CN102468207A - 晶片支承板及晶片支承板的使用方法 - Google Patents

晶片支承板及晶片支承板的使用方法 Download PDF

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CN102468207A
CN102468207A CN2011103292794A CN201110329279A CN102468207A CN 102468207 A CN102468207 A CN 102468207A CN 2011103292794 A CN2011103292794 A CN 2011103292794A CN 201110329279 A CN201110329279 A CN 201110329279A CN 102468207 A CN102468207 A CN 102468207A
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关家一马
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Abstract

本发明提供在不使用切削带的情况下能够对晶片进行半切断的晶片支承板及晶片支承板的使用方法。一种支承并运送晶片的晶片支承板，该晶片支承板的特征在于，包括：晶片支承部，其由圆形凹部形成，收纳晶片而进行支承；多个通孔，其形成于该圆形凹部的底部；以及框架部，其围绕该晶片支承部，且加工装置的运送单元作用于该框架部。

Description

晶片支承板及晶片支承板的使用方法
技术领域
本发明涉及用于支承并运送晶片的晶片支承板及该晶片支承板的使用方法。
背景技术
例如，在半导体器件制造工艺中，在通过以格子状形成于大致圆板形状的半导体晶片的表面的切割道(分割预定线)而划分的各个区域分别形成IC、LSI等器件，沿着分割预定线分割形成有该器件的各个区域，从而制造出各个器件。
作为将半导体晶片分割为各个器件的分割装置，一般使用被称为切割装置的切削装置，该切削装置通过具有非常薄的切削刃的切削刀而沿着分割预定线切削半导体晶片，从而将晶片分割为各个器件。这样被分割的器件被包装而广泛利用于便携电话或个人电脑等的电气设备。
近年来，人们要求便携电话或个人电脑等电气设备的轻量化、小型化，要求更薄的器件。作为将晶片分割为更薄的器件的技术，开发了所谓叫作先切割法的分割技术，并得以实用(例如，参照日本特开平11-40520号公报)。
该先切割法是沿着分割预定线从半导体晶片的表面形成预定深度(相当于器件的精加工厚度的深度)的分割槽，然后磨削在表面形成有分割槽的半导体晶片的背面而使得分割槽在该背面外露，从而将晶片分割为各个器件的技术，该技术能够将器件的厚度加工为50μm以下。
在先切割法中，将晶片不完全切断而进行半切断，因此无需使用完全切割时使用的切割带，而为了节约切割带，本申请人开发了用于实施半切断的专用切割装置(参照日本特开2004-235622号公报)。
专利文献1日本特开平11-40520号公报
专利文献2日本特开2004-235622号公报
专利文献3特开2005-166969号公报
但是，专利文献2中所公开的半切断专用的切削装置没有广泛的应用性，在不实施半切断的情况下运行被中断，存在生产性不好的问题。另外，如果通过切割带，由环状框架支承晶片，则虽然可以使用一般的切割带来实施半切断，但由于需要使用切割带，因此存在不够经济的问题。
发明内容
本发明是鉴于上述问题点而研发的，本发明的目的在于提供一种将晶片半切断时无需使用切断带的晶片支承板及该晶片支承板的使用方法。
根据技术方案一的发明，提供一种用于支承并运送晶片的晶片支承板，该晶片支承板的特征在于，包括：晶片支承部，其由圆形凹部形成，收纳晶片而进行支承；多个通孔，其形成于该圆形凹部的底部；以及框架部，其围绕该晶片支承部，且加工装置的运送单元作用于该框架部。
优选为，在圆形凹部的底部配置有防滑片。
根据技术方案三的发明，提供一种在加工装置中的权利要求1或2所述的晶片支承板的使用方法，其中，该加工装置包括：工作盘，其具有保持面，在该保持面上作用有保持晶片的吸引力；加工单元，其对保持在该工作盘上的晶片实施预定的加工；第1运送单元，其向该工作盘运入晶片；以及第2运送单元，其从该工作盘运出晶片，该晶片支承板的使用方法的特征在于，包括：晶片运入步骤，该第1运送单元对收纳有晶片的该晶片支承板的该框架部进行作用，将晶片运入该工作盘的保持面；保持步骤，向该工作盘的保持面作用吸引力，通过形成于该圆形凹部的底部的该多个通孔而吸引并保持晶片；加工步骤，通过该加工单元对晶片实施预定的加工；晶片运出步骤，使从该工作盘运出晶片的该第2运送单元作用于该晶片支承板的该框架部，并且解除作用于该工作盘的保持面的吸引力，从该工作盘运出晶片。
