JP5513694B1 - 配線基板およびその製造方法 - Google Patents
配線基板およびその製造方法 Download PDFInfo
- Publication number
- JP5513694B1 JP5513694B1 JP2013555696A JP2013555696A JP5513694B1 JP 5513694 B1 JP5513694 B1 JP 5513694B1 JP 2013555696 A JP2013555696 A JP 2013555696A JP 2013555696 A JP2013555696 A JP 2013555696A JP 5513694 B1 JP5513694 B1 JP 5513694B1
- Authority
- JP
- Japan
- Prior art keywords
- metal
- wiring board
- surface layer
- connection terminal
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000002184 metal Substances 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 68
- 239000002344 surface layer Substances 0.000 claims abstract description 66
- 238000002844 melting Methods 0.000 claims abstract description 16
- 230000008018 melting Effects 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 238000010292 electrical insulation Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 24
- 238000007747 plating Methods 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 28
- 230000004048 modification Effects 0.000 description 20
- 238000012986 modification Methods 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
図1は、配線基板10の構成を示す上面図である。図2は、配線基板10の構成を模式的に示す部分断面図である。図3は、半導体チップ20を実装した配線基板10の構成を模式的に示す部分断面図である。図2には、図1の矢視F2−F2で切断した配線基板10の断面を図示した。図3には、半導体チップ20を実装した配線基板10を、図1の矢視F2−F2に対応する位置で切断した断面を図示した。
図8は、変形例における配線基板10bの構成を示す上面図である。配線基板10bの説明において、上述した実施形態の配線基板10と同様の構成については同一符号を付すと共に説明を省略する。本変形例は、本明細書で説明する他の実施形態や他の変形例に適用することが可能である。変形例の配線基板10bは、第1表面141、第2表面142、接続端子130および開口部150の形状がそれぞれ異なる点を除き、上述した実施形態の配線基板10と同様である。
図9は、変形例の配線基板10cにおける接続端子130cの詳細構成を模式的に示す拡大断面図である。配線基板10cの説明において、上述した実施形態の配線基板10と同様の構成については同一符号を付すと共に説明を省略する。本変形例は、本明細書で説明する他の実施形態や他の変形例に適用することが可能である。
本発明は、上述の実施形態や実施例、変形例に限られるものではなく、その趣旨を逸脱しない範囲において種々の構成で実現することができる。例えば、発明の概要の欄に記載した各形態中の技術的特徴に対応する実施形態、実施例、変形例中の技術的特徴は、上述の課題の一部または全部を解決するために、あるいは、上述の効果の一部または全部を達成するために、適宜、差し替えや、組み合わせを行うことが可能である。また、その技術的特徴が本明細書中に必須なものとして説明されていなければ、適宜、削除することが可能である。
20…半導体チップ
30…アンダーフィル材
120…基層
130,130c…接続端子
132…基部
132a…側部
132b…側部
132c…端部
132d…側部
132e…端部
134…被覆部
136…空洞
138…充填部
140…表層
141…第1表面
142…第2表面
148…壁面
150…開口部
232…接続端子
SD…ハンダ
Claims (6)
- 電気絶縁性を有する表層と、
導電性を有し前記表層から突出した接続端子と
を備える配線基板であって、
前記接続端子は、
導電性を有する第1金属からなり、前記表層に隣接しつつ前記表層を貫通すると共に、前記表層から突出した基部と、
導電性を有し前記第1金属よりも融点が低い第2金属からなり、前記基部を被覆する被覆部と、
前記第1金属および前記第2金属を含有する合金と、前記第2金属との少なくとも一方からなり、前記基部の空洞に充填された充填部と
を含むことを特徴とする配線基板。 - 前記第1金属は銅(Cu)であり、前記第2金属は錫(Sn)であることを特徴とする請求項1に記載の配線基板。
- 導電性を有する第1金属からなる基部に、導電性を有し前記第1金属よりも融点が低い第2金属からなる被覆部を被覆した接続端子を、電気絶縁性の表層から突出した状態で形成してなる配線基板の製造方法であって、
前記第2金属の融点以上に前記接続端子を加熱して前記基部および前記被覆部のうち少なくとも前記被覆部を溶融させた溶融金属を、前記基部の空洞に充填することを特徴とする配線基板の製造方法。 - 前記被覆部を置換メッキによって形成する際に、前記基部に前記空洞を形成することを特徴とする請求項3に記載の配線基板の製造方法。
- 電気絶縁性を有する表層と、
導電性を有し前記表層から突出した接続端子と
を備える配線基板であって、
前記接続端子は、
導電性を有する第1金属からなり、前記表層に隣接する基部と、
導電性を有し前記第1金属よりも融点が低い第2金属からなり、前記基部を被覆する被覆部と、
前記第1金属および前記第2金属を含有する合金と、前記第2金属との少なくとも一方からなり、前記基部の空洞に充填された充填部と
を含むことを特徴とする配線基板。 - 前記第1金属は銅(Cu)であり、前記第2金属は錫(Sn)であることを特徴とする請求項5に記載の配線基板。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013555696A JP5513694B1 (ja) | 2012-09-07 | 2013-07-29 | 配線基板およびその製造方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012196863 | 2012-09-07 | ||
JP2012196863 | 2012-09-07 | ||
PCT/JP2013/004588 WO2014038125A1 (ja) | 2012-09-07 | 2013-07-29 | 配線基板およびその製造方法 |
