JP5814272B2 - 組み込まれたダイを有する集積回路パッケージの熱ビア - Google Patents
組み込まれたダイを有する集積回路パッケージの熱ビア Download PDFInfo
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- JP5814272B2 JP5814272B2 JP2012556143A JP2012556143A JP5814272B2 JP 5814272 B2 JP5814272 B2 JP 5814272B2 JP 2012556143 A JP2012556143 A JP 2012556143A JP 2012556143 A JP2012556143 A JP 2012556143A JP 5814272 B2 JP5814272 B2 JP 5814272B2
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Description
104 パッケージ基板
106 導電バンプ
108 パッケージコンタクト
110 パッケージ
112 ダイ
114 パッケージ基板
116 ワイヤボンド
118 ワイヤボンド
120 ダイ
122 ワイヤボンド
200 システム−イン−パッケージ
202 ダイ
204 銅めっき
206 熱ビア
208 パッケージ基板
210 トレース
302 金属層
304 基板
306 金属層
308 コア
310 金属層
312 基板
314 金属層
316 銅めっき
402 テープ
502 熱ホットスポット
Claims (28)
- 複数のパッケージコンタクトに接続される基板と、
前記基板内に組み込まれるダイと、
前記ダイの熱ホットスポットにおいて前記ダイに接続され、前記複数のパッケージコンタクトの少なくとも1つに前記ダイの熱ホットスポットを接続する、前記基板内に形成される複数の熱ビアであって、前記複数の熱ビアに属する1つの熱ビアが、前記ダイの熱ホットスポットに属する1つの熱ホットスポットを実質的に覆うように、少なくとも2つの重畳する円の結合と実質的に同一の断面形状を有する複数の熱ビアと、
を備える製品。 - 前記ダイがアクティブ面と背面とを有し、前記複数の熱ビアが前記ダイの背面に接続され、前記ダイのホットスポットと前記複数のパッケージコンタクトの少なくとも1つとの間に熱通路を提供する、請求項1に記載の製品。
- 前記ダイのホットスポットにおいて前記ダイの背面に堆積される銅めっきをさらに備え、前記銅めっきが、前記複数の熱ビアに前記ダイのホットスポットを熱的に接続する、請求項2に記載の製品。
- 前記基板が第1の面と第2の面とを有し、前記第1の面が複数のパッケージコンタクトに接触し、前記製品が、前記第2の面に接続されるフリップチップダイをさらに備える、請求項1に記載の製品。
- 前記基板が第1の基板部分、コア及び第2の基板部分を備え、前記ダイが前記コア内に組み込まれる、請求項1に記載の製品。
- 前記複数の熱ビアが、前記第1の基板部分内にのみ組み込まれる、請求項5に記載の製品。
- 前記基板が、前記複数のパッケージコンタクト及び前記第1の基板部分に接触する金属層をさらに備える、請求項5に記載の製品。
- 前記複数の熱ビアが、前記金属層の少なくとも一部に接触する、請求項7に記載の製品。
- コア、第1基板、第2基板、複数のパッケージコンタクト、並びに前記複数のパッケージコンタクト及び前記第1基板に接触する金属層を備えるパッケージ基板と、
前記パッケージ基板のコアに組み込まれるダイと、
少なくとも前記金属層の一部に接触する前記パッケージ基板内の複数の熱ビアであって、前記複数の熱ビアが、前記ダイの熱ホットスポットにおいて前記ダイに接続され、前記複数のパッケージコンタクトの少なくとも1つに前記ダイの熱ホットスポットを接続し、前記複数の熱ビアに属する1つの熱ビアが、前記ダイの熱ホットスポットに属する1つの熱ホットスポットを実質的に覆うように、少なくとも2つの重畳する円の結合と実質的に同一の断面形状を有する複数の熱ビアと、
前記複数の熱ビアに接触し、前記ダイの熱ホットスポットにおいて前記ダイに堆積される銅めっきであって、前記複数の熱ビアに前記ダイの熱ホットスポットを熱的に接続し、前記ダイのアクティブ面の1つ又はそれ以上の装置に電気接続を与える銅めっきと、
を備える製品。 - 前記複数の熱ビアが導電性である、請求項1に記載の製品。
- 前記複数の熱ビアの少なくとも1つから前記複数のパッケージコンタクトの少なくとも1つまでの伝熱通路を提供するために前記基板内に形成されるトレースをさらに備える、請求項1に記載の製品。
- 前記複数の熱ビアが、前記ダイの熱ホットスポットに関して実質的に集中するように前記ダイの底面に沿って位置する、請求項1に記載の製品。
- 前記複数の熱ビアに属する前記熱ビアに関連する断面形状が、前記ダイの熱ホットスポットを完全に覆うように形成される外郭を有する、請求項1に記載の製品。
- 組み込まれたダイを有する基板と、
前記組み込まれたダイからの熱を分散するように構成された複数のパッケージコンタクトと、
前記組み込まれたダイのホットスポットを前記複数のパッケージコンタクトに熱的に接続するように構成された複数の熱ビアであって、前記複数の熱ビアが、前記熱ホットスポットにおいて前記組み込まれたダイに接続され、前記組み込まれたダイの熱ホットスポットを実質的に覆うように少なくとも2つの重畳する円の結合と実質的に同一の断面形状を有する、熱的に接続するように構成された複数の熱ビアと、
を備える装置。 - 前記組み込まれたダイが、アクティブ面と背面とを有し、前記熱を分散する複数のパッケージコンタクトに前記ホットスポットを熱的に接続する複数の熱ビアが、前記ホットスポットと前記熱を分散する複数のパッケージコンタクトとの間に熱通路を提供するために前記組み込まれたダイの背面に接続される、請求項14に記載の装置。