优选为，将晶片支承板的圆形凹部的深度设定得比从形成于晶片的切削槽的底部到晶片的背面的距离浅。
通过由本发明的晶片支承板来支承晶片，即使不使用实施半切断的专用的切削装置，也无需使用切削带且能够使用一般的切削装置而对晶片进行半切断，因此比较经济。并且，本发明的晶片支承板能够重复使用，因此比较经济。
进一步，在向晶片的表面照射对晶片具有吸收性的波长的激光束而实施消融加工来形成分割槽的激光加工装置及向晶片的内部聚光并照射对晶片具有透过性的波长的激光束而在晶片内部形成改质层的激光加工装置中也能够使用本发明的晶片支承板，能够避免切削带的使用，因此比较经济。
附图说明
图1是切削装置的外观立体图。
图2是表示由本发明实施方式的晶片支承板来支承晶片的样子的分解立体图。
图3是由晶片支承板来支承晶片的状态下的立体图。
图4是晶片支承板的纵剖面图。
图5是表示对由晶片支承板支承的晶片进行切削的样子的立体图。
符号说明
2  切削装置
18  工作盘
24  切削单元
28  切削刀
30  晶片支承板
32  圆形凹部(晶片支承部)
33  框架部
34  通孔
具体实施方式
下面，参照附图来详细说明本发明的实施方式。参照图1，该图中表示了能够使用本发明的晶片支承板而将晶片半切断的切削装置2的外观立体图。
在切削装置2的前面侧设有用于由操作员输入加工条件等对装置的指示的操作单元4。在装置上部设有CRT等显示单元6，在该显示单元6上显示对操作员的导向画面和通过后述的摄像单元来摄像的图像。
如图2及图3所示，在作为切割对象的器件晶片W的表面，以正交的方式形成有第1切割道(分割预定线)S1和第2切割道(分割预定线)S2，多个器件D通过第1切割道S1和第2切割道S2被划分而形成于晶片W上。11是作为表示硅晶片W的结晶方位的标记的切口。
参照图2，该图中表示了由本发明实施方式的晶片支承板30来支承晶片W的样子的分解立体图。晶片支承板30具有圆形凹部32，该圆形凹部32具有比晶片W的直径稍大的直径，在圆形凹部32的底部形成有多个通孔34。另外，面对圆形凹部32而形成有与晶片W的切口11嵌合的突起31。
晶片支承板30具有围绕圆形凹部32的框架部33，切削装置2的运送单元作用于该框架部33而运送晶片支承板30。晶片支承板30优选由树脂形成，但也可以由铝等金属形成。
晶片支承板30用于对晶片W进行半切断，因此圆形凹部32的深度被设定为比从形成于晶片W的切削槽的底部到晶片W的背面的距离稍浅的深度。例如，如果晶片W的厚度为700μm，切削槽的深度为100μm，则圆形凹部32的深度比600μm浅，例如被设定为500μm。
图3表示将圆形凹部32作为支承晶片W的晶片支承部，使得晶片支承板30的突起31与晶片W的切口11嵌合，将晶片W***圆形凹部32中的状态下的立体图。优选，如图4的纵剖面图所示，在支承晶片的圆形凹部32的底部配置有防滑片36。
在防滑片36上也形成有与通孔34连通的多个通孔37。通过在作为晶片支承部起作用的圆形凹部32的底部设置防滑片36，从而防止由晶片支承板30来支承晶片W而进行运送的过程中晶片W从圆形凹部32飞出。
再参照图1，在晶片盒8中收纳有多枚由晶片支承板30支承的晶片W。晶片盒8载置于能够上下移动的盒式升降机9上。
在晶片盒8的后方配置有运出入单元10，该运出入单元10从晶片盒8运出切削前的晶片W，并且将切削后的晶片运入晶片盒8。
在晶片盒8与运出入单元10之间设有暂时载置运出入对象的晶片W的区域即临时放置区域12，在临时放置区域12中配置有将晶片W对位在一定的位置上的对位单元14。
在临时放置区域12的附近配置有运送单元16，该运送单元16具有旋转臂，该旋转臂吸附支承了晶片W的晶片支承板30的框架部33而进行运送，运出到临时放置区域12的晶片W被运送单元16吸附而运送到工作盘18上，在该工作盘18的保持面上被吸引，并且通过由多个夹板19来固定晶片支承板30的框架部33而保持在工作盘18上。
工作盘18构成为能够旋转且能够在X轴方向上进行往返运动，在工作盘18的X轴方向的移动路径的上方配置有检测晶片W的应切削的切割道的对准单元20。
对准单元20具有对晶片W的表面进行摄像的摄像单元22，能够根据通过摄像取得的图像，通过图案匹配等处理而检测应切削的切割道。由摄像单元22取得的图像被显示在显示单元6上。
