JP5789436B2 - ダイボンダ - Google Patents
ダイボンダ Download PDFInfo
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- JP5789436B2 JP5789436B2 JP2011154917A JP2011154917A JP5789436B2 JP 5789436 B2 JP5789436 B2 JP 5789436B2 JP 2011154917 A JP2011154917 A JP 2011154917A JP 2011154917 A JP2011154917 A JP 2011154917A JP 5789436 B2 JP5789436 B2 JP 5789436B2
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- die bonder
- recognition camera
- illumination
- syringe
- adhesive
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- 239000000853 adhesive Substances 0.000 claims description 61
- 230000001070 adhesive effect Effects 0.000 claims description 59
- 238000005286 illumination Methods 0.000 claims description 32
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 230000005856 abnormality Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003909 pattern recognition Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 240000007371 Cuscuta campestris Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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Description
図1において、ダイボンダ10は大別するとウエハ供給部1と、フレーム供給・搬送部2と、ダイボンディング部3とを有する。フレーム供給・搬送部2はスタックローダ21と、フレームフィーダ22と、アンローダ23とを有する。スタックローダ21によりフレームフィーダ22に供給されたフレーム(以下、リードフレームという)は、フレームフィーダ22上の2箇所の処理位置を介してアンローダ23に搬送される。
図2において、リードフレーム34は矢印X方向に移動する。リードフレーム34の上部にはシリンジ36が配置されている。このシリンジ36の内部にはペースト状接着剤37が封入されている。認識用カメラ33はシリンジ36がZ方向に上昇しているときにリードフレーム34の位置やペースト状接着剤37の塗布量を計測するものである。この認識用カメラ33はレンズ33aがペースト状接着剤37の塗布面を常に狙うように、傾斜させて固定されている。認識用カメラ33の下方には照明38が取り付けられている。この照明38は複数個のLED38aで構成されている。この照明38からの明かりは照明38と対向する位置で傾斜して取り付けられた反射板39によってリードフレーム34のパターン認識面とペースト状接着剤37の塗布面を照射するようになっている。
すなわち、リードフレーム34は矢印X方向から移動して来る。リードフレーム34はシリンジ36の直下に来たら停止し、固定された認識用カメラ33にて撮影された画像からリードフレーム34の停止位置が適正であるかを確認する。停止位置が所定の位置であることが確認されたらシリンジ36が下降してリードフレーム34の所定位置にペースト状接着剤37が塗布される。シリンジ36によるペースト状接着剤37の塗布が完了し、シリンジ36がZ方向に上昇したら、認識用カメラ33によってペースト状接着剤37が適正量であるか、又は液垂れの有無などを確認する。適正量で液垂れがないことが確認されたら次の塗布作業へと進む。
図3において、シリンジ36が上昇している段階で、ペースト状接着剤の塗布された部分を固定された認識用カメラ33で観察している。そのとき照明38からの明かりは点線で示すように反射板39に向かって照射され、この反射板39によって跳ね返った明かりはペースト状接着剤塗布面を照らす。
図4において、リードフレーム34の上部にはシリンジ36が配置されている。このシリンジ36にはペースト状接着剤37が封入されている。認識用カメラ33はシリンジ36が上昇しているときにリードフレーム34の位置やペースト状接着剤37の塗布量を観察するものである。認識用カメラ33に取り付けられたレンズ33aの外周にはリング状の照明38が取り付けられている(この照明38については図5で詳細に説明する)。この照明38は複数個のLED38aで構成されている。この照明38からの明かりは照明38と対向する位置で傾斜して取り付けられた反射板39によってリードフレーム34のパターン認識面とペースト状接着剤の塗布面を照射するようになっている。
すなわち、リードフレーム34はシリンジ36の直下に来たら停止し、固定された認識用カメラ33にて撮影された画像からリードフレーム34の停止位置が適正であるかを確認する。停止位置が所定の位置であることが確認されたらシリンジ36が降下してリードフレーム34の所定位置にペースト状接着剤37を塗布する。シリンジ36によるペースト状接着剤37の塗布が完了しシリンジ36が上昇したら、認識用カメラ33によってペースト状接着剤37が適正量で塗布されているかを確認する。適正量であることが確認されたら次の塗布作業へ進む。
図5において、認識用カメラ33のレンズ33aを覆うようにリング状の照明38が取り付けられている。このリング状の照明38はリング状に形成された容器内に複数のLEDを配置した単体の照明装置としてものである(本実施例では6個のLEDで検討を行った)。
図6において、
(ステップ101):プリフォーム部にリードフレームが所定位置まで搬送されて来てペースト状接着剤を塗布するための準備に入る。
(ステップ102):搬送されて来たリードフレームが所定位置に配置されているかを認識用カメラで確認する。
(ステップ103):カメラの視野内でフレームの位置ずれが確認されたら、所定の位置からのズレ分を計算してペースト状接着剤を塗布する際に位置の修正を行う。一方、カメラの視野外や認識不能の場合は、エラーとして作業を停止する(ステップ104)。
(ステップ106):ペースト状接着剤の塗布が終了したシリンジが上昇すると認識用カメラが塗布されたペースト状接着剤の状態を確認する。
(ステップ107):ペースト状接着剤の量が少なかったり、擦れが確認されたりした場合には、塗布不良エラーとして作業を停止する(ステップ108)。問題ないことが確認されたらペースト状接着剤の塗布工程が終了する。
Claims (8)
- リードフレームの上部に位置するように配置され、内部にペースト状接着剤を封入するようにされるシリンジと、
このシリンジの側方に固定されている認識用カメラと、
この認識用カメラの近傍に設けられている照明と、
この照明と対向する位置に設けられている反射板とを備え、
前記反射板は前記照明から直接の明かりを受けて前記リードフレームのペースト状接着剤の塗布面を照射するようにされ、
前記認識用カメラは前記明かりが照射される前記塗布面を撮影するようにされることを特徴とするダイボンダ。 - 請求項1記載のダイボンダにおいて、
前記認識用カメラと前記照明と前記反射板はX方向に搬送されるリードフレームの上部に配置するようにされる前記シリンジを境として−Y側に前記反射板、+Y側に前記認識用カメラと前記照明が配置されていることを特徴とするダイボンダ。 - 請求項1又は2記載のダイボンダにおいて、
