JP5451957B2

JP5451957B2 - Infrared detector

Info

Publication number: JP5451957B2
Application number: JP2006047474A
Authority: JP
Inventors: 貞幸角; 尚之西川; 良谷口; 智宏上津
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2006-02-23
Filing date: 2006-02-23
Publication date: 2014-03-26
Anticipated expiration: 2026-02-23
Also published as: JP2007225455A

Description

本発明は人体等から放射される赤外線を焦電素子で検出するようにした赤外線検出器に関するものである。 The present invention relates to an infrared detector that detects infrared rays emitted from a human body or the like with a pyroelectric element.

一般に、人体を赤外線の変化量で検出する赤外線検出素子には、焦電素子と呼ばれるものが多く使用されている。このような焦電素子を用いた赤外線検出器は、防犯用の進入検知の他、照明などの負荷制御用として使われている。この赤外線検出器としては例えば図６に示すように人体の動作により発生した赤外線を、レンズ１００により焦電素子Ｘの受光部に集光させ、赤外線の変化に応じて発生する焦電素子Ｘの分極による信号を電流電圧変換回路１０１で電圧信号に変換した後、バンドパスアンプ１０２で所定の周波数帯域を選択的に増幅し、予め閾値を設定しているウィンドコンパレータ１０３から”Ｈ”、”Ｌ”レベルの検出信号を出力するタイプのものがあり、このウィンドコンパレータ１０３から出力される検出信号が負荷制御に用いられるのである。 In general, a so-called pyroelectric element is often used as an infrared detecting element for detecting a human body by the amount of change in infrared rays. Infrared detectors using such pyroelectric elements are used for load control such as lighting in addition to detection of security entry. As this infrared detector, for example, as shown in FIG. 6, the infrared rays generated by the movement of the human body are condensed on the light receiving portion of the pyroelectric element X by the lens 100, and the pyroelectric element X generated according to the change of the infrared rays. A signal due to polarization is converted into a voltage signal by the current-voltage conversion circuit 101, and then a predetermined frequency band is selectively amplified by the band-pass amplifier 102, and "H", "L" There is a type which outputs a "level detection signal, and the detection signal output from the window comparator 103 is used for load control.

ところで、従来の赤外線検出器には図７（ａ）に示すように焦電素子Ｘの両端部を回路基板１０４上に設けた電子回路素子からなる凸状支持部１０５、１０５間に橋渡すように固定して回路基板１０４から焦電素子Ｘを浮かして焦電素子Ｘの受光面と背方の回路基板１０４との間に熱絶縁用の空間を設け、焦電素子Ｘが赤外線を受光したときに赤外線のエネルギが逃げないようにし、焦電素子Ｘの感度を高めているものがある。そして焦電素子Ｘの電荷は非常に微小なため、非常に大きな増幅をしなければならず、その影響で、焦電素子Ｘの出力にわずかでもノイズが入ると、後段のバンドパスアンプ１０２でノイズも増幅され、本来の信号とノイズとの区別が困難となる。そこで図７（ａ）に示すように金属製のキャップ（ＣＡＮ）１０６と、ステム１０７からなる容器の中に焦電素子Ｘ及び回路基板１０４を封止してシールドを図ったパッケージ構造によって、外来ノイズを遮断している（例えば特許文献１）。尚図７（ａ）中１０８は出力用の端子ピン、１０９はキャップ１０６の赤外線通過窓で、この赤外線通過窓１０９には所定の周波数域の赤外線のみを通過させるバンドパス型の光学フィルタ１１０が装着されている。 By the way, in the conventional infrared detector, as shown in FIG. 7A, both ends of the pyroelectric element X are bridged between the convex support portions 105 and 105 made of electronic circuit elements provided on the circuit board 104. The pyroelectric element X is floated from the circuit board 104 and a space for thermal insulation is provided between the light receiving surface of the pyroelectric element X and the circuit board 104 on the back, and the pyroelectric element X receives infrared rays. In some cases, infrared energy does not escape and the sensitivity of the pyroelectric element X is increased. Since the charge of the pyroelectric element X is very small, very large amplification must be performed. If a slight noise enters the output of the pyroelectric element X due to the influence, the subsequent band-pass amplifier 102 Noise is also amplified, making it difficult to distinguish the original signal from noise. Therefore, as shown in FIG. 7A, a package structure in which the pyroelectric element X and the circuit board 104 are sealed in a container made of a metal cap (CAN) 106 and a stem 107 to provide a shield is provided. Noise is cut off (for example, Patent Document 1). In FIG. 7A, reference numeral 108 denotes an output terminal pin, 109 denotes an infrared passage window of the cap 106, and the infrared passage window 109 has a band-pass optical filter 110 that allows only infrared rays in a predetermined frequency range to pass. It is installed.