在对准单元20的左侧配置有切削单元24，该切削单元24对保持在工作盘18的晶片W实施切削加工。切削单元24与对准单元20一体构成，两者联动而在Y轴方向及Z轴方向上移动。
切削单元24在能够旋转的主轴26的前端安装切削刀28而构成，且能够在Y轴方向及Z轴方向上移动。切削刀28位于摄像单元22的X轴方向的延长线上。
完成切削的晶片W通过运送单元25从工作盘18运出而被运送到旋转洗涤装置27，由旋转洗涤装置27进行自旋洗涤及自旋干燥。
下面，对如上结构的本发明实施方式的晶片支承板30的使用方法进行说明。晶片支承板的使用方法包括如下步骤：晶片运入步骤，运入晶片W的运送单元16作用于收纳并支承晶片W的晶片支承板30的框架部33，将晶片W运入工作盘18的保持面；以及保持步骤，将吸引力作用于工作盘18的保持面，通过形成于晶片保持板30的圆形凹部32的底部的多个通孔34而吸引并保持晶片W。
如上所述，通过晶片支承板30而在工作盘18吸引并保持晶片W之后，由切削单元(加工单元)24实施对晶片W进行切削加工的切削步骤。关于该切削步骤，将参照图5来进行说明。
参照图5，该图中表示了通过切削单元24沿着切割道切削被晶片支承板30支承的晶片W的样子的立体图。25是切削单元24的主轴壳体，在主轴壳体25中能够旋转地收纳有主轴26，该主轴26通过未图示的伺服马达来旋转驱动。切削刀28是电铸刀，在其外周部具有在镍母材中分散钻石砥粒而成的切削刃28a。
40是覆盖切削刀28的刀盖，安装有沿着切削刀28的侧面延伸的未图示的切削水喷嘴和将切削水喷射到切削刀28的切削刃28a与晶片W之间的接触区域的切削水喷射喷嘴46。
来自切削水供给部44的切削水通过管42而供给到未图示的切削水喷嘴，通过管48而供给到切削水喷射喷嘴46。切削水在切削水供给部44中例如被加压为约0.3MPa，以每分钟1.6～2.0升的流量从切削水喷射喷嘴46喷射。
50是装卸盖，通过螺钉52能够装卸地安装在刀盖40上。装卸盖50具有沿着切削刀28的侧面延伸的切削水喷嘴54，切削水通过管56而供给到切削水喷嘴54。
60是内置有检测切削刀28的切削刃28a的缺口或磨耗的刀片传感器的刀片检测块，通过螺钉62能够装卸地安装在刀盖40上。刀片检测块60具有调整刀片传感器的位置的调整螺钉64。
在沿着切割道S1、S2切削被晶片支承板30支承的晶片W之前，通过周知的图案匹配等手法，实施应切削的切割道S1、S2与切割刀28之间的对准。
在实施对准之后，进行第1切割道S1与切削刀28之间的对位，将工作盘18在图5中由箭头X所示的X轴方向上移动，并且在将切削刀28向箭头A的方向高速旋转(例如30000rpm)的同时，使得切削单元24下降，在对位后的第1切割道S1上形成预定的深度(与器件的精加工厚度相当的深度)的分割槽。
该分割槽的深度形成为不到达晶片支承板30的框架部33的上面的深度，例如为100μm。如上所述，通过由切削刀28对晶片W进行半切断，从而在不损坏晶片支承板30的情况下能够形成预定深度的分割槽。
将切削单元24按照存储于存储器的切割道间距在Y轴方向上分度送出的同时进行切削，从而将第1切割道S1全部半切断，形成相同的分割槽。另外，如果将工作盘18旋转90度之后，进行与上述相同的切削，则将第2切割道S2全部半切断，形成相同的分割槽。
这样，在实施将所有切割道S1、S2半切断的加工步骤之后，解除工作盘18的吸引力，将运送单元25的吸附部作用于晶片支承板30的框架部33而吸引并保持晶片支承板30，运送至旋转洗涤装置27，通过旋转洗涤装置27对晶片W进行自旋洗涤及自旋干燥。
接着，在晶片W的表面粘贴保护带之后，通过使用磨削装置的背面磨削步骤而磨削形成有分割槽的晶片的背面，使得分割槽外露在该背面，从而能够将晶片W分割为各个器件D。
根据上述的本发明的实施方式，通过由晶片支承板30来支承晶片W，从而即使不使用进行半切断的专用的切削装置，而使用一般的切割装置且不使用切割带，也能够对晶片W进行半切断，因此非常经济。并且，晶片支承板30能够重复使用，因此比较经济。
在上述的实施方式中对将本发明的晶片支承板30适用于切削装置2的例子进行了说明，但本发明的晶片支承板30不限于这样的使用方法，本发明同样适用于向晶片W的表面照射对晶片W具有吸收性的波长的激光束而实施消融加工来形成分割槽的激光加工装置及向晶片W的内部聚光并照射对晶片W具有透过性的波长的激光束而在晶片内部形成改质层的激光加工装置中。