JP2013555696A JP5513694B1 (ja) | 2012-09-07 | 2013-07-29 | 配線基板およびその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5513694B1 true JP5513694B1 (ja) | 2014-06-04 |
JPWO2014038125A1 JPWO2014038125A1 (ja) | 2016-08-08 |
Family
ID=50236764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013555696A Expired - Fee Related JP5513694B1 (ja) | 2012-09-07 | 2013-07-29 | 配線基板およびその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10123415B2 (ja) |
EP (1) | EP2894951B1 (ja) |
JP (1) | JP5513694B1 (ja) |
KR (1) | KR101622895B1 (ja) |
CN (1) | CN104604341B (ja) |
TW (1) | TWI492678B (ja) |
WO (1) | WO2014038125A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6181441B2 (ja) * | 2013-06-24 | 2017-08-16 | 新光電気工業株式会社 | パッド構造、実装構造、及び、製造方法 |
KR20170083823A (ko) * | 2016-01-11 | 2017-07-19 | 에스케이하이닉스 주식회사 | 측면 범프 결합 구조를 갖는 반도체 패키지 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001267376A (ja) * | 2000-03-14 | 2001-09-28 | Seiko Instruments Inc | Fpcの製造方法及び表示装置 |
JP2002289652A (ja) * | 2001-03-26 | 2002-10-04 | Hitachi Cable Ltd | 半導体装置用テープキャリアおよびその製造方法 |
JP2010153744A (ja) * | 2008-12-26 | 2010-07-08 | Fujitsu Ltd | 回路基板の製造方法及び半導体装置の製造方法 |
JP2011192692A (ja) * | 2010-03-12 | 2011-09-29 | Mitsubishi Paper Mills Ltd | ソルダーレジストパターンの形成方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002261111A (ja) * | 2001-03-06 | 2002-09-13 | Texas Instr Japan Ltd | 半導体装置及びバンプ形成方法 |
JP2004288785A (ja) * | 2003-03-20 | 2004-10-14 | Sony Corp | 導電突起の接合構造及び接合方法 |
TWI254995B (en) | 2004-01-30 | 2006-05-11 | Phoenix Prec Technology Corp | Presolder structure formed on semiconductor package substrate and method for fabricating the same |
JP2006024902A (ja) * | 2004-06-07 | 2006-01-26 | Shinko Electric Ind Co Ltd | 極細線パターンを有する配線基板の製造方法および配線基板 |
WO2006040847A1 (ja) * | 2004-10-14 | 2006-04-20 | Ibiden Co., Ltd. | プリント配線板及びプリント配線板の製造方法 |
JP4665531B2 (ja) * | 2005-01-27 | 2011-04-06 | 日立電線株式会社 | 配線板の製造方法 |
TWI281840B (en) * | 2005-05-09 | 2007-05-21 | Phoenix Prec Technology Corp | Electrically connecting structure of circuit board and method for fabricating same |
JP4747770B2 (ja) | 2005-10-04 | 2011-08-17 | 日立化成工業株式会社 | プリント配線板の製造方法、及び半導体チップ搭載基板の製造方法 |
DE102006025162B3 (de) * | 2006-05-30 | 2008-01-31 | Epcos Ag | Flip-Chip-Bauelement und Verfahren zur Herstellung |
US7619305B2 (en) * | 2007-08-15 | 2009-11-17 | Powertech Technology Inc. | Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking |
WO2009110095A1 (ja) * | 2008-03-07 | 2009-09-11 | 富士通株式会社 | 導電材料、導電ペースト、回路基板、及び半導体装置 |
US7569935B1 (en) * | 2008-11-12 | 2009-08-04 | Powertech Technology Inc. | Pillar-to-pillar flip-chip assembly |
JP5287976B2 (ja) * | 2009-03-09 | 2013-09-11 | 株式会社村田製作所 | 樹脂配線基板 |
US8299341B2 (en) * | 2009-05-13 | 2012-10-30 | The California Institute Of Technology | Fabrication of vertically aligned metallic nanopillars |
TWI469288B (zh) * | 2009-06-11 | 2015-01-11 | Chipbond Technology Corp | 凸塊化晶片結構及其應用之半導體覆晶裝置 |
US8143704B2 (en) * | 2009-10-02 | 2012-03-27 | Texas Instruments Incorporated | Electronic assemblies including mechanically secured protruding bonding conductor joints |
US8786062B2 (en) * | 2009-10-14 | 2014-07-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and process for fabricating same |
