JP5002074B2 - 導電性接着剤組成物及び導電性接着フィルム - Google Patents
導電性接着剤組成物及び導電性接着フィルム Download PDFInfo
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- JP5002074B2 JP5002074B2 JP2011540991A JP2011540991A JP5002074B2 JP 5002074 B2 JP5002074 B2 JP 5002074B2 JP 2011540991 A JP2011540991 A JP 2011540991A JP 2011540991 A JP2011540991 A JP 2011540991A JP 5002074 B2 JP5002074 B2 JP 5002074B2
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- 239000011701 zinc Substances 0.000 description 1
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/12—Polyester-amides
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- C—CHEMISTRY; METALLURGY
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
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- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
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- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
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Description
表1に示した以下の樹脂成分をそれぞれ表に示した比率(重量比、樹脂固形分換算)で配合し、分散させた。分散はプラネタリー混練機を使用し、加温85℃、回転数50rpmで、6時間混練することにより行った。
SIBS:株式会社カネカ製、シブスター103T
SEBS:旭化成ケミカルズ株式会社製、タフテックM1911
ポリウレタンエラストマー:日本ミラクトラン株式会社製、ミラクトランP485RSUI
エポキシ樹脂:三菱化学株式会社製、828
ポリエステル樹脂:東洋紡績株式会社製:バイロンGA−5300
アクリル樹脂:DIC株式会社製、ファインディックA−254
溶剤:ジメチルホルムアミド(DMF) 180重量部
シクロヘキサノン 80重量部
トルエン 45重量部
充填材(タルク、平均粒径4〜5μm) 50重量部
粘着性付与剤(荒川化学工業株式会社製、ペンセルD−125) 30重量部
安定剤(チバ・スペシャルティケミカルズ社製、イルガノックス(登録商標)1010) 1.3重量部
構成:ポリイミド 25μm/銅箔 18μm
電極メッキ:Ni3μm/Au0.3μm
ピッチ:3mm
電極幅(a):10mm
<PTF基板>
ポリマー:東レ株式会社製、ポリエチレンテレフタレート(PET) 188μm
銀ペースト:約10μm
*銀ペースト上にレジスト塗工
ピッチ:3mm
図4に示すように、上記FPC/PTF試験用サンプルを引張試験機(ミネベア株式会社製 PT−200N)で、引張速度100mm/min、剥離方向90度にて剥離し、破断時の最大値を測定した。
図5に示すように、FPC/PTF試験用サンプルのFPC端末端子間で、低抵抗計(HIOKI製、直流方式 3227ミリオームハイテスタ)を使用して、a−b、b−c、c−d間の接続抵抗をそれぞれ測定し、平均値を求めた。
80℃で1000時間保持した後に、上記方法により90度ピール強度を測定し、次の基準で評価した:
A:5N/cm以上、B:5N/cm未満。
スクリーン80メッシュ(テトロン(登録商標))を使用し、乾燥膜厚(乾燥温度120℃、15分間)が20±5μmを維持する様に、接着剤組成物の印刷を実施した。目視により、スクリーンと印刷物間の糸引き、版ぬけ、泡かみ、にじみ等の不具合の有無を観察し、次の基準で評価した;
A:糸引き、版ぬけ、泡かみ、にじみ等の不具合がなく、印刷作業性良好、
B:不具合が若干あるが、許容範囲であり、印刷作業性やや良好、
C:不具合が顕著にあり、印刷作業性不良。
接着剤組成物を平滑面に厚さ20±5μmで塗布し、温度100℃で15分間乾燥後、塗膜に指先で触れて、粘着の有無(タック性)を調べ、次の基準で評価した;
A:タックがなく、良好、
B:タックが若干あり、やや良好、
C:タックが顕著にあり、不良。
コンスタントヒータ方式プレス機(株式会社大橋製作所製、HBM−10)を使用して、圧着温度130〜140℃、圧力3MPa、時間15秒でプレス圧着し、目視により、樹脂流れ、ボイド等の不具合の有無を観察し、次の基準で評価した;
A:不具合がなく、プレス作業性良好、
B:不具合が若干あるが、許容範囲であり、プレス作業性やや良好、
C:不具合が顕著にあり、プレス作業性不良。
接着剤組成物を平滑面に厚さ20±5μmで塗布し、温度120℃で5分間乾燥後、塗膜のブロッキング(くっつき)の有無及び塗膜中のボイドの有無を目視で判断し、次の基準で評価した;
A:ブロッキングもボイドもなく良好、
B:ボイドは若干あるが、ブロッキングはなく、やや良好、
C:ブロッキングもボイドもあり、不良。
