JP5686570B2 - ウエーハ支持プレートの使用方法 - Google Patents

ウエーハ支持プレートの使用方法 Download PDF

Info

Publication number: JP5686570B2
Authority: JP; Japan
Prior art keywords: wafer; support plate; cutting; chuck table; wafer support
Prior art date: 2010-10-29
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2010243025A

Other languages

English (en)

Japanese (ja)

Other versions

JP2012094793A (ja

Inventor

関家　一馬

一馬関家

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Disco Corp

Original Assignee

Disco Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-10-29

Filing date

2010-10-29

Publication date

2015-03-18

2010-10-29 Application filed by Disco Corp filed Critical Disco Corp

2010-10-29 Priority to JP2010243025A priority Critical patent/JP5686570B2/ja

2011-09-19 Priority to TW100133627A priority patent/TWI534953B/zh

2011-10-26 Priority to CN201110329279.4A priority patent/CN102468207B/zh

2011-10-26 Priority to KR1020110109778A priority patent/KR101739975B1/ko

2012-05-17 Publication of JP2012094793A publication Critical patent/JP2012094793A/ja

2015-03-18 Application granted granted Critical

2015-03-18 Publication of JP5686570B2 publication Critical patent/JP5686570B2/ja

Status Active legal-status Critical Current

2030-10-29 Anticipated expiration legal-status Critical

Links

235000012431 wafers Nutrition 0.000 claims description 169
238000005520 cutting process Methods 0.000 claims description 79
238000000034 method Methods 0.000 claims description 18
238000003754 machining Methods 0.000 claims description 3
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
230000032258 transport Effects 0.000 description 7
239000004065 semiconductor Substances 0.000 description 6
238000004140 cleaning Methods 0.000 description 5
238000003384 imaging method Methods 0.000 description 5
238000000227 grinding Methods 0.000 description 4
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
238000001514 detection method Methods 0.000 description 2
238000002347 injection Methods 0.000 description 2
239000007924 injection Substances 0.000 description 2
XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
238000002679 ablation Methods 0.000 description 1
239000006061 abrasive grain Substances 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
239000013078 crystal Substances 0.000 description 1
229910003460 diamond Inorganic materials 0.000 description 1
239000010432 diamond Substances 0.000 description 1
238000001035 drying Methods 0.000 description 1
230000006870 function Effects 0.000 description 1
230000001678 irradiating effect Effects 0.000 description 1
230000009191 jumping Effects 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
229910052751 metal Inorganic materials 0.000 description 1
239000002184 metal Substances 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
229910052710 silicon Inorganic materials 0.000 description 1
239000010703 silicon Substances 0.000 description 1
239000007921 spray Substances 0.000 description 1

Images

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Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Dicing (AREA)
Processing Of Stones Or Stones Resemblance Materials (AREA)
Mechanical Treatment Of Semiconductor (AREA)

JP2010243025A 2010-10-29 2010-10-29 ウエーハ支持プレートの使用方法 Active JP5686570B2 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2010243025A JP5686570B2 (ja)	2010-10-29	2010-10-29	ウエーハ支持プレートの使用方法
TW100133627A TWI534953B (zh)	2010-10-29	2011-09-19	Use of wafer support plate
CN201110329279.4A CN102468207B (zh)	2010-10-29	2011-10-26	晶片支承板及晶片支承板的使用方法
KR1020110109778A KR101739975B1 (ko)	2010-10-29	2011-10-26	웨이퍼 지지 플레이트 및 웨이퍼 지지 플레이트의 사용 방법

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2010243025A JP5686570B2 (ja)	2010-10-29	2010-10-29	ウエーハ支持プレートの使用方法

Publications (2)

Publication Number	Publication Date
JP2012094793A JP2012094793A (ja)	2012-05-17
JP5686570B2 true JP5686570B2 (ja)	2015-03-18

Family

ID=46071668

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2010243025A Active JP5686570B2 (ja)	2010-10-29	2010-10-29	ウエーハ支持プレートの使用方法

Country Status (4)

Country	Link
JP (1)	JP5686570B2 (zh)
KR (1)	KR101739975B1 (zh)
CN (1)	CN102468207B (zh)
TW (1)	TWI534953B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102810518A (zh) *	2012-07-13	2012-12-05	日月光半导体制造股份有限公司	晶圆承载板结构及晶圆接合方法
JP6317935B2 (ja) *	2014-02-05	2018-04-25	株式会社ディスコ	保持テーブル
KR101984929B1 (ko)	2017-01-17	2019-06-03	주식회사 네패스	반도체 패키지 제조용 트레이
KR20230144303A (ko)	2022-04-07	2023-10-16	(주)에스티아이	웨이퍼 휨 개선 유닛

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5764156U (zh) *	1980-09-30	1982-04-16
US5195729A (en) *	1991-05-17	1993-03-23	National Semiconductor Corporation	Wafer carrier
JP3099235B2 (ja) *	1993-08-12	2000-10-16	株式会社東京精密	ウエハ検査装置
JP2001210708A (ja) *	2000-01-28	2001-08-03	Dowa Mining Co Ltd	基板の搬送方法及び基板搬送用のトレー
JP4323129B2 (ja) *	2002-02-15	2009-09-02	株式会社ディスコ	板状物の搬送機構
SG115602A1 (en) *	2003-01-09	2005-10-28	Disco Corp	Conveying device for a plate-like workpiece
US20050136653A1 (en) *	2003-12-22	2005-06-23	Ramirez Jose G.	Non-adhesive semiconductor wafer holder and assembly
JP2006120827A (ja) *	2004-10-21	2006-05-11	Renesas Technology Corp	半導体装置の製造方法

2010
- 2010-10-29 JP JP2010243025A patent/JP5686570B2/ja active Active
2011
- 2011-09-19 TW TW100133627A patent/TWI534953B/zh active
- 2011-10-26 KR KR1020110109778A patent/KR101739975B1/ko active IP Right Grant
- 2011-10-26 CN CN201110329279.4A patent/CN102468207B/zh active Active

Also Published As

Publication number	Publication date
TWI534953B (zh)	2016-05-21
KR20120046034A (ko)	2012-05-09
CN102468207B (zh)	2016-05-04
JP2012094793A (ja)	2012-05-17
CN102468207A (zh)	2012-05-23
KR101739975B1 (ko)	2017-05-25
TW201250922A (en)	2012-12-16

Legal Events

Date	Code	Title	Description
2013-09-14	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130913
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2014-06-04	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140603
2014-07-29	A521	Request for written amendment filed	Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20140728
2015-01-09	TRDD	Decision of grant or rejection written
2015-01-21	A01	Written decision to grant a patent or to grant a registration (utility model)	Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20150120
2015-01-29	A61	First payment of annual fees (during grant procedure)	Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20150120
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