前記認識用カメラは前記塗布面にレンズを向けるために傾斜させて固定されていることを特徴とするダイボンダ。 - 請求項3記載のダイボンダにおいて、
前記認識用カメラは前記塗布面をチェックし、異常があった場合は塗布不良エラーとするようにされることを特徴とするダイボンダ。 - 請求項3記載のダイボンダにおいて、
前記照明は前記認識用カメラの下部に配置されていることを特徴とするダイボンダ。 - 請求項3記載のダイボンダにおいて、
前記照明は複数個のLEDによって構成するようにされることを特徴とするダイボンダ。 - 請求項3記載のダイボンダにおいて、
前記反射板の反射面を艶消し白色コーティングとするようにされることを特徴とするダイボンダ。 - 請求項7記載のダイボンダにおいて、
前記艶消し白色コーティングの厚さを0.02mm以上0.04mm以下とするようにされることを特徴とするダイボンダ。
Priority Applications (5)
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TW100131257A TWI456671B (zh) | 2011-07-13 | 2011-08-31 | 晶片黏著機 |
US13/224,511 US9099524B2 (en) | 2011-07-13 | 2011-09-02 | Die bonder |
CN201110264599.6A CN102881613B (zh) | 2011-07-13 | 2011-09-05 | 芯片接合机 |
KR1020110089397A KR101287663B1 (ko) | 2011-07-13 | 2011-09-05 | 다이본더 |
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JP6324823B2 (ja) * | 2014-06-26 | 2018-05-16 | ファスフォードテクノロジ株式会社 | 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 |
JP7161870B2 (ja) * | 2018-06-27 | 2022-10-27 | ファスフォードテクノロジ株式会社 | ダイボンダおよび半導体装置の製造方法 |
JP7300353B2 (ja) * | 2019-09-13 | 2023-06-29 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
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JPH0722166B2 (ja) * | 1982-09-22 | 1995-03-08 | 株式会社東芝 | ダイボンダ等におけるペレツト認識方法 |
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JPS62105436A (ja) * | 1985-10-31 | 1987-05-15 | Nec Kansai Ltd | パタ−ン認識装置 |
JPS63184346A (ja) * | 1987-01-26 | 1988-07-29 | Nec Corp | ペレツトボンデイング装置 |
JP2751435B2 (ja) * | 1989-07-17 | 1998-05-18 | 松下電器産業株式会社 | 電子部品の半田付状態の検査方法 |
JP2969401B2 (ja) * | 1991-10-29 | 1999-11-02 | 株式会社新川 | ボンデイングワイヤ検査装置 |
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US5850256A (en) * | 1995-12-15 | 1998-12-15 | Corley; Ferrand David | Portable test pattern illuminator |
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JP3287777B2 (ja) * | 1996-12-27 | 2002-06-04 | 株式会社新川 | ダイボンディング装置 |
JP3667990B2 (ja) | 1998-05-27 | 2005-07-06 | 富士写真フイルム株式会社 | 画像読取装置 |
JP4331306B2 (ja) | 1999-03-17 | 2009-09-16 | オリンパス株式会社 | 画像取込み装置 |
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KR20070099398A (ko) * | 2006-04-03 | 2007-10-09 | 삼성전자주식회사 | 기판검사장치와 이를 이용한 기판검사방법 |
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JP4870031B2 (ja) * | 2007-06-13 | 2012-02-08 | 大崎エンジニアリング株式会社 | ピックアップ装置 |
CN100561701C (zh) * | 2007-11-13 | 2009-11-18 | 广东工业大学 | 一种焊头定位精度检测***及其方法 |
KR20090067857A (ko) | 2007-12-21 | 2009-06-25 | 세크론 주식회사 | 다이본더용 양방향 촬상 광학계 |
JP5015824B2 (ja) * | 2008-02-29 | 2012-08-29 | 日東電工株式会社 | 粘着フィルム位置検出器および粘着フィルム貼付装置 |
JP5493360B2 (ja) * | 2009-01-08 | 2014-05-14 | オムロン株式会社 | X線検査方法、x線検査装置およびx線検査プログラム |
JP3150529U (ja) * | 2009-03-03 | 2009-05-21 | 協和界面科学株式会社 | 液滴形状測定装置、接触角測定装置 |
JP5277266B2 (ja) * | 2011-02-18 | 2013-08-28 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ及び半導体製造方法 |
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- 2011-08-31 TW TW100131257A patent/TWI456671B/zh active
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- 2011-09-05 KR KR1020110089397A patent/KR101287663B1/ko active IP Right Grant
- 2011-09-05 CN CN201110264599.6A patent/CN102881613B/zh active Active
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CN102881613A (zh) | 2013-01-16 |
US9099524B2 (en) | 2015-08-04 |
TW201304022A (zh) | 2013-01-16 |
JP2013021226A (ja) | 2013-01-31 |
KR20130009537A (ko) | 2013-01-23 |
US20130016205A1 (en) | 2013-01-17 |
KR101287663B1 (ko) | 2013-07-24 |
CN102881613B (zh) | 2016-04-13 |
TWI456671B (zh) | 2014-10-11 |
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