JP5606471B2 - 基板回転保持装置および基板処理装置 - Google Patents
基板回転保持装置および基板処理装置 Download PDFInfo
- Publication number
- JP5606471B2 JP5606471B2 JP2012033977A JP2012033977A JP5606471B2 JP 5606471 B2 JP5606471 B2 JP 5606471B2 JP 2012033977 A JP2012033977 A JP 2012033977A JP 2012033977 A JP2012033977 A JP 2012033977A JP 5606471 B2 JP5606471 B2 JP 5606471B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding
- pin
- rotation
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
- B23B31/02—Chucks
- B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
- B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
- B23B31/1261—Chucks with simultaneously-acting jaws, whether or not also individually adjustable pivotally movable in a radial plane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/18—Pivoted jaw
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/24—Chucks or sockets by centrifugal force
- Y10T279/247—Chucks or sockets by centrifugal force to grip tool or workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
第1の実施形態にかかる基板処理装置について図1〜図8を用いて具体的に説明する。なお、図1〜図6においては、位置関係を明確にするために、互いに直交するX方向、Y方向およびZ方向を示す矢印を付している。ここでは、Z方向を上下方向として説明するが、これに限定されるものではない。
次に、第2の実施形態にかかる基板処理装置および基板回転保持装置について説明する。第2の実施形態では、チャックピンにおける基板接触部の形状が異なる以外は、第1の実施形態と同様の構成である。第1の実施形態の構成要素に対応する構成要素には同一の符号を付し、第1の実施形態と重複する説明については適宜、省略する。
Claims (5)
- 円盤状の基板の外周端部を複数の保持部材で挟持して前記基板を保持する基板保持部と、
前記基板保持部を回転させる回転駆動部と
を備え、
各前記保持部材は、
上から見たときに、前記基板との当接面が凹曲面であり、前記凹曲面が周方向に繰り返し形成される
ことを特徴とする基板回転保持装置。 - 各前記保持部材は、
前記凹曲面間に凸曲面が形成される
ことを特徴とする請求項1に記載の基板回転保持装置。 - 前記基板保持部は、
各前記保持部材を回転させ、前記基板に当接する凹曲面を変更する
ことを特徴とする請求項1又は2に記載の基板回転保持装置。 - 円盤状の基板の外周端部を複数の保持部材で挟持して前記基板を保持する基板保持部と、
前記基板保持部を回転させる回転駆動部と、
前記基板が回転している状態で前記基板の処理を行う基板処理部と、
を備え、
各前記保持部材は、
上から見たときに、前記基板との当接面が凹曲面であり、前記凹曲面が周方向に繰り返し形成される
ことを特徴とする基板処理装置。 - 前記基板保持部は、
各前記保持部材を回転させ、前記基板に当接する凹曲面を変更する
ことを特徴とする請求項4に記載の基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033977A JP5606471B2 (ja) | 2012-02-20 | 2012-02-20 | 基板回転保持装置および基板処理装置 |
US13/729,513 US20130214497A1 (en) | 2012-02-20 | 2012-12-28 | Substrate rotation holding apparatus and substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033977A JP5606471B2 (ja) | 2012-02-20 | 2012-02-20 | 基板回転保持装置および基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013171918A JP2013171918A (ja) | 2013-09-02 |
JP5606471B2 true JP5606471B2 (ja) | 2014-10-15 |
Family
ID=48981698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012033977A Expired - Fee Related JP5606471B2 (ja) | 2012-02-20 | 2012-02-20 | 基板回転保持装置および基板処理装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20130214497A1 (ja) |
JP (1) | JP5606471B2 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3012891B1 (fr) * | 2013-11-06 | 2015-11-27 | Altix | Plateau pour machine d'insolation |
US9947572B2 (en) | 2014-03-26 | 2018-04-17 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus |
JP6294793B2 (ja) * | 2014-08-19 | 2018-03-14 | 株式会社ディスコ | エッジクランプ搬送機構 |
CN104733366B (zh) * | 2015-03-27 | 2017-07-25 | 北京七星华创电子股份有限公司 | 一种支撑脚装置 |
JP6461748B2 (ja) * | 2015-08-25 | 2019-01-30 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
FR3041730B1 (fr) * | 2015-09-30 | 2018-12-07 | Safran Transmission Systems | Dispositif de montage d'une couronne d'un train epicycloidal |
JP6660202B2 (ja) * | 2016-02-19 | 2020-03-11 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
KR102518220B1 (ko) * | 2016-11-09 | 2023-04-04 | 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. | 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척 |
TWI765936B (zh) | 2016-11-29 | 2022-06-01 | 美商東京威力科創Fsi股份有限公司 | 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭 |
KR102493551B1 (ko) | 2017-01-27 | 2023-01-30 | 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. | 프로세스 챔버에서 기판을 회전 및 병진시키기 위한 시스템 및 방법 |
US10658221B2 (en) * | 2017-11-14 | 2020-05-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer cleaning apparatus and method for cleaning semiconductor wafer |
JP7357625B2 (ja) | 2018-02-19 | 2023-10-06 | ティーイーエル マニュファクチュアリング アンド エンジニアリング オブ アメリカ,インコーポレイテッド | 制御可能なビームサイズの処理噴霧を有する小型電子機器処理システム |
JP7172163B2 (ja) | 2018-06-20 | 2022-11-16 | 日新電機株式会社 | 基板保持装置 |
US11545387B2 (en) | 2018-07-13 | 2023-01-03 | Tel Manufacturing And Engineering Of America, Inc. | Magnetic integrated lift pin system for a chemical processing chamber |
KR20220092729A (ko) * | 2020-12-24 | 2022-07-04 | 세메스 주식회사 | 척 핀 어셈블리 및 이를 포함하는 기판 지지 장치 및 액 처리 장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09213772A (ja) * | 1996-01-30 | 1997-08-15 | Dainippon Screen Mfg Co Ltd | 基板保持装置 |
JP2008013851A (ja) * | 2000-04-27 | 2008-01-24 | Ebara Corp | 回転保持装置及び半導体基板処理装置 |
JP2003258069A (ja) * | 2002-03-05 | 2003-09-12 | Sumitomo Mitsubishi Silicon Corp | 半導体ウェーハの保持具 |
US6964419B2 (en) * | 2003-04-02 | 2005-11-15 | Taiwan Seminconductor Manufacturing Co., Ltd. | Chuck rollers and pins for substrate cleaning and drying system |
US7578886B2 (en) * | 2003-08-07 | 2009-08-25 | Ebara Corporation | Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
JP2006253210A (ja) * | 2005-03-08 | 2006-09-21 | Dainippon Screen Mfg Co Ltd | 基板保持装置、基板処理装置および基板処理方法 |
JP2007157921A (ja) * | 2005-12-02 | 2007-06-21 | Ebara Corp | 基板処理装置及び基板処理方法 |
US20070199656A1 (en) * | 2006-02-28 | 2007-08-30 | Ibis Technology Corporation | Hybrid wafer-holder |
JP2010021041A (ja) * | 2008-07-11 | 2010-01-28 | Sumco Corp | イオン注入装置のウェーハ保持具 |
US8608146B2 (en) * | 2009-12-18 | 2013-12-17 | Lam Research Ag | Reinforced pin for being used in a pin chuck, and a pin chuck using such reinforced pin |
-
2012
- 2012-02-20 JP JP2012033977A patent/JP5606471B2/ja not_active Expired - Fee Related
- 2012-12-28 US US13/729,513 patent/US20130214497A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2013171918A (ja) | 2013-09-02 |
US20130214497A1 (en) | 2013-08-22 |
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