JP5867083B2 - ネガ型感光性樹脂組成物およびそれを用いた保護膜 - Google Patents

ネガ型感光性樹脂組成物およびそれを用いた保護膜 Download PDF

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Publication number
JP5867083B2
JP5867083B2 JP2011525758A JP2011525758A JP5867083B2 JP 5867083 B2 JP5867083 B2 JP 5867083B2 JP 2011525758 A JP2011525758 A JP 2011525758A JP 2011525758 A JP2011525758 A JP 2011525758A JP 5867083 B2 JP5867083 B2 JP 5867083B2
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Prior art keywords
resin composition
negative photosensitive
photosensitive resin
solution
same manner
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Japanese (ja)
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JPWO2011129210A1 (ja
Inventor
斉 荒木
斉 荒木
諏訪　充史
充史 諏訪
徹 岡沢
徹 岡沢
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Toray Industries Inc
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Toray Industries Inc
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/22—Absorbing filters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials For Photolithography (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Electroluminescent Light Sources (AREA)
JP2011525758A 2010-04-14 2011-04-04 ネガ型感光性樹脂組成物およびそれを用いた保護膜 Active JP5867083B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011525758A JP5867083B2 (ja) 2010-04-14 2011-04-04 ネガ型感光性樹脂組成物およびそれを用いた保護膜

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010092802 2010-04-14
JP2010092802 2010-04-14
JP2011525758A JP5867083B2 (ja) 2010-04-14 2011-04-04 ネガ型感光性樹脂組成物およびそれを用いた保護膜
PCT/JP2011/058494 WO2011129210A1 (ja) 2010-04-14 2011-04-04 ネガ型感光性樹脂組成物、それを用いた保護膜およびタッチパネル部材

Related Child Applications (1)

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JP2012269010A Division JP5212571B2 (ja) 2010-04-14 2012-12-10 タッチパネル部材

Publications (2)

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JPWO2011129210A1 JPWO2011129210A1 (ja) 2013-07-18
JP5867083B2 true JP5867083B2 (ja) 2016-02-24

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JP2011525758A Active JP5867083B2 (ja) 2010-04-14 2011-04-04 ネガ型感光性樹脂組成物およびそれを用いた保護膜
JP2012269010A Active JP5212571B2 (ja) 2010-04-14 2012-12-10 タッチパネル部材

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Country Status (6)

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JP (2) JP5867083B2 (zh)
KR (1) KR101807641B1 (zh)
CN (1) CN102844708B (zh)
SG (1) SG184526A1 (zh)
TW (1) TWI536105B (zh)
WO (1) WO2011129210A1 (zh)

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JP5708522B2 (ja) 2011-02-15 2015-04-30 信越化学工業株式会社 レジスト材料及びこれを用いたパターン形成方法
JP2012215833A (ja) * 2011-03-31 2012-11-08 Toyo Ink Sc Holdings Co Ltd 感光性樹脂組成物およびタッチパネル用絶縁膜
WO2013084284A1 (ja) * 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
JP2015146038A (ja) * 2011-12-05 2015-08-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物、感光性エレメント、タッチパネルの製造方法及び樹脂硬化膜
WO2013084883A1 (ja) * 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント、並びに、タッチパネルの製造方法
JP6212970B2 (ja) * 2011-12-05 2017-10-18 日立化成株式会社 タッチパネル用電極の保護膜及びタッチパネル
JP2013200577A (ja) * 2011-12-05 2013-10-03 Hitachi Chemical Co Ltd 樹脂硬化膜パターンの形成方法、感光性樹脂組成物、感光性エレメント、タッチパネルの製造方法及び樹脂硬化膜
WO2013084282A1 (ja) * 2011-12-05 2013-06-13 日立化成株式会社 樹脂硬化膜パターンの形成方法、感光性樹脂組成物及び感光性エレメント
WO2013084283A1 (ja) * 2011-12-05 2013-06-13 日立化成株式会社 タッチパネル用電極の保護膜の形成方法、感光性樹脂組成物及び感光性エレメント
US9704724B2 (en) 2011-12-26 2017-07-11 Toray Industries, Inc. Photosensitive resin composition and method for producing semiconductor device
US9377686B2 (en) * 2012-07-09 2016-06-28 Toray Industries, Inc. Photosensitive resin composition, conductive wire protection film, and touch panel member
JP6022870B2 (ja) * 2012-09-25 2016-11-09 旭化成株式会社 感光性樹脂組成物
JP6430098B2 (ja) * 2013-01-15 2018-11-28 日立化成株式会社 タッチパネル電極の保護膜用感光性透明材
JP6217296B2 (ja) * 2013-01-22 2017-10-25 東洋インキＳｃホールディングス株式会社 感光性樹脂組成物、ならびにそれを用いた塗膜
KR20150118582A (ko) * 2013-02-12 2015-10-22 도레이 카부시키가이샤 감광성 수지 조성물, 그것을 열경화시켜서 이루어지는 보호막 또는 절연막, 그것을 사용한 터치 패널 및 그 제조 방법
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CN105122137B (zh) * 2013-03-28 2020-02-07 东丽株式会社 感光性树脂组合物、保护膜或绝缘膜、触摸面板及其制造方法
JP6236885B2 (ja) * 2013-06-04 2017-11-29 日立化成株式会社 保護膜付きタッチパネル用基材の製造方法、感光性樹脂組成物、感光性エレメント、及び、タッチパネル
CN104427742B (zh) * 2013-08-28 2017-08-22 鹏鼎控股(深圳)股份有限公司 覆盖膜及电路板
JP6255806B2 (ja) * 2013-09-04 2018-01-10 Jsr株式会社 ゲート絶縁膜、感放射線性樹脂組成物、硬化膜、ゲート絶縁膜の形成方法、半導体素子および表示装置
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JP2019046499A (ja) * 2018-12-05 2019-03-22 日立化成株式会社 硬化膜付きタッチパネル用基材の製造方法、それに用いる感光性樹脂組成物、感光性エレメント及びタッチパネル
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JPH11202123A (ja) * 1997-10-09 1999-07-30 Dainippon Printing Co Ltd 非導電性遮光層用組成物、非導電性遮光層、およびカラーフィルター
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Also Published As

Publication number Publication date
CN102844708B (zh) 2015-11-25
KR20130070563A (ko) 2013-06-27
JP2013083996A (ja) 2013-05-09
CN102844708A (zh) 2012-12-26
TW201142506A (en) 2011-12-01
KR101807641B1 (ko) 2017-12-11
SG184526A1 (en) 2012-11-29
JPWO2011129210A1 (ja) 2013-07-18
TWI536105B (zh) 2016-06-01
JP5212571B2 (ja) 2013-06-19
WO2011129210A1 (ja) 2011-10-20

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