JP5801609B2 - 保護回路素子 - Google Patents
保護回路素子 Download PDFInfo
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- JP5801609B2 JP5801609B2 JP2011125448A JP2011125448A JP5801609B2 JP 5801609 B2 JP5801609 B2 JP 5801609B2 JP 2011125448 A JP2011125448 A JP 2011125448A JP 2011125448 A JP2011125448 A JP 2011125448A JP 5801609 B2 JP5801609 B2 JP 5801609B2
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- 239000004065 semiconductor Substances 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 3
- 238000007254 oxidation reaction Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 42
- 230000015556 catabolic process Effects 0.000 description 36
- 238000010586 diagram Methods 0.000 description 23
- 238000009792 diffusion process Methods 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 16
- 238000004088 simulation Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 238000002955 isolation Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/402—Field plates
- H01L29/404—Multiple field plate structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0259—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using bipolar transistors as protective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/083—Anode or cathode regions of thyristors or gated bipolar-mode devices
- H01L29/0834—Anode regions of thyristors or gated bipolar-mode devices, e.g. supplementary regions surrounding anode regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7394—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET on an insulating layer or substrate, e.g. thin film device or device isolated from the bulk substrate
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Description
図1は、半導体装置1の概略的なフロアレイアウトである。図1を参照して、半導体装置1は、高耐圧ドライバ2と、論理回路3と、アナログ回路4と、I/O回路5とを含む。I/O回路はさらにESD保護回路10を含む。
図2は、半導体装置1に含まれるESD保護回路10を概略的に示す回路図である。このESD保護回路10は、半導体装置1の端子ごとに設けられる。ここでは、1つの端子に対するESD保護回路10について説明する。
図6は、実施の形態2に係る横型IGBT100とアバランシェダイオード200との平面図である。図7は、実施の形態2において、図6に示す断面線VII−VIIにおける断面図である。図8は、実施の形態2において、図7に示す断面図を拡大した図である。
以上から、横型IGBT100のコレクタ領域であるN+拡散層105にアバランシェダイオード200を内蔵することによって必要となるESD保護回路10の面積増加はコンタクトを共有する効果もあってごく僅かであり、GGNMOSなどの素子を直列接続する場合よりもESD保護素子の所要面積を減らす事ができる。
Claims (3)
- 半導体基板の主表面上に形成された第1導電型の半導体層を備え、
前記半導体層は横型IGBTとアバランシェダイオードを含み、
前記横型IGBTは、
前記半導体層の表面から深さ方向に形成された前記第1導電型のコレクタ領域と、
前記半導体層の表面から深さ方向に形成された前記第1導電型のエミッタ領域と、
前記エミッタ領域を周方向と下方から取り囲むように、前記半導体層に形成された第2導電型の第1のウェル領域と、
前記半導体層と前記エミッタ領域との間に位置する前記第1のウェル領域の上に形成された第1のゲート電極とを有し、
前記アバランシェダイオードは、
前記コレクタ領域と、
前記コレクタ領域を周方向と下方から取り囲むように、前記半導体層に形成された前記第2導電型の第2のウェル領域とを有し、
前記第2のウェル領域を周囲から取り囲むように、前記半導体層の表面から深さ方向に形成されたLOCOS(Local Oxidation of Silicon)酸化膜と、
前記LOCOS(Local Oxidation of Silicon)酸化膜の下部の一部と接触し、かつ前記半導体層に形成され、前記第2のウェル領域の近傍に形成する前記第1導電型のバッファ領域をさらに備える保護回路素子。 - 前記バッファ領域は、前記エミッタ領域より前記コレクタ領域に近い領域に形成された、請求項1に記載の保護回路素子。
- 前記横型IGBTのゲート長に沿う方向に前記半導体層を切断した断面図において、
前記コレクタ領域の中心から前記コレクタ領域の端部までの距離は、前記コレクタ領域の中心から前記エミッタ領域の中心までの距離の4分の1から2.8分の1である、請求項2に記載の保護回路素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011125448A JP5801609B2 (ja) | 2011-06-03 | 2011-06-03 | 保護回路素子 |
US13/486,783 US8638533B2 (en) | 2011-06-03 | 2012-06-01 | Semiconductor device |