Claims (5)

1.一种用于支承并运送晶片的晶片支承板，其特征在于包括：
晶片支承部，其由圆形凹部形成，收纳晶片而进行支承；
多个通孔，其形成于该圆形凹部的底部；以及
框架部，其围绕该晶片支承部，且加工装置的运送单元作用于该框架部。
2.根据权利要求1所述的晶片支承板，其特征在于，
在该圆形凹部的底部配置有防滑片。
3.一种加工装置中的权利要求1或2所述的晶片支承板的使用方法，该加工装置包括：工作盘，其具有保持面，在该保持面上作用有保持晶片的吸引力；加工单元，其对保持在该工作盘上的晶片实施预定的加工；第1运送单元，其向该工作盘运入晶片；以及第2运送单元，其从该工作盘运出晶片，
该晶片支承板的使用方法的特征在于包括：
晶片运入步骤，该第1运送单元作用于收纳有晶片的该晶片支承板的该框架部，将晶片运入该工作盘的保持面；
保持步骤，向该工作盘的保持面作用吸引力，通过形成于该圆形凹部的底部的该多个通孔而吸引并保持晶片；
加工步骤，通过该加工单元对晶片实施预定的加工；以及
晶片运出步骤，使从该工作盘运出晶片的该第2运送单元作用于该晶片支承板的该框架部，并且解除作用于该工作盘的保持面的吸引力，从该工作盘运出晶片。
4.根据权利要求3所述的晶片支承板的使用方法，其特征在于，
该加工单元由切削单元构成，该切削单元具有对晶片实施切削加工的切削刀，
在该加工步骤中，在被该晶片支承板支承的晶片上形成切削槽。
5.根据权利要求4所述的晶片支承板的使用方法，其特征在于，
该晶片支承板的该圆形凹部的深度比从形成于晶片的切削槽的底部到晶片的背面的距离稍浅。
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