ところで、特許文献１に開示されているパッケージ構造の赤外線検出器は、内部に上述の電流電圧変換回路のみを設ける構成であるため、図７（ｂ）のような構成をとっており、プリント板１１１上に図７（ｂ）に示すキャップ１０６とステム１０７からなる容器内に焦電素子Ｘを内蔵した赤外線検出器のほか、レンズ１１２、更にコンデンサや抵抗、ＩＣのチップなどの外付け電子回路素子１１３が実装され、上述の光学フィルタやウィンドウコンパレータ、更にはタイマ、出力アンプが付加されて用いられるのが一般的である。 By the way, the infrared detector having the package structure disclosed in Patent Document 1 has a configuration as shown in FIG. 7B because only the above-described current-voltage conversion circuit is provided therein. In addition to an infrared detector in which a pyroelectric element X is built in a container made up of a cap 106 and a stem 107 shown in FIG. 7B on 111, an external electronic circuit such as a lens 112, a capacitor, a resistor, an IC chip, etc. In general, the element 113 is mounted, and the above-described optical filter, window comparator, timer, and output amplifier are added.

一方、図８（ａ）〜（ｃ）に示すように樹脂成型品で製作される３次元回路ブロック（ＭＩＤ基板）２００に、焦電素子Ｘとバンドパスアンプやとウィンドウコンパレータを構成する電子回路素子２０１を実装し、キャップ１０６とステム１０７からなる容器内に内蔵して封止することにより、小型化を図った赤外線検出器が提供されている（例えば特許文献２）。この赤外線検出器に用いる３次元回路ブロック２００は、表立面と裏立面とを形成した縦方向に起立する縦長のブロックとなっており、立面には電子回路素子２０１を実装し、上部には焦電素子Ｘの熱絶縁をとるための空間を作る凹部２０２を一体形成し、凹部２０２の両端間に焦電素子Ｘを橋渡ししてある。
特開平５−３３２８２９号公報（図１、段落番号００１５〜１００６）特許第３２１１０７４号公報（図６〜図８及び段落番号００１８〜００２１） On the other hand, as shown in FIGS. 8A to 8C, an electronic circuit constituting a pyroelectric element X, a band-pass amplifier, and a window comparator is added to a three-dimensional circuit block (MID substrate) 200 made of a resin molded product. There has been provided an infrared detector that is miniaturized by mounting the element 201 and enclosing and sealing it in a container composed of a cap 106 and a stem 107 (for example, Patent Document 2). The three-dimensional circuit block 200 used for the infrared detector is a vertically long block that has a vertical surface and a vertical surface, and has an electronic circuit element 201 mounted on the vertical surface. In FIG. 2, a recess 202 for forming a space for thermal insulation of the pyroelectric element X is integrally formed, and the pyroelectric element X is bridged between both ends of the recess 202.
JP-A-5-332829 (FIG. 1, paragraph numbers 0015 to 1006) Japanese Patent No. 3211074 (FIGS. 6 to 8 and paragraph numbers 0018 to 0021)

