JP5695145B2 - 弾性表面波デバイス - Google Patents
弾性表面波デバイス Download PDFInfo
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- JP5695145B2 JP5695145B2 JP2013169514A JP2013169514A JP5695145B2 JP 5695145 B2 JP5695145 B2 JP 5695145B2 JP 2013169514 A JP2013169514 A JP 2013169514A JP 2013169514 A JP2013169514 A JP 2013169514A JP 5695145 B2 JP5695145 B2 JP 5695145B2
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- Prior art keywords
- acoustic wave
- surface acoustic
- wave device
- comb
- electrode
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- 238000010897 surface acoustic wave method Methods 0.000 title claims description 56
- 239000000758 substrate Substances 0.000 claims description 33
- 239000000615 nonconductor Substances 0.000 claims description 21
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 12
- 230000005284 excitation Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000003071 parasitic effect Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
以下、実施の形態1を用いて、本発明の特に請求項1に記載の発明について説明する。なお、上述した従来の弾性表面波デバイスと同様の構成については同じ符号を付して説明する。
以下、実施の形態2を用いて、本発明の特に請求項2に記載の発明について説明する。
以下、実施の形態3を用いて、本発明の特に請求項3に記載の発明について説明する。
2 櫛形電極
3 パッド電極
4 配線
5 側壁
6 天板
8 励振空間
9 封止樹脂
11 外部端子
12 柱状部
13 非導体部
Claims (7)
- 圧電基板と、
前記圧電基板の表面に設けられた櫛形電極と、
前記櫛形電極に接続された配線と、
前記圧電基板の上に設けられ、かつ前記櫛形電極を囲む側壁と、
前記側壁の上に設けられ、かつ前記櫛形電極の励振空間を覆う天板とを備え、
前記配線の中に非導体部を設け、
前記側壁の内側に前記側壁と非接触になるように、前記非導体部の上に前記圧電基板側から前記天板側に至る柱状部を設けた弾性表面波デバイス。 - 前記柱状部の下部外周端は前記配線にかかるように設けた請求項1記載の弾性表面波デバイス。
- 前記櫛形電極および配線は送信回路または受信回路を構成する請求項1または2に記載の弾性表面波デバイス。
- 前記送信回路または受信回路の信号ライン上の前記櫛形電極間を繋ぐ前記配線の1つの中に複数個の前記非導体部を設けた請求項3に記載の弾性表面波デバイス。
- 前記複数個の非導体部のそれぞれに前記柱状部を設けた請求項4に記載の弾性表面波デバイス。
- 前記弾性表面波デバイスは弾性表面波デュプレクサである請求項1から5のいずれか一項に記載の弾性表面波デバイス。
- 前記天板および前記圧電基板の上を覆う封止樹脂を設けた請求項1から5のいずれか一項に記載の弾性表面波デバイス。
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JP2013169514A JP5695145B2 (ja) | 2013-08-19 | 2013-08-19 | 弾性表面波デバイス |
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JP2013169514A JP5695145B2 (ja) | 2013-08-19 | 2013-08-19 | 弾性表面波デバイス |
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JP2008308166A Division JP5453787B2 (ja) | 2008-12-03 | 2008-12-03 | 弾性表面波デバイス |
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JP2015020810A Division JP5921733B2 (ja) | 2015-02-05 | 2015-02-05 | 弾性表面波デバイスを製造する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013232992A JP2013232992A (ja) | 2013-11-14 |
JP5695145B2 true JP5695145B2 (ja) | 2015-04-01 |
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JP2013169514A Active JP5695145B2 (ja) | 2013-08-19 | 2013-08-19 | 弾性表面波デバイス |
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JP (1) | JP5695145B2 (ja) |
Cited By (1)
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---|---|---|---|---|
CN108432133A (zh) * | 2015-12-25 | 2018-08-21 | 株式会社村田制作所 | 高频模块 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015156626A (ja) * | 2014-01-16 | 2015-08-27 | 京セラ株式会社 | 弾性波素子、分波器および通信装置 |
JP6296154B2 (ja) * | 2014-05-20 | 2018-03-20 | 株式会社村田製作所 | 弾性波デバイス及びその製造方法 |
JPWO2015190166A1 (ja) * | 2014-06-12 | 2017-04-20 | 株式会社村田製作所 | 弾性表面波装置 |
WO2016017307A1 (ja) | 2014-07-28 | 2016-02-04 | 株式会社村田製作所 | ラダー型フィルタ |
CN106537772B (zh) * | 2014-07-31 | 2018-04-03 | 天工滤波方案日本有限公司 | 声波器件 |
JP6350510B2 (ja) * | 2015-12-24 | 2018-07-04 | 株式会社村田製作所 | 弾性表面波装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0759231B1 (de) * | 1994-05-02 | 1998-12-23 | SIEMENS MATSUSHITA COMPONENTS GmbH & CO. KG | Verkapselung für elektronische bauelemente |
JP4889426B2 (ja) * | 2006-09-27 | 2012-03-07 | 京セラ株式会社 | 弾性表面波装置、フィルタ装置および通信装置 |
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CN108432133A (zh) * | 2015-12-25 | 2018-08-21 | 株式会社村田制作所 | 高频模块 |
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