JP5742627B2 - 半導体装置および半導体装置の製造方法 - Google Patents
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- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
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Description
まず、本発明の実施の形態1に係る半導体装置および半導体装置の製造方法について説明する。はじめに、本実施の形態に係る半導体装置としてのMOSFET1の構造について、図1〜図4を参照して説明する。ここで、図3は、MOSFET1に備えられた半導体基板10の上面図である。また、図4は、MOSFET1の構造を部分的に示す上面図である。
次に、本発明の実施の形態2に係る半導体装置および半導体装置の製造方法について説明する。はじめに、本実施の形態に係る半導体装置としてのMOSFET2の構造について、図16〜図19を参照して説明する。ここで、図18は、MOSFET2に備えられた半導体基板10の上面を示す平面図である。また、図19は、MOSFET2の上面を示す平面図である。図16および図17を参照して、MOSFET2は、基本的には上記実施の形態1に係る半導体装置としてのMOSFET1と同様の構造を有し、かつ同様の効果を奏する。しかし、MOSFET2は、電位固定領域とソース配線の接続、およびゲート電極とゲート配線との接続においてMOSFET1とは異なっている。
Claims (10)
- 一方の主表面にトレンチが形成された半導体基板と、
前記トレンチの壁面上に接触して配置された第1絶縁膜と、
前記第1絶縁膜上に接触して配置されたゲート電極と、
前記一方の主表面上に配置された第1配線とを備え、
前記半導体基板は、
第1導電型のドリフト層と、
前記ドリフト層から見て前記一方の主表面側に配置された第2導電型のボディ層とを含み、
前記トレンチは、前記ボディ層を貫通して前記ドリフト層に達するように形成され、
前記トレンチは、平面的に見て活性領域を取り囲むように配置される外周トレンチを含み、
前記外周トレンチから見て前記活性領域とは反対側の前記一方の主表面には前記ボディ層が露出した電位固定領域が形成されており、
前記第1配線は、平面的に見て前記活性領域に重なるように配置され、
前記電位固定領域は、前記第1配線と電気的に接続されており、
前記電位固定領域上に配置された第2絶縁膜と、
平面的に見て前記電位固定領域に重なるように前記第2絶縁膜上に配置された第2配線とをさらに備えた、半導体装置。 - 前記ドリフト層において前記外周トレンチに接触する領域には、第2導電型の電界緩和領域が形成されており、
前記電界緩和領域は、前記電位固定領域に接続されている、請求項1に記載の半導体装置。 - 前記電位固定領域は、前記第1配線下にまで延在する電位固定領域延在部を含み、
前記ゲート電極は、前記第2配線下にまで延在するゲート電極延在部を含み、
前記電位固定領域は、前記電位固定領域延在部において前記第1配線に電気的に接続され、
前記ゲート電極は、前記ゲート電極延在部において前記第2配線に電気的に接続されている、請求項1または2に記載の半導体装置。 - 前記第1配線は、前記外周トレンチ上を越えて前記電位固定領域上にまで延在する第1配線延在部を含み、
前記第2配線は、前記外周トレンチ上を越えて前記ゲート電極上にまで延在する第2配線延在部を含み、
前記第1配線は、前記第1配線延在部において前記電位固定領域と電気的に接続され、
前記第2配線は、前記第2配線延在部において前記ゲート電極と電気的に接続されている、請求項1または2に記載の半導体装置。 - 前記トレンチの側壁面と前記一方の主表面とがなす角は、100°〜160°である、請求項1〜4のいずれか1項に記載の半導体装置。
- 前記半導体基板は、炭化珪素からなっている、請求項1〜5のいずれか1項に記載の半導体装置。
- 第1導電型のドリフト層と、一方の主表面を含むように前記ドリフト層上に形成された第2導電型のボディ層とを含む半導体基板を準備する工程と、
前記一方の主表面側に開口し、前記ボディ層を貫通するとともに前記ドリフト層に達するようにトレンチを形成する工程と、
前記トレンチの壁面を含むように第1絶縁膜を形成する工程と、
前記第1絶縁膜上に接触するようにゲート電極を形成する工程と、
前記一方の主表面上に第1配線を形成する工程とを備え、
前記トレンチを形成する工程では、平面的に見て活性領域を取り囲むように配置される外周トレンチが形成され、
前記第1配線を形成する工程では、平面的に見て前記活性領域に重なるとともに、前記外周トレンチから見て前記活性領域とは反対側の前記一方の主表面に露出する前記ボディ層である電位固定領域に電気的に接続されるように、前記第1配線が形成され、
前記電位固定領域上に第2絶縁膜を形成する工程と、
平面的に見て前記電位固定領域に重なるように前記第2絶縁膜上に第2配線を形成する工程とをさらに備えた、半導体装置の製造方法。 - 前記トレンチを形成する工程では、前記外周トレンチが、前記外周トレンチ以外の前記トレンチと同時に形成される、請求項7に記載の半導体装置の製造方法。
- 前記ドリフト層において前記外周トレンチに接触するように延在し、前記電位固定領域に到達する第2導電型の電界緩和領域を形成する工程をさらに備え、
前記電界緩和領域を形成する工程では、イオン注入により前記電界緩和領域が形成される、請求項7または8に記載の半導体装置の製造方法。 - 前記半導体基板を準備する工程では、炭化珪素からなる半導体基板が準備される、請求項7〜9のいずれか1項に記載の半導体装置の製造方法。
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