実施例9,10,13,14及び比較例3については、接着剤組成物を平滑面に塗布、乾燥して、厚さ35μmのフィルムを形成し、それぞれコーティング幅300mmの幅方向3点(左、中心、右)において長手方向10cmごとに10回(n=30)膜厚を測定し、以下の基準により評価した。膜厚測定は、フィルムを樹脂に埋めて硬化したものを研磨することによりフィルムの厚み方向の断面をあらわにし、その断面をCCDカメラで観察して、厚み寸法を測定することにより行った。
A:標準偏差3μm未満、
B:標準偏差3μm以上、5μm未満、
C:標準偏差5μm以上、7μm未満、
D:標準偏差7μm以上。
2……ポリマー厚膜フィルム(PTF)基板
3……接着剤組成物(ペースト又はフィルム)
Claims (8)
- 樹脂成分と溶剤と導電性粒子とを含有してなる導電性接着剤組成物であって、
前記樹脂成分が、溶剤に可溶のポリエーテルエステルアミドと、スチレン−イソブチレン−スチレン系オレフィンエラストマー、スチレン−エチレン−ブチレン−スチレン系オレフィンエラストマー及びこれらの無水マレイン酸変性物から選択されたオレフィンエラストマー1種又は2種以上とからなり、
これらの配合割合が、前記ポリエーテルエステルアミド100重量部に対して、前記オレフィンエラストマーが総量で1〜300重量部である
ことを特徴とする導電性接着剤組成物。 - 前記溶剤に可溶のポリエーテルエステルアミド100重量部に対し、
さらにウレタンエラストマーを10〜100重量部含有してなる
ことを特徴とする、請求項1に記載の導電性接着剤組成物。 - 前記溶剤に可溶のポリエーテルエステルアミド100重量部に対し、
さらにポリエステル樹脂を1〜100重量部含有してなる
ことを特徴とする、請求項1に記載の導電性接着剤組成物。 - 前記溶剤に可溶のポリエーテルエステルアミド100重量部に対し、
さらにアクリル樹脂を1〜100重量部含有してなる
ことを特徴とする、請求項1に記載の導電性接着剤組成物。 - 前記溶剤に可溶のポリエーテルエステルアミド100重量部に対し、
さらにエポキシ樹脂を5〜50重量部含有してなる
ことを特徴とする、請求項1又は2に記載の導電性接着剤組成物。 - 前記導電性粒子の含有量が、導電性接着剤組成物中の総樹脂固形分100重量部に対して1〜100重量部の範囲内である
ことを特徴とする、請求項1〜5のいずれか1項に記載の導電性接着剤組成物。 - 前記溶剤の使用量が、導電性接着剤組成物の樹脂固形分濃度が10〜50重量%となる範囲である
ことを特徴とする、請求項1〜6のいずれか1項に記載の導電性接着剤組成物。 - 請求項1〜7のいずれか1項に記載の導電性接着剤組成物から得られる導電性接着フィルム。
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US10280343B2 (en) | 2014-12-08 | 2019-05-07 | Shengyi Technology Co., Ltd. | Adhesive resin composition, adhesive film, and flexible metal laminate |
KR102247864B1 (ko) | 2013-08-09 | 2021-05-04 | 닛토덴코 가부시키가이샤 | 점착제 조성물, 점착 테이프 또는 시트 |
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JP2014511029A (ja) * | 2012-03-27 | 2014-05-01 | エイブルスティック・(シャンハイ)・リミテッド | コンデンサ用導電性コーティングおよびそれを用いたコンデンサ |
KR102055031B1 (ko) * | 2012-06-29 | 2019-12-11 | 타츠타 전선 주식회사 | 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 |
WO2015068611A1 (ja) * | 2013-11-07 | 2015-05-14 | 東洋インキScホールディングス株式会社 | 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法 |
US10875283B2 (en) | 2014-07-31 | 2020-12-29 | Toagosei Co., Ltd. | Adhesive layer-equipped laminate, and flexible copper-clad laminate sheet and flexible flat cable using same |
CN104497546A (zh) * | 2014-11-10 | 2015-04-08 | 苏州维泰生物技术有限公司 | 一种医用抗静电导磁聚氨酯薄膜及其制备方法 |
WO2024009969A1 (ja) * | 2022-07-06 | 2024-01-11 | 東亞合成株式会社 | 接着剤組成物、ボンディングフィルム、接着剤組成物層付き積層体、積層体、及び、電磁波シールドフィルム |
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KR102247864B1 (ko) | 2013-08-09 | 2021-05-04 | 닛토덴코 가부시키가이샤 | 점착제 조성물, 점착 테이프 또는 시트 |
US10280343B2 (en) | 2014-12-08 | 2019-05-07 | Shengyi Technology Co., Ltd. | Adhesive resin composition, adhesive film, and flexible metal laminate |
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CN102906211B (zh) | 2014-11-05 |
TW201207066A (en) | 2012-02-16 |
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