JP5478877B2 - 研磨パッド - Google Patents
研磨パッド Download PDFInfo
- Publication number
- JP5478877B2 JP5478877B2 JP2008332478A JP2008332478A JP5478877B2 JP 5478877 B2 JP5478877 B2 JP 5478877B2 JP 2008332478 A JP2008332478 A JP 2008332478A JP 2008332478 A JP2008332478 A JP 2008332478A JP 5478877 B2 JP5478877 B2 JP 5478877B2
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- Japan
- Prior art keywords
- polishing pad
- polishing
- isocyanate
- weight
- dressing
- Prior art date
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Polyurethanes Or Polyureas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
図1にカットレートを示す。
3 スラリー
5 半導体ウェハ
Claims (3)
- 発泡ポリウレタンの研磨層を有する研磨パッドであって、
前記発泡ポリウレタンが、エポキシ樹脂とイソシアネート基含有化合物と活性水素含有化合物とを発泡硬化させてなることを特徴とする研磨パッド。 - イソシアネート基含有化合物が、芳香族イソシアネート系のイソシアネート末端プレポリマーである請求項1に記載の研磨パッド。
- 前記発泡ポリウレタンは、密度が0.4〜0.9g/cm3であって、ショアA硬度が80〜97である請求項1または2に記載の研磨パッド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008332478A JP5478877B2 (ja) | 2008-12-26 | 2008-12-26 | 研磨パッド |
Applications Claiming Priority (1)
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JP2008332478A JP5478877B2 (ja) | 2008-12-26 | 2008-12-26 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
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JP2010149260A JP2010149260A (ja) | 2010-07-08 |
JP5478877B2 true JP5478877B2 (ja) | 2014-04-23 |
Family
ID=42568925
Family Applications (1)
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JP2008332478A Active JP5478877B2 (ja) | 2008-12-26 | 2008-12-26 | 研磨パッド |
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JP (1) | JP5478877B2 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5735777B2 (ja) * | 2010-10-13 | 2015-06-17 | 九重電気株式会社 | 研磨パッド |
JPWO2012137531A1 (ja) * | 2011-04-04 | 2014-07-28 | Dic株式会社 | 研磨パッド用ウレタン樹脂組成物、研磨パッド及びその製造方法 |
JP5970636B2 (ja) * | 2012-06-06 | 2016-08-17 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 研磨パッド |
US10907021B2 (en) * | 2013-07-26 | 2021-02-02 | Basf Se | Isocyanate-epoxy-foam system |
EP3152044A4 (en) | 2014-06-04 | 2017-12-20 | Bright Lite Structures LlC | Composite structure exhibiting energy absorption and/or including a defect free surface |
CN107614766B (zh) | 2015-04-03 | 2021-04-27 | 明亮简化结构有限责任公司 | 用于可控制地切割纤维的装置及相关方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02232173A (ja) * | 1989-03-02 | 1990-09-14 | Rodeele Nitta Kk | 研磨パッド |
JP3570681B2 (ja) * | 2001-12-10 | 2004-09-29 | 東洋ゴム工業株式会社 | 研磨パッド |
JP2005169578A (ja) * | 2003-12-12 | 2005-06-30 | Toyo Tire & Rubber Co Ltd | Cmp用研磨パッドの製造方法 |
IN2014CN03733A (ja) * | 2004-09-05 | 2015-10-16 | Friction Control Solutions Ltd |
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2008
- 2008-12-26 JP JP2008332478A patent/JP5478877B2/ja active Active
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JP2010149260A (ja) | 2010-07-08 |
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