JP5453787B2 - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
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- JP5453787B2 JP5453787B2 JP2008308166A JP2008308166A JP5453787B2 JP 5453787 B2 JP5453787 B2 JP 5453787B2 JP 2008308166 A JP2008308166 A JP 2008308166A JP 2008308166 A JP2008308166 A JP 2008308166A JP 5453787 B2 JP5453787 B2 JP 5453787B2
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- Prior art keywords
- acoustic wave
- surface acoustic
- comb
- wave device
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010897 surface acoustic wave method Methods 0.000 title claims description 54
- 239000000758 substrate Substances 0.000 claims description 35
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- 238000007789 sealing Methods 0.000 claims description 16
- 230000005284 excitation Effects 0.000 claims description 8
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- 230000003071 parasitic effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
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- 230000017525 heat dissipation Effects 0.000 description 4
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- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
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- 230000020169 heat generation Effects 0.000 description 1
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- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
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- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
以下、実施の形態1を用いて、本発明の特に請求項1に記載の発明について説明する。なお、上述した従来の弾性表面波デバイスと同様の構成については同じ符号を付して説明する。
以下、実施の形態2を用いて、本発明の特に請求項2に記載の発明について説明する。
以下、実施の形態3を用いて、本発明の特に請求項3に記載の発明について説明する。
2 櫛形電極
3 パッド電極
4 配線
5 側壁
6 天板
8 励振空間
9 封止樹脂
11 外部端子
12 柱状部
13 非導体部
Claims (3)
- 圧電基板と、
前記圧電基板の表面に設けられた櫛形電極と、
前記櫛形電極に接続された配線と、
前記圧電基板の上に設けられ、かつ前記櫛形電極を囲む側壁と、
前記側壁の上に設けられ、かつ前記櫛形電極の励振空間を覆う天板と、を備え、
前記側壁の内側に前記側壁と非接触になるように、前記圧電基板側から前記天板側に至る柱状部を設け、
前記柱状部は、前記圧電基板に近づくにつれて広がるようなテーパー形状を有する弾性表面波デバイス。 - 前記弾性表面波デバイスは弾性表面波デュプレクサである請求項1に記載の弾性表面波デバイス。
- 前記天板および前記圧電基板の上を覆う封止樹脂を設けた請求項1に記載の弾性表面波デバイス。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008308166A JP5453787B2 (ja) | 2008-12-03 | 2008-12-03 | 弾性表面波デバイス |
Applications Claiming Priority (1)
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---|---|---|---|
JP2008308166A JP5453787B2 (ja) | 2008-12-03 | 2008-12-03 | 弾性表面波デバイス |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013169514A Division JP5695145B2 (ja) | 2013-08-19 | 2013-08-19 | 弾性表面波デバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010135959A JP2010135959A (ja) | 2010-06-17 |
JP5453787B2 true JP5453787B2 (ja) | 2014-03-26 |
Family
ID=42346820
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008308166A Active JP5453787B2 (ja) | 2008-12-03 | 2008-12-03 | 弾性表面波デバイス |
Country Status (1)
Country | Link |
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JP (1) | JP5453787B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5654303B2 (ja) * | 2010-09-21 | 2015-01-14 | 太陽誘電株式会社 | 電子部品およびその製造方法、並びに電子部品を備えた電子デバイス |
JP5569587B2 (ja) | 2010-12-16 | 2014-08-13 | パナソニック株式会社 | 弾性波装置 |
JP5823219B2 (ja) * | 2011-09-08 | 2015-11-25 | 太陽誘電株式会社 | 電子部品 |
JP5815365B2 (ja) * | 2011-10-20 | 2015-11-17 | 京セラ株式会社 | 弾性波装置、電子部品および弾性波装置の製造方法 |
JP5839567B2 (ja) * | 2012-02-01 | 2016-01-06 | 株式会社神戸製鋼所 | 溶剤分離方法 |
JP2014192782A (ja) * | 2013-03-28 | 2014-10-06 | Japan Radio Co Ltd | 封止部材、封止補助部材、封止方法および封止補助方法 |
WO2016017307A1 (ja) | 2014-07-28 | 2016-02-04 | 株式会社村田製作所 | ラダー型フィルタ |
CN106537772B (zh) * | 2014-07-31 | 2018-04-03 | 天工滤波方案日本有限公司 | 声波器件 |
JP7370542B2 (ja) * | 2021-11-25 | 2023-10-30 | 三安ジャパンテクノロジー株式会社 | 弾性波デバイス |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0759231B1 (de) * | 1994-05-02 | 1998-12-23 | SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG | Verkapselung für elektronische bauelemente |
JP2002261582A (ja) * | 2000-10-04 | 2002-09-13 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイスおよびその製造方法ならびにそれを用いた回路モジュール |
JP2004274574A (ja) * | 2003-03-11 | 2004-09-30 | Toyo Commun Equip Co Ltd | 弾性表面波装置とその製造方法 |
JP4872589B2 (ja) * | 2006-02-07 | 2012-02-08 | パナソニック株式会社 | 電子部品パッケージ、電子部品およびその製造方法 |
JP4771847B2 (ja) * | 2006-03-28 | 2011-09-14 | 京セラ株式会社 | 弾性表面波装置 |
JP2007325013A (ja) * | 2006-06-01 | 2007-12-13 | Alps Electric Co Ltd | 表面弾性波装置の製造方法及び表面弾性波装置 |
JP4889426B2 (ja) * | 2006-09-27 | 2012-03-07 | 京セラ株式会社 | 弾性表面波装置、フィルタ装置および通信装置 |
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- 2008-12-03 JP JP2008308166A patent/JP5453787B2/ja active Active
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