Applications Claiming Priority (1)
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---|---|---|---|
JP2011125448A JP5801609B2 (ja) | 2011-06-03 | 2011-06-03 | 保護回路素子 |
Publications (3)
Publication Number | Publication Date |
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JP2012253233A JP2012253233A (ja) | 2012-12-20 |
JP2012253233A5 JP2012253233A5 (ja) | 2014-04-10 |
JP5801609B2 true JP5801609B2 (ja) | 2015-10-28 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011125448A Expired - Fee Related JP5801609B2 (ja) | 2011-06-03 | 2011-06-03 | 保護回路素子 |
Country Status (2)
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US (1) | US8638533B2 (ja) |
JP (1) | JP5801609B2 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8854103B2 (en) * | 2012-03-28 | 2014-10-07 | Infineon Technologies Ag | Clamping circuit |
US20140334048A1 (en) * | 2013-05-07 | 2014-11-13 | Rf Micro Devices, Inc. | Esd protection circuit |
CN103633071A (zh) * | 2013-11-15 | 2014-03-12 | 四川长虹电器股份有限公司 | Esd保护电路 |
CN103633087B (zh) * | 2013-12-19 | 2016-08-17 | 电子科技大学 | 一种具有esd保护功能的强抗闩锁可控ligbt器件 |
US9231403B2 (en) * | 2014-03-24 | 2016-01-05 | Texas Instruments Incorporated | ESD protection circuit with plural avalanche diodes |
US10872846B2 (en) | 2017-06-22 | 2020-12-22 | Renesas Electronics America Inc. | Solid top terminal for discrete power devices |
CN209571961U (zh) * | 2017-06-29 | 2019-11-01 | 电力集成公司 | 开关式功率转换器及功率因数电路 |
CN109103240B (zh) * | 2018-08-21 | 2021-08-20 | 电子科技大学 | 一种低导通功耗绝缘体上硅横向绝缘栅双极型晶体管 |
CN109888006B (zh) * | 2019-03-12 | 2021-08-20 | 电子科技大学 | 一种低功耗绝缘体上硅横向绝缘栅双极型晶体管 |
CN118017454A (zh) * | 2019-12-06 | 2024-05-10 | 华为技术有限公司 | 一种esd保护电路 |
TWI804736B (zh) * | 2020-03-25 | 2023-06-11 | 立錡科技股份有限公司 | 具有橫向絕緣閘極雙極性電晶體之功率元件及其製造方法 |
CN114664921B (zh) * | 2022-03-21 | 2023-05-05 | 电子科技大学 | 一种具备抗esd功能的igbt及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2289371B (en) * | 1994-05-05 | 1997-11-19 | Fuji Electric Co Ltd | A semiconductor device and control method |
JP2003163271A (ja) * | 2001-11-28 | 2003-06-06 | Matsushita Electric Ind Co Ltd | 半導体保護装置 |
US7804670B2 (en) * | 2005-01-07 | 2010-09-28 | Semiconductor Components Industries, L.L.C. | Hybrid ESD clamp |
JP4857353B2 (ja) | 2009-03-02 | 2012-01-18 | 株式会社日立製作所 | 半導体装置、およびそれを用いたプラズマディスプレイ駆動用半導体装置 |
JP5396124B2 (ja) * | 2009-03-30 | 2014-01-22 | 新日本無線株式会社 | 半導体静電保護装置 |
JP2010278188A (ja) | 2009-05-28 | 2010-12-09 | Renesas Electronics Corp | 半導体集積回路装置 |
US8896064B2 (en) * | 2010-10-18 | 2014-11-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Electrostatic discharge protection circuit |
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2011
- 2011-06-03 JP JP2011125448A patent/JP5801609B2/ja not_active Expired - Fee Related
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2012
- 2012-06-01 US US13/486,783 patent/US8638533B2/en active Active
Also Published As
Publication number | Publication date |
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US8638533B2 (en) | 2014-01-28 |
US20120307407A1 (en) | 2012-12-06 |
JP2012253233A (ja) | 2012-12-20 |
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