上述の特許文献１に開示されているような赤外線検出器の場合、焦電素子Ｘが赤外線を受けたときに赤外線エネルギが逃げないようにするために焦電素子Ｘの受光面を回路基板１０４より浮かす支持部１０５を設けているが、この支持部１０５が回路基板１０４とは別部品であるため、別途部品実装工程が必要となりコストアップの要因となっていた。また別部品として支持部１０５を設ける場合、取り付け誤差により支持部１０５の高さが変わり、焦電素子Ｘの熱絶縁の効果にばらつきが発生するなどの問題があった。また特許文献１の赤外線検出器の場合、図７（ｂ）のような外付け回路部が必要で、そのため電子回路素子１１３を大きなプリント基板１１１に実装する構成であるため回路規模が非常に大きくなるという問題があり、昨今の小型化・薄型化の要請には答えられないという問題があり、また回路部品が外付けになると電磁ノイズの影響を受けやすくなり、ノイズ環境が悪いところでは、誤動作の要因となっていた。これを防ぐために、外付け回路部に大きなシールド板を取り付けることが必要となるという問題もあった。 In the case of the infrared detector disclosed in the above-mentioned Patent Document 1, the light receiving surface of the pyroelectric element X is arranged on the circuit board 104 so that the infrared energy does not escape when the pyroelectric element X receives the infrared light. Although the support part 105 which floats more is provided, since this support part 105 is a separate component from the circuit board 104, a separate component mounting process is required, which causes a cost increase. Further, when the support part 105 is provided as a separate part, there is a problem that the height of the support part 105 changes due to an attachment error, and the thermal insulation effect of the pyroelectric element X varies. Further, in the case of the infrared detector of Patent Document 1, an external circuit unit as shown in FIG. 7B is necessary, and therefore the circuit scale is very large because the electronic circuit element 113 is mounted on a large printed board 111. There is a problem that it is not possible to respond to the recent demand for miniaturization and thinning, and it becomes easy to be affected by electromagnetic noise when circuit parts are externally attached. It was a factor. In order to prevent this, there is a problem that it is necessary to attach a large shield plate to the external circuit portion.

一方特許文献２に開示されている赤外線検出器のように３次元回路ブロック２００を用いたものは、特許文献１に開示されている赤外線検出器の問題点を或る程度解決できる。 On the other hand, the one using the three-dimensional circuit block 200 like the infrared detector disclosed in Patent Document 2 can solve the problems of the infrared detector disclosed in Patent Document 1 to some extent.

すなわち３次元回路ブロック２００に直接焦電素子Ｘを浮かす凹部２０２を形成するためため、部品点数削減や低コスト化が可能となり、また電子回路素子２０１を金属製のキャップとステムからなる容器に内蔵するＣＡＮパッケージとすることで、小型化が可能となる上に、バンドパスアンプやウィンドコンパレータをＩＣ化することで回路部を小型化することも可能である。また焦電素子Ｘとバンドパスアンプの入力部までの距離を短くすることができるため、プリント基板による外付け部品で増幅する方法より外来ノイズが入りにくくなり、ノイズに強い構成となる。更に焦電素子Ｘと回路部全体を金属製キャップとステムからなる容器内に内蔵してシールドすることにより、外来ノイズに非常に強い構成が実現できるという利点がある。 That is, since the concave portion 202 for directly floating the pyroelectric element X is formed in the three-dimensional circuit block 200, the number of parts can be reduced and the cost can be reduced, and the electronic circuit element 201 is built in a container made of a metal cap and stem. By using the CAN package, it is possible to reduce the size, and it is also possible to reduce the size of the circuit unit by making the bandpass amplifier and the window comparator into an IC. In addition, since the distance between the pyroelectric element X and the input part of the bandpass amplifier can be shortened, external noise is less likely to enter than a method of amplifying with an external component using a printed circuit board, and the configuration is strong against noise. Furthermore, by incorporating and shielding the pyroelectric element X and the entire circuit unit in a container made of a metal cap and stem, there is an advantage that a configuration extremely resistant to external noise can be realized.

しかしながら、この特許文献２に開示されている赤外検出器では、３次元回路ブロック２００が縦長で起立して表立面と裏立面とを形成した回路部に電子部品やＩＣを実装しているため、パッケージが縦長になるのは避けられない。 However, in the infrared detector disclosed in Patent Document 2, an electronic component or an IC is mounted on a circuit portion in which the three-dimensional circuit block 200 stands vertically and forms a front surface and a back surface. Therefore, it is inevitable that the package becomes vertically long.

そのため、この特許文献２に開示されている赤外線検出器を取り付ける機器の厚みに制限が発生し薄型化が困難になるなどの、更なる小型化、薄型化の要請には応えられなかった。 For this reason, it has not been possible to meet the demand for further miniaturization and thinning, such as a limitation on the thickness of a device to which the infrared detector disclosed in Patent Document 2 is restricted, making it difficult to reduce the thickness.

本発明は、上述の点に鑑みて為されたものであって、その目的とするところは薄型化が可能で且つ生産性を向上させた赤外線検出器を提供することにある。 The present invention has been made in view of the above points, and an object of the present invention is to provide an infrared detector that can be thinned and has improved productivity.