US8669137B2 (en) * | 2011-04-01 | 2014-03-11 | International Business Machines Corporation | Copper post solder bumps on substrate |
KR20130076286A (ko) * | 2011-12-28 | 2013-07-08 | 삼성전기주식회사 | 인쇄회로기판 및 그의 제조방법 |
-
2013
- 2013-07-29 CN CN201380046617.0A patent/CN104604341B/zh not_active Expired - Fee Related
- 2013-07-29 JP JP2013555696A patent/JP5513694B1/ja not_active Expired - Fee Related
- 2013-07-29 EP EP13834871.9A patent/EP2894951B1/en not_active Not-in-force
- 2013-07-29 KR KR1020157008427A patent/KR101622895B1/ko active IP Right Grant
- 2013-07-29 WO PCT/JP2013/004588 patent/WO2014038125A1/ja active Application Filing
- 2013-07-29 US US14/416,254 patent/US10123415B2/en active Active
- 2013-09-05 TW TW102131921A patent/TWI492678B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001267376A (ja) * | 2000-03-14 | 2001-09-28 | Seiko Instruments Inc | Fpcの製造方法及び表示装置 |
JP2002289652A (ja) * | 2001-03-26 | 2002-10-04 | Hitachi Cable Ltd | 半導体装置用テープキャリアおよびその製造方法 |
JP2010153744A (ja) * | 2008-12-26 | 2010-07-08 | Fujitsu Ltd | 回路基板の製造方法及び半導体装置の製造方法 |
JP2011192692A (ja) * | 2010-03-12 | 2011-09-29 | Mitsubishi Paper Mills Ltd | ソルダーレジストパターンの形成方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104604341A (zh) | 2015-05-06 |
US20150189752A1 (en) | 2015-07-02 |
US10123415B2 (en) | 2018-11-06 |
TWI492678B (zh) | 2015-07-11 |
KR101622895B1 (ko) | 2016-05-19 |
WO2014038125A1 (ja) | 2014-03-13 |
JPWO2014038125A1 (ja) | 2016-08-08 |
EP2894951A1 (en) | 2015-07-15 |
EP2894951A4 (en) | 2016-08-10 |
EP2894951B1 (en) | 2018-07-04 |
TW201424481A (zh) | 2014-06-16 |
KR20150052212A (ko) | 2015-05-13 |
CN104604341B (zh) | 2017-12-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI479971B (zh) | 佈線板,其製造方法及具有佈線板之半導體裝置 | |
TWI660652B (zh) | 印刷電路板及其製造方法 | |
US9301391B2 (en) | Substrate structure, semiconductor package device, and manufacturing method of substrate structure | |
TWI573229B (zh) | 配線基板 | |
US9247654B2 (en) | Carrier substrate and manufacturing method thereof | |
JP2008085089A (ja) | 樹脂配線基板および半導体装置 | |
CN103889168A (zh) | 承载电路板、承载电路板的制作方法及封装结构 | |
KR20170014958A (ko) | 반도체 패키지 및 반도체 패키지의 제조방법 | |
TW201618261A (zh) | 電子元件封裝結構及製作方法 | |
US8322596B2 (en) | Wiring substrate manufacturing method | |
CN103400810A (zh) | 半导体芯片的层叠封装结构及其制造方法 | |
JP5513694B1 (ja) | 配線基板およびその製造方法 | |
US9420696B2 (en) | Method of manufacturing wiring substrate | |
JP5475077B2 (ja) | 配線基板およびその製造方法 | |
US10314166B2 (en) | Printed wiring board | |
TW201639089A (zh) | 晶片封裝結構的製作方法 | |
US20160255726A1 (en) | Package and method of manufacturing package thereof | |
JP5956185B2 (ja) | 多数個取り配線基板 | |
JP2013182909A (ja) | 電子部品搭載用多数個取り基板 | |
JP5934057B2 (ja) | プリント回路基板 | |
KR20170038535A (ko) | 인쇄회로기판 및 그 제조방법 | |
JP5491605B1 (ja) | 配線基板 | |
JP2016189400A (ja) | 多層プリント配線板の製造方法 | |
KR102172678B1 (ko) | 인쇄회로기판 및 이의 제조 방법 | |
CN109275340A (zh) | 模块 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20140226 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140304 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140327 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5513694 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |