JP5955635B2 - 洗浄装置 - Google Patents
洗浄装置 Download PDFInfo
- Publication number
- JP5955635B2 JP5955635B2 JP2012110068A JP2012110068A JP5955635B2 JP 5955635 B2 JP5955635 B2 JP 5955635B2 JP 2012110068 A JP2012110068 A JP 2012110068A JP 2012110068 A JP2012110068 A JP 2012110068A JP 5955635 B2 JP5955635 B2 JP 5955635B2
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- Prior art keywords
- cleaning
- rotation
- cleaned
- support rollers
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims description 143
- 230000007246 mechanism Effects 0.000 claims description 27
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 description 26
- 235000012431 wafers Nutrition 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 230000001105 regulatory effect Effects 0.000 description 10
- 239000007788 liquid Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 239000002699 waste material Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229920006311 Urethane elastomer Polymers 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Description
図1は、本実施形態に係る洗浄装置(小径保持位置)の平面図である。図2は、本実施形態に係る洗浄装置(小径保持位置)の正面図である。図3は、本実施形態に係る洗浄装置(大径保持位置)の平面図である。図4は、本実施形態に係る洗浄装置(大径保持位置)の正面図である。図5は、本実施形態に係る洗浄装置により洗浄される洗浄対象物(小径)を示す図である。図6は、本実施形態に係る洗浄装置により洗浄される洗浄対象物(大径)を示す図である。本実施形態に係る洗浄装置は、洗浄対象物を保持した状態で回転させながら、洗浄対象物の下面を洗浄するものである。洗浄装置1は、図1〜図4に示すように、回転保持手段2と、洗浄手段3とを含んで構成されている。
2 回転保持手段
21a〜21d 支持ローラー
21e〜21h 接触部
22a〜22d 回転基台
23a〜23c 回転駆動源
24a,24b 固定基台
25a,25b 移動機構
25c,25d シャフト
25e,25f シリンダ本体
26 回転センサ
27a〜27d 小径規制ピン
28a〜28d 大径規制ピン
3 洗浄手段
31 洗浄ローラー
32 回転シャフト
33 洗浄ローラー回転駆動源
R1a〜R1d:回転軸
R2a〜R2d:回転軸
R3a〜R3d:回転軸
S1,S2 洗浄対象物
T1,T2 支持基板
W1,W2 被加工物
Claims (1)
- 少なくとも被加工物を含む円盤状の洗浄対象物を外周縁で水平あるいは略水平に保持しながら回転させる回転保持手段と、前記回転保持手段で保持された前記洗浄対象物の下面を洗浄する洗浄手段とを備えた洗浄装置であって、
前記回転保持手段は、
前記洗浄対象物の外周縁に接触しつつ、鉛直方向の回転軸で回転する3個以上の支持ローラーと、
少なくとも1個の前記支持ローラーに装着された回転駆動源と、
前記支持ローラーを回転自在に支持し、前記支持ローラーの回転軸とは異なる位置にある鉛直方向の回転軸で回動する回転基台と、
所定の異なる位置に前記支持ローラーを位置づける移動機構と、
を備え、
前記移動機構は、前記回転基台を前記回転軸周りに回動させ、隣り合う前記支持ローラーの相対距離を変更するものであり、
鉛直方向から見た際に、前記回転保持手段が前記洗浄対象物の外周縁に対応する領域および前記洗浄対象物の外側に配設され、前記洗浄手段が前記洗浄対象物の中央を含んだ領域の前記洗浄対象物の下方に配設され、
前記洗浄対象物の直径の変更に対応して前記洗浄対象物の下面を洗浄することを特徴とする洗浄装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012110068A JP5955635B2 (ja) | 2012-05-11 | 2012-05-11 | 洗浄装置 |
KR1020130051952A KR101989199B1 (ko) | 2012-05-11 | 2013-05-08 | 세정 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012110068A JP5955635B2 (ja) | 2012-05-11 | 2012-05-11 | 洗浄装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013239498A JP2013239498A (ja) | 2013-11-28 |
JP5955635B2 true JP5955635B2 (ja) | 2016-07-20 |
Family
ID=49764309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012110068A Active JP5955635B2 (ja) | 2012-05-11 | 2012-05-11 | 洗浄装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5955635B2 (ja) |
KR (1) | KR101989199B1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6403564B2 (ja) * | 2014-12-12 | 2018-10-10 | 株式会社ディスコ | 洗浄装置 |
JP6549936B2 (ja) * | 2015-08-19 | 2019-07-24 | 株式会社ディスコ | 洗浄装置 |
JP6609197B2 (ja) * | 2016-02-25 | 2019-11-20 | 株式会社ディスコ | 洗浄装置 |
JP7251899B2 (ja) | 2018-12-11 | 2023-04-04 | 株式会社ディスコ | 被加工物の加工方法 |
CN115547887B (zh) * | 2022-09-26 | 2023-06-02 | 先之科半导体科技(东莞)有限公司 | 一种碳化硅二极管生产的刻蚀清洗设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3314685B2 (ja) * | 1997-09-17 | 2002-08-12 | 三菱マテリアル株式会社 | ディスクの回転装置 |
JP2003249620A (ja) | 2002-02-22 | 2003-09-05 | Toray Eng Co Ltd | 半導体の接合方法およびその方法により作成された積層半導体 |
JP2004342820A (ja) | 2003-05-15 | 2004-12-02 | Shimada Phys & Chem Ind Co Ltd | 基板処理装置 |
JP4308778B2 (ja) * | 2005-01-11 | 2009-08-05 | 和夫 田▲邉▼ | ウエーハの洗浄装置 |
KR100905920B1 (ko) * | 2008-02-20 | 2009-07-02 | (주)이노맥스 | 디스크 세정장치 |
-
2012
- 2012-05-11 JP JP2012110068A patent/JP5955635B2/ja active Active
-
2013
- 2013-05-08 KR KR1020130051952A patent/KR101989199B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101989199B1 (ko) | 2019-06-13 |
KR20130126500A (ko) | 2013-11-20 |
JP2013239498A (ja) | 2013-11-28 |
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