上述の目的を達成するために、請求項１の発明では、ステムと、該ステム上に被着するキャップとからなる容器内部に、赤外線検知素子と、ＩＣ素子を含む電子回路素子とを実装するとともに実装する一部の電子回路素子を内蔵した基板部を収納するものであって、前記基板部は、金属箔により形成したシールド層を片面又は両面に形成した基板を有し、
前記ステムは前記基板部に向かって端子ピンを突出させ、前記基板部は前記端子ピンを下面から上面へ貫挿させる貫通孔を設けるとともに前記端子ピンを前記基板部に接着固定し且つ電気接続するための導電性接着剤を充填する接着剤保持部は前記貫通孔の開口端周辺の基板部面に形成した凹部により構成され、前記凹部の底部は前記赤外線検知素子よりも下方に位置することを特徴とする。 To achieve the above object, according to the first aspect of the present invention, an infrared detection element and an electronic circuit element including an IC element are mounted inside a container including a stem and a cap attached to the stem. And a board part containing a part of the electronic circuit element to be mounted together, the board part having a board formed with a shield layer formed of metal foil on one side or both sides,
The stem projects terminal pins toward the substrate portion, and the substrate portion is provided with a through hole through which the terminal pin is inserted from the lower surface to the upper surface, and the terminal pins are bonded and fixed to the substrate portion and electrically connected. The adhesive holding portion for filling the conductive adhesive is formed by a concave portion formed in the substrate portion surface around the opening end of the through hole, and the bottom portion of the concave portion is positioned below the infrared detection element. Features.

請求項１の発明によれば、実装する一部の電子回路素子を内蔵した基板部を用いているため、赤外線検出器全体の薄型化が可能で、しかも基板部の上面側に設けた接着剤保持部に充填される導電性接着剤によって端子ピンを基板部に接着するとともに基板部の回路との間で電気的に接続することで、基板部の回路からの出力を端子ピン側に取り出すことが可能となり、その上少なくとも貫通孔の上側開口端周辺の基板部面に接着剤保持部を設けて端子ピンの接着固定と導電を図る構成であるため、端子ピンの欠損などの不良検出を目視で行うことができ、そのため生産性の向上が図れ、結果コスト上昇の抑制も図れる。また、端子ピンと基板部との接着固定位置を低くすることができ、その結果赤外線検出器全体の一層の薄型化を可能とする。 According to the first aspect of the present invention, since the substrate portion containing a part of the electronic circuit element to be mounted is used, the entire infrared detector can be thinned, and the adhesive provided on the upper surface side of the substrate portion The terminal pin is bonded to the board part by the conductive adhesive filled in the holding part, and the output from the circuit of the board part is taken out to the terminal pin side by being electrically connected to the circuit of the board part. In addition, an adhesive holding part is provided on the substrate surface around at least the upper opening end of the through hole so that the terminal pin can be bonded and fixed and electrically conductive. As a result, productivity can be improved and, as a result, cost increases can be suppressed . In addition, the bonding and fixing position between the terminal pin and the substrate portion can be lowered, and as a result, the entire infrared detector can be further reduced in thickness .

上述の目的を達成するために、請求項２の発明では、ステムと、該ステム上に被着するキャップとからなる容器内部に、赤外線検知素子とＩＣ素子を含む電子回路素子とを実装するとともに実装する一部の電子回路素子を内蔵した基板部を収納するものであって、前記基板部は、金属箔により形成したシールド層を片面又は両面に形成した基板を有し、前記ステムは前記基板部に向かって端子ピンを突出させ、前記基板部は前記端子ピンを下面から上面へ貫挿させる貫通孔を設けるとともに前記端子ピンを前記基板部に接着固定し且つ電気接続するための導電性接着剤を充填する接着剤保持部は前記貫通孔の開口端を囲繞するように基板部面に立設された枠部により構成され、前記枠部の底部は前記赤外線検知素子よりも下方に位置することを特徴とする。
In order to achieve the above-mentioned object, in the invention of claim 2, an electronic circuit element including an infrared detection element and an IC element is mounted inside a container including a stem and a cap attached to the stem. A substrate portion containing a part of electronic circuit elements to be mounted is accommodated, wherein the substrate portion has a substrate formed with a shield layer formed of metal foil on one side or both sides, and the stem is the substrate The terminal pin protrudes toward the portion, and the substrate portion is provided with a through-hole through which the terminal pin is inserted from the lower surface to the upper surface, and the terminal pin is bonded and fixed to the substrate portion and electrically conductively bonded. The adhesive holding portion for filling the agent is constituted by a frame portion standing on the surface of the substrate portion so as to surround the open end of the through hole, and the bottom portion of the frame portion is located below the infrared detection element. about And features.

