JP5686570B2 - ウエーハ支持プレートの使用方法 - Google Patents
ウエーハ支持プレートの使用方法 Download PDFInfo
- Publication number
- JP5686570B2 JP5686570B2 JP2010243025A JP2010243025A JP5686570B2 JP 5686570 B2 JP5686570 B2 JP 5686570B2 JP 2010243025 A JP2010243025 A JP 2010243025A JP 2010243025 A JP2010243025 A JP 2010243025A JP 5686570 B2 JP5686570 B2 JP 5686570B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- support plate
- cutting
- chuck table
- wafer support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 235000012431 wafers Nutrition 0.000 claims description 169
- 238000005520 cutting process Methods 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 18
- 238000003754 machining Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 230000032258 transport Effects 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010243025A JP5686570B2 (ja) | 2010-10-29 | 2010-10-29 | ウエーハ支持プレートの使用方法 |
TW100133627A TWI534953B (zh) | 2010-10-29 | 2011-09-19 | Use of wafer support plate |
CN201110329279.4A CN102468207B (zh) | 2010-10-29 | 2011-10-26 | 晶片支承板及晶片支承板的使用方法 |
KR1020110109778A KR101739975B1 (ko) | 2010-10-29 | 2011-10-26 | 웨이퍼 지지 플레이트 및 웨이퍼 지지 플레이트의 사용 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010243025A JP5686570B2 (ja) | 2010-10-29 | 2010-10-29 | ウエーハ支持プレートの使用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012094793A JP2012094793A (ja) | 2012-05-17 |
JP5686570B2 true JP5686570B2 (ja) | 2015-03-18 |
Family
ID=46071668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010243025A Active JP5686570B2 (ja) | 2010-10-29 | 2010-10-29 | ウエーハ支持プレートの使用方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5686570B2 (zh) |
KR (1) | KR101739975B1 (zh) |
CN (1) | CN102468207B (zh) |
TW (1) | TWI534953B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102810518A (zh) * | 2012-07-13 | 2012-12-05 | 日月光半导体制造股份有限公司 | 晶圆承载板结构及晶圆接合方法 |
JP6317935B2 (ja) * | 2014-02-05 | 2018-04-25 | 株式会社ディスコ | 保持テーブル |
KR101984929B1 (ko) | 2017-01-17 | 2019-06-03 | 주식회사 네패스 | 반도체 패키지 제조용 트레이 |
KR20230144303A (ko) | 2022-04-07 | 2023-10-16 | (주)에스티아이 | 웨이퍼 휨 개선 유닛 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5764156U (zh) * | 1980-09-30 | 1982-04-16 | ||
US5195729A (en) * | 1991-05-17 | 1993-03-23 | National Semiconductor Corporation | Wafer carrier |
JP3099235B2 (ja) * | 1993-08-12 | 2000-10-16 | 株式会社東京精密 | ウエハ検査装置 |
JP2001210708A (ja) * | 2000-01-28 | 2001-08-03 | Dowa Mining Co Ltd | 基板の搬送方法及び基板搬送用のトレー |
JP4323129B2 (ja) * | 2002-02-15 | 2009-09-02 | 株式会社ディスコ | 板状物の搬送機構 |
SG115602A1 (en) * | 2003-01-09 | 2005-10-28 | Disco Corp | Conveying device for a plate-like workpiece |
US20050136653A1 (en) * | 2003-12-22 | 2005-06-23 | Ramirez Jose G. | Non-adhesive semiconductor wafer holder and assembly |
JP2006120827A (ja) * | 2004-10-21 | 2006-05-11 | Renesas Technology Corp | 半導体装置の製造方法 |
-
2010
- 2010-10-29 JP JP2010243025A patent/JP5686570B2/ja active Active
-
2011
- 2011-09-19 TW TW100133627A patent/TWI534953B/zh active
- 2011-10-26 KR KR1020110109778A patent/KR101739975B1/ko active IP Right Grant
- 2011-10-26 CN CN201110329279.4A patent/CN102468207B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TWI534953B (zh) | 2016-05-21 |
KR20120046034A (ko) | 2012-05-09 |
CN102468207B (zh) | 2016-05-04 |
JP2012094793A (ja) | 2012-05-17 |
CN102468207A (zh) | 2012-05-23 |
KR101739975B1 (ko) | 2017-05-25 |
TW201250922A (en) | 2012-12-16 |
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