JP5675975B2 - 接着剤組成物及び接着フィルム - Google Patents
接着剤組成物及び接着フィルム Download PDFInfo
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- JP5675975B2 JP5675975B2 JP2013517838A JP2013517838A JP5675975B2 JP 5675975 B2 JP5675975 B2 JP 5675975B2 JP 2013517838 A JP2013517838 A JP 2013517838A JP 2013517838 A JP2013517838 A JP 2013517838A JP 5675975 B2 JP5675975 B2 JP 5675975B2
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/12—Polyester-amides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/40—Polyamides containing oxygen in the form of ether groups
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
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- C—CHEMISTRY; METALLURGY
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
表1に示した樹脂成分及びシリカをそれぞれ表に示した比率(重量比、樹脂固形分換算)で配合し、分散させた。分散はプラネタリー混練機を使用し、加温85℃、回転数50rpmで、3時間混練することにより行った。表1に示した樹脂成分及びシリカの詳細は以下の通りである。
結晶性ポリエステル:バイロンGA−5300(東洋紡績株式会社、Mn:25000、ガラス転移点:−2℃、融点:114℃)
ポリウレタンエラストマー:ミラクトランP485RSUI(日本ミラクトラン株式会社)
SIBS:シブスター103T(株式会社カネカ)
シリカ:アドマファインSO−C2(株式会社アドマテックス)
導電性粒子:金属コーティング樹脂ボール(芯部:PMMA、第1層:Ni、最外層:Au、平均粒径30μm) 10重量部
溶剤:イソホロン 300重量部
ブチルセロソルブ 50重量部
N−メチルピロリドン 80重量部
安定剤:イルガノックス1010(チバ・スペシャルティケミカルズ社) 1.3重量部
構成:ポリイミド 25μm/銅箔 18μm
電極メッキ:Ni3μm/Au0.3μm
ピッチ:3mm
電極幅(a):10mm
<PTF基板>
ポリマー:東レ(株)製ポリエチレンテレフタレート(PET) 188μm
銀ペースト:約10μm
*銀ペースト上にレジスト塗工
ピッチ:3mm
図4に示すように、FPC/PTF試験用サンプルのFPC端末端子間で、低抵抗計(HIOKI製、直流方式 3227ミリオームハイテスタ)を使用して、a−b、b−c、c−d間の接続抵抗をそれぞれ測定し、平均値を求めた。
図5に示すように、上記FPC/PTF試験用サンプルを引張試験機(ミネベア株式会社製 PT−200N)で、引張速度50mm/min、剥離方向90度にて剥離し、破断時の最大値を測定した。
図3に示すようにFPC1とPTF基板2とを接続して80℃で1000時間保持した後、上記方法により90度ピール強度を測定した。5N/cm未満ならば×とし、5N/cm以上のものについては、さらに105℃で1000時間保持した後、同様にして90度ピール試験を行い、5N/cm以上であれば○、5N/cm未満であれば△とした。
図3に示すようにFPC1とPTF基板2とが接続したものをエアオーブン中に吊るし、FPC1に600gの重りを付けた後、1℃/90秒で加熱していき、FPC1とPTF基板2とが接着箇所で分離する温度を計測した。80℃以上であれば○、60℃以上80℃未満であれば△、60℃未満であれば×とした。
図1に示したフレキシブルプリント基板(FPC)1の回路4上に、188μmのPETを貼り付け、150℃でプレスし、PET面側から光学顕微鏡で導電性粒子周りの気泡を確認し、気泡がなければ○とし、気泡が若干認められるが実用上問題がない場合は△とし、気泡が認められるため実用上問題がある場合は×とした。
2……ポリマー厚膜フィルム(PTF)基板
3……接着剤組成物(ペースト又はフィルム)
4……回路
Claims (5)
- ポリエーテルエステルアミド100重量部に対し、結晶性ポリエステル1〜100重量部、及びシリカ20〜110重量部を含有してなる接着剤組成物。
- 導電性粒子をさらに含有することを特徴とする、請求項1に記載の接着剤組成物。
- 前記導電性粒子が金属コーティング樹脂ボールであることを特徴とする、請求項2に記載の接着剤組成物。
- 前記結晶性ポリエステルが、数平均分子量が10000〜35000の範囲内であり、ガラス転移点が−70〜30℃の範囲内であり、かつ融点が90〜180℃の範囲内であることを特徴とする、請求項1〜3のいずれか1項に記載の接着剤組成物。
- 請求項1〜4のいずれか1項に記載の接着剤組成物からなる接着フィルム。
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JPS61108676A (ja) * | 1984-10-16 | 1986-05-27 | アトケム | 熱可塑性エラストマ−及びポリエ−テル‐アミドを主成分とする接着性組成物とその使用 |
JP2001354938A (ja) * | 2000-06-12 | 2001-12-25 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置 |
JP2002138269A (ja) * | 2000-08-22 | 2002-05-14 | Nitto Shinko Kk | ポリエステル系ホットメルト接着剤組成物及びこれを用いて形成された接着剤フィルム・シート |
JP2006152233A (ja) * | 2004-11-01 | 2006-06-15 | Tatsuta System Electronics Kk | 異方導電性接着剤及びこれを用いて形成された電子機器 |
JP2010168510A (ja) * | 2009-01-26 | 2010-08-05 | Tatsuta System Electronics Kk | 接着剤組成物 |
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US6528572B1 (en) * | 2001-09-14 | 2003-03-04 | General Electric Company | Conductive polymer compositions and methods of manufacture thereof |
EP1389633A1 (en) | 2002-08-14 | 2004-02-18 | The Procter & Gamble Company | Improved thermoplastic hydrophilic adhesive compositions for dry and wet surfaces the compositions having an increased water adhesion stability |
JP4715130B2 (ja) * | 2004-08-23 | 2011-07-06 | 東洋紡績株式会社 | 接着剤組成物とそれを用いた積層体 |
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JPS61108676A (ja) * | 1984-10-16 | 1986-05-27 | アトケム | 熱可塑性エラストマ−及びポリエ−テル‐アミドを主成分とする接着性組成物とその使用 |
JP2001354938A (ja) * | 2000-06-12 | 2001-12-25 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置 |
JP2002138269A (ja) * | 2000-08-22 | 2002-05-14 | Nitto Shinko Kk | ポリエステル系ホットメルト接着剤組成物及びこれを用いて形成された接着剤フィルム・シート |
JP2006152233A (ja) * | 2004-11-01 | 2006-06-15 | Tatsuta System Electronics Kk | 異方導電性接着剤及びこれを用いて形成された電子機器 |
JP2010168510A (ja) * | 2009-01-26 | 2010-08-05 | Tatsuta System Electronics Kk | 接着剤組成物 |
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TWI496856B (zh) | 2015-08-21 |
TW201302948A (zh) | 2013-01-16 |
CN103403121A (zh) | 2013-11-20 |
JPWO2012164836A1 (ja) | 2015-02-23 |
KR101812370B1 (ko) | 2017-12-26 |
WO2012164836A1 (ja) | 2012-12-06 |
KR20140020861A (ko) | 2014-02-19 |
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