請求項２の発明によれば、実装する一部の電子回路素子を内蔵した基板部を用いているため、赤外線検出器全体の薄型化が可能で、しかも基板部の上面側に設けた接着剤保持部に充填される導電性接着剤によって端子ピンを基板部に接着するとともに基板部の回路との間で電気的に接続することで、基板部の回路からの出力を端子ピン側に取り出すことが可能となり、その上少なくとも貫通孔の上側開口端周辺の基板部面に接着剤保持部を設けて端子ピンの接着固定と導電を図る構成であるため、端子ピンの欠損などの不良検出を目視で行うことができ、そのため生産性の向上が図れ、結果コスト上昇の抑制も図れる。また、導電性接着剤を塗布する範囲を容易に規定できるため、導電性接着剤の塗布量の流動管理幅を広くすることができる上に導電性接着剤の漏れ防止も図れ、その結果生産性の一層の向上とコスト抑制とが可能となる。 According to the second aspect of the present invention, since the substrate portion containing a part of the electronic circuit element to be mounted is used, the entire infrared detector can be thinned, and the adhesive provided on the upper surface side of the substrate portion The terminal pin is bonded to the board part by the conductive adhesive filled in the holding part, and the output from the circuit of the board part is taken out to the terminal pin side by being electrically connected to the circuit of the board part. In addition, an adhesive holding part is provided on the substrate surface around at least the upper opening end of the through hole so that the terminal pin can be bonded and fixed and electrically conductive. As a result, productivity can be improved and, as a result, cost increases can be suppressed . In addition, since the range where the conductive adhesive is applied can be easily defined, the flow control range of the applied amount of the conductive adhesive can be widened and the leakage of the conductive adhesive can be prevented, resulting in productivity. Can be further improved and cost can be reduced .

請求項３の発明では、請求項１又は２の発明では、前記端子ピンの周部には前記基板部の貫通孔の内径寸法よりも大きく外方へ突出させた基板部下面支持用オフセット部を設けていることを特徴とする。 In the invention of claim 3, in the invention of claim 1 or 2 , the peripheral portion of the terminal pin is provided with an offset portion for supporting the lower surface of the substrate portion that protrudes outward larger than the inner diameter dimension of the through hole of the substrate portion. It is provided.

請求項３の発明によれば、端子ピンの基板部下面支持用オフセット部で基板部下面を支持することができ、そのため端子ピンの最上端と基板部上面との位置関係の精度を高め、端子ピンとキャップとの接触を避けるためのキャップ内の高さ方向の余裕分を低く見積もることができ、その結果赤外線検出器全体の一層の薄型化を可能とし、しかも基板部下面とステムとの間にスペーサを設けずとも精度良く絶縁状態を保つことが可能となり、部材コストの削減と更なる薄型化も可能となる。 According to the invention of claim 3, the substrate portion lower surface can be supported by the substrate portion lower surface supporting offset portion of the terminal pin, so that the accuracy of the positional relationship between the uppermost end of the terminal pin and the substrate portion upper surface is improved, and the terminal The margin in the height direction in the cap for avoiding the contact between the pin and the cap can be estimated low, and as a result, the entire infrared detector can be further reduced in thickness, and between the bottom surface of the substrate portion and the stem. Even without providing a spacer, it is possible to maintain an insulating state with high accuracy, and it is possible to reduce the member cost and further reduce the thickness.

本発明は、実装する一部の電子回路素子を内蔵した基板部を用いるため、赤外線検出器全体の薄型化が可能で、しかも基板部の上面側に設けた接着剤保持部に充填される導電性接着剤によって端子ピンを基板部に接着するとともに基板部の回路との間で電気的に接続することで、基板部の回路からの出力を端子ピン側に取り出すことが可能となり、その上少なくとも貫通孔の上側開口端周辺の基板部面に接着剤保持部を設けて端子ピンの接着固定と導電を図る構成であるため、端子ピンの欠損などの不良検出を目視で行うことができ、そのため生産性の向上が図れ、結果コスト上昇の抑制も図れるという効果がある。 Since the present invention uses a substrate part that incorporates some electronic circuit elements to be mounted, the entire infrared detector can be made thin, and the conductive material filled in the adhesive holding part provided on the upper surface side of the substrate part can be used. By bonding the terminal pin to the board part with a conductive adhesive and electrically connecting it to the circuit of the board part, it becomes possible to take out the output from the circuit of the board part to the terminal pin side, and at least Because it is a configuration that provides adhesive fixing and conduction of the terminal pins by providing an adhesive holding part on the substrate surface around the upper opening end of the through hole, it is possible to visually detect defects such as chipping of the terminal pins. There is an effect that productivity can be improved and the cost increase can be suppressed as a result.