- 前記組み込まれたダイのホットスポットを前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに熱的に接続する複数の熱ビアが、前記組み込まれたダイの背面に堆積される銅めっきを含む、請求項15に記載の装置。
- フリップチップダイをさらに備え、前記基板が、前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに接触する第1の面と、前記フリップチップダイに接続される第2の面とを有する、請求項14に記載の装置。
- 前記基板が、第1の基板部分、第2の基板部分及びコアを含み、前記ダイが、前記基板のコアに組み込まれる、請求項14に記載の装置。
- 前記組み込まれたダイのホットスポットを前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに熱的に接続する複数の熱ビアが、前記第1の基板部分にのみ組み込まれる、請求項18に記載の装置。
- 前記基板が、前記第1の基板部分及び前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに接触する金属層をさらに備える、請求項18に記載の装置。
- 前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトが、前記金属層の少なくとも一部と接触する、請求項20に記載の装置。
- 前記組み込まれたダイのホットスポットを前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに熱的に接続する複数の熱ビアが、前記ダイのアクティブ面の1つ又はそれ以上の装置に電気接続を与える手段を含み、前記電気接続を与える手段が、前記ホットスポットにおいて前記組み込まれたダイに堆積される、請求項21に記載の装置。
- 前記組み込まれたダイのホットスポットを前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに熱的に接続する複数の熱ビアが、導電性である、請求項14に記載の装置。
- 前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトと、前記組み込まれたダイのホットスポットを前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに熱的に接続する複数の熱ビアとの間に、伝熱通路を提供する手段をさらに備え、前記伝熱通路を提供する手段が、前記基板内に形成される、請求項14に記載の装置。
- 前記組み込まれたダイのホットスポットを前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに熱的に接続する複数の熱ビアが、前記組み込まれたダイの底面に沿って位置し、前記組み込まれたダイの熱ホットスポットに関して実質的に集中する複数の熱ビアを含む、請求項14に記載の装置。
- 前記組み込まれたダイのホットスポットを前記組み込まれたダイからの熱を分散する複数のパッケージコンタクトに熱的に接続する複数の熱ビアに関連する断面形状が、前記組み込まれたダイの熱ホットスポットを完全に覆うように形成される外郭を有する、請求項14に記載の装置。
- 前記組み込まれたダイを有する基板を収納する第1の基板及び第2の基板をさらに備える、請求項14に記載の装置。
- 集積回路パッケージをさらに備え、そこに組み込まれる前記ダイ及びそこに形成される前記複数の熱ビアを有する前記基板が、前記集積回路パッケージ内に収納される、請求項1に記載の製品。
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US12/714,918 US8633597B2 (en) | 2010-03-01 | 2010-03-01 | Thermal vias in an integrated circuit package with an embedded die |
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PCT/US2011/026539 WO2011109310A2 (en) | 2010-03-01 | 2011-02-28 | Thermal vias in an integrated circuit package with an embedded die |
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KR102556052B1 (ko) * | 2015-12-23 | 2023-07-14 | 삼성전자주식회사 | 시스템 모듈과 이를 포함하는 모바일 컴퓨팅 장치 |
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KR20140107661A (ko) | 2014-09-04 |
CN102822965A (zh) | 2012-12-12 |
KR101697684B1 (ko) | 2017-01-18 |
WO2011109310A2 (en) | 2011-09-09 |
WO2011109310A3 (en) | 2011-10-27 |
US20110210438A1 (en) | 2011-09-01 |
EP2543066A2 (en) | 2013-01-09 |
EP2543066B1 (en) | 2018-08-22 |
BR112012022063A2 (pt) | 2016-08-30 |
JP2013521654A (ja) | 2013-06-10 |
US8633597B2 (en) | 2014-01-21 |
KR20120132511A (ko) | 2012-12-05 |
KR101551279B1 (ko) | 2015-09-08 |
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