581 端縁
59 枕部
591 端縁
6 蓋(封止部材)
71 導電性バンプ
72 導電性接合材
81 絶縁部
82 凹部
L1,L2 線
Claims (8)
- 複数の封止部材により圧電振動片の振動領域が気密封止された圧電振動デバイスの封止部材において、
当該封止部材を構成する基材の一主面に、凸部が成形され、
前記基材の他主面は、前記凸部に対応する領域が平坦面とされ、この平坦面以外の領域が湾曲面とされてなり、
外部の回路基板に接続するための複数の外部端子が、前記平坦面に形成され、
圧電振動片を検査するための複数の検査端子が、前記湾曲面に形成されたことを特徴とする圧電振動デバイスの封止部材。 - 請求項1に記載の圧電振動デバイスの封止部材において、
前記基材の両主面を貫通する複数のビアが形成され、
前記複数のビアの並びが、前記他主面のいずれの辺に対しても傾斜していることを特徴とする圧電振動デバイスの封止部材。 - 請求項1または2に記載の圧電振動デバイスの封止部材において、
前記凸部は、当該封止部材の外形の一部となる壁部であることを特徴とする圧電振動デバイスの封止部材。 - 請求項1乃至3のうちいずれか1つに記載の圧電振動デバイスの封止部材において、
前記検査端子を覆う絶縁材料からなる絶縁部が設けられたことを特徴とする圧電振動デバイスの封止部材。 - 請求項1乃至4のうちいずれか1つに記載の圧電振動デバイスの封止部材において、
電極として、画像認識用の一対の認識部が、前記基材の一主面に形成されたことを特徴とする圧電振動デバイスの封止部材。 - 請求項1乃至5のうちいずれか1つに記載の圧電振動デバイスの封止部材において、
前記基板の一主面に、圧電振動片用であり画像認識用である枕部が形成されたことを特徴とする圧電振動デバイスの封止部材。 - 圧電振動デバイスにおいて、
請求項1乃至6のうちいずれか1つに記載の封止部材と、前記圧電振動片と、が設けられたことを特徴とする圧電振動デバイス。 - 請求項7に記載の圧電振動デバイスにおいて、
集積回路素子が封止部材に設けられ、
前記封止部材と前記集積回路素子との空隙は50μm以下であり、前記封止部材と前記圧電振動片との空隙は、前記封止部材と前記集積回路素子との空隙よりも広いことを特徴とする圧電振動デバイス。
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CN201180021027.3A CN102918767B (zh) | 2010-05-28 | 2011-05-27 | 压电振动器件的密封部件及压电振动器件 |
US13/497,827 US8710718B2 (en) | 2010-05-28 | 2011-05-27 | Sealing member for piezoelectric resonator device, and piezoelectric resonator device |
JP2012517324A JP5741578B2 (ja) | 2010-05-28 | 2011-05-27 | 圧電振動デバイスの封止部材、および圧電振動デバイス |
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CN112448686A (zh) * | 2019-09-05 | 2021-03-05 | 芯恩(青岛)集成电路有限公司 | 一种纳米材料体声波谐振器及其制备方法 |
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JP5942349B2 (ja) * | 2011-07-07 | 2016-06-29 | セイコーエプソン株式会社 | センサー装置 |
CN104115395B (zh) * | 2012-02-28 | 2017-06-09 | 株式会社大真空 | 表面安装型压电振荡器 |
JP5900582B1 (ja) * | 2014-11-21 | 2016-04-06 | 株式会社大真空 | 圧電振動デバイス |
CN107615648B (zh) * | 2015-03-27 | 2020-10-09 | 株式会社大真空 | 压电振动器件 |
US11342899B2 (en) * | 2016-11-16 | 2022-05-24 | Daishinku Corporation | Crystal resonator device |
JP2020134369A (ja) * | 2019-02-21 | 2020-08-31 | セイコーエプソン株式会社 | 慣性センサー、電子機器および移動体 |
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CN102918767B (zh) | 2016-03-30 |
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