JP5879106B2 - 脆性材料基板のスクライブ方法 - Google Patents

脆性材料基板のスクライブ方法 Download PDF

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Publication number
JP5879106B2
JP5879106B2 JP2011257039A JP2011257039A JP5879106B2 JP 5879106 B2 JP5879106 B2 JP 5879106B2 JP 2011257039 A JP2011257039 A JP 2011257039A JP 2011257039 A JP2011257039 A JP 2011257039A JP 5879106 B2 JP5879106 B2 JP 5879106B2
Authority
JP
Japan
Prior art keywords
brittle material
substrate
laser
material substrate
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011257039A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013112532A (ja
Inventor
政直 村上
政直 村上
政二 清水
政二 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2011257039A priority Critical patent/JP5879106B2/ja
Priority to TW101138193A priority patent/TWI488703B/zh
Priority to KR1020120125872A priority patent/KR101440481B1/ko
Priority to CN201210482627.6A priority patent/CN103130409B/zh
Publication of JP2013112532A publication Critical patent/JP2013112532A/ja
Application granted granted Critical
Publication of JP5879106B2 publication Critical patent/JP5879106B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08—Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085—On sheet material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
JP2011257039A 2011-11-25 2011-11-25 脆性材料基板のスクライブ方法 Expired - Fee Related JP5879106B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2011257039A JP5879106B2 (ja) 2011-11-25 2011-11-25 脆性材料基板のスクライブ方法
TW101138193A TWI488703B (zh) 2011-11-25 2012-10-17 脆性材料基板的切割方法及切割裝置
KR1020120125872A KR101440481B1 (ko) 2011-11-25 2012-11-08 취성 재료 기판의 스크라이브 방법 및 취성 재료 기판의 스크라이브 장치
CN201210482627.6A CN103130409B (zh) 2011-11-25 2012-11-23 脆性材料基板的划线方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011257039A JP5879106B2 (ja) 2011-11-25 2011-11-25 脆性材料基板のスクライブ方法

Publications (2)

Publication Number Publication Date
JP2013112532A JP2013112532A (ja) 2013-06-10
JP5879106B2 true JP5879106B2 (ja) 2016-03-08

Family

ID=48490924

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011257039A Expired - Fee Related JP5879106B2 (ja) 2011-11-25 2011-11-25 脆性材料基板のスクライブ方法

Country Status (4)

Country Link
JP (1) JP5879106B2 (zh)
KR (1) KR101440481B1 (zh)
CN (1) CN103130409B (zh)
TW (1) TWI488703B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015048255A (ja) * 2013-08-30 2015-03-16 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
JP6207306B2 (ja) * 2013-08-30 2017-10-04 三星ダイヤモンド工業株式会社 レーザ光によるガラス基板融着方法及びレーザ加工装置
CN105436712B (zh) * 2015-12-07 2017-12-12 武汉铱科赛科技有限公司 一种脆性半导体材料的脆性裂片方法及***
JP6775822B2 (ja) * 2016-09-28 2020-10-28 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法並びに分断装置
CN107199410B (zh) * 2017-07-25 2019-04-02 东莞市盛雄激光设备有限公司 一种激光切割设备及其切割方法
CN111108072B (zh) * 2017-09-27 2022-06-17 三星钻石工业股份有限公司 玻璃基板的切断装置、切断方法和存储介质
KR102216294B1 (ko) 2020-07-22 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
US20230173614A1 (en) 2020-04-28 2023-06-08 Iti Co., Ltd. Ceramic cutting method and equipment
KR102216298B1 (ko) 2020-04-28 2021-02-18 주식회사 아이티아이 세라믹 절단법 및 장비
KR102241518B1 (ko) 2020-11-17 2021-04-19 주식회사 아이티아이 세라믹 절단방법 및 장치

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3938312B2 (ja) 2001-06-14 2007-06-27 住友電工ハードメタル株式会社 硬質材料の加工方法
JP2003088973A (ja) * 2001-09-12 2003-03-25 Hamamatsu Photonics Kk レーザ加工方法
JP4408607B2 (ja) * 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置
JP2004098120A (ja) * 2002-09-09 2004-04-02 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP2005138143A (ja) * 2003-11-06 2005-06-02 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
JP3908236B2 (ja) * 2004-04-27 2007-04-25 株式会社日本製鋼所 ガラスの切断方法及びその装置
JP2007261915A (ja) * 2006-03-29 2007-10-11 Joyo Kogaku Kk レーザによるガラス切断方法および切断装置
TW200738388A (en) * 2006-04-12 2007-10-16 Chung Shan Inst Of Science Device for cutting glass piece and method for the same
JP2008272832A (ja) * 2007-04-03 2008-11-13 Bbele.Com Kk レーザによる脆性材料の切断方法及び切断装置。
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
US8093532B2 (en) * 2008-03-31 2012-01-10 Electro Scientific Industries, Inc. Laser machining of fired ceramic and other hard and/or thick materials
WO2009128316A1 (ja) * 2008-04-15 2009-10-22 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
JP2009262408A (ja) * 2008-04-24 2009-11-12 Lemi Ltd 脆性材料基板のスクライブ方法および装置
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
JP2011057494A (ja) * 2009-09-09 2011-03-24 Lemi Ltd 脆性材料の割断方法および装置
JP2011088799A (ja) * 2009-10-26 2011-05-06 Mitsubishi Electric Corp 半導体装置の製造方法およびレーザー加工装置
JP4719857B2 (ja) * 2009-10-28 2011-07-06 地方独立行政法人鳥取県産業技術センター アタッチメント
US20110127242A1 (en) * 2009-11-30 2011-06-02 Xinghua Li Methods for laser scribing and separating glass substrates
EP2507182B1 (en) * 2009-11-30 2014-03-05 Corning Incorporated Methods for laser scribing and separating glass substrates

Also Published As

Publication number Publication date
KR101440481B1 (ko) 2014-09-18
CN103130409B (zh) 2016-02-10
KR20130058604A (ko) 2013-06-04
TWI488703B (zh) 2015-06-21
CN103130409A (zh) 2013-06-05
JP2013112532A (ja) 2013-06-10
TW201336612A (zh) 2013-09-16

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