以下本発明を実施形態により説明する。
（実施形態１）
本実施形態の赤外線検出器Ａは、図１（ａ）、（ｂ）及び図２（ａ）、（ｂ）に示すように円盤状の金属製のステム１と、金属製のキャップ２とからなるＣＡＮパッケージ用の容器内に、赤外線検知素子である焦電素子ＸとＩＣ素子１６やチップ状電子部品１７からなる電子回路素子を実装するとともに例えばチップ状の電子部品１７を内蔵した基板部３を収納して構成されたものである。尚焦電素子Ｘ以外の赤外線検知素子（サーモパイルや、ボローメータ）を用いても良い。 Embodiments of the present invention will be described below.
(Embodiment 1)
As shown in FIGS. 1A and 1B and FIGS. 2A and 2B, the infrared detector A of the present embodiment includes a disk-shaped metal stem 1 and a metal cap 2. In a container for a CAN package, a pyroelectric element X that is an infrared detection element and an electronic circuit element composed of an IC element 16 and a chip-shaped electronic component 17 are mounted, and for example, a substrate portion 3 that incorporates a chip-shaped electronic component 17 It is constructed by storing. An infrared detecting element (thermopile or a barometer) other than the pyroelectric element X may be used.

ステム１は中央部を周辺部より一段上方へ突出させて基板搭載部１ａを形成するとともにこの基板搭載部１ａの周部には基板搭載部１ａの面よりも低い環状のフランジ１ｂを形成している。 The stem 1 has a central portion protruding upward from the peripheral portion to form a substrate mounting portion 1a, and an annular flange 1b lower than the surface of the substrate mounting portion 1a is formed around the substrate mounting portion 1a. Yes.

キャップ２は下部が開口し、天井部の中央には光学フィルタ５を装着した矩形の赤外線通過窓４を開口しており、ステム１の基板搭載部１ａの周辺のフランジ１ｂ上にキャップ２の下端周縁に突出形成した鍔部２ａを載せて抵抗溶接等によって接合することでキャップ２はステム１上に被着されて容器を形成するとともに、容器内を封止するとともに電磁シールドを行うようになっている。 The cap 2 has an opening at the bottom, a rectangular infrared passage window 4 fitted with an optical filter 5 at the center of the ceiling, and a lower end of the cap 2 on the flange 1b around the substrate mounting portion 1a of the stem 1. The cap 2 is placed on the stem 1 to form a container by mounting a flange 2a protruding from the periphery and joined by resistance welding or the like, and the container is sealed and electromagnetic shielding is performed. ing.

赤外線通過窓４に装着する光学フィルタ５は、特定の波長域の赤外線のみを通過させるもので、外乱光の影響を低減するためのもので、人体検知の場合、おおよそ４μｍ以上の波長の光を通し、それより低い赤外線をカットするようにコーティングを施したものを用いる。 The optical filter 5 attached to the infrared passage window 4 allows only infrared rays in a specific wavelength range to pass therethrough and reduces the influence of disturbance light. In the case of human body detection, light having a wavelength of about 4 μm or more is used. Use the one that is coated so as to cut infrared rays lower than that.

基板部３は、ガラスエポキシ等から形成された回路基板７と、この回路基板７上に配置形成される樹脂層体８と、この樹脂層体８上に配置されるガラスエポキシ等から形成された基板９と、この基板９上に配置形成される樹脂層体１０とからなる多層構造の基板ユニットから構成され、樹脂層体１０、８は基板７、９に一体的に積層されるように形成される。 The substrate portion 3 is formed of a circuit board 7 formed of glass epoxy or the like, a resin layer body 8 disposed on the circuit board 7, glass epoxy disposed on the resin layer body 8, or the like. It is composed of a substrate unit having a multilayer structure composed of a substrate 9 and a resin layer body 10 disposed and formed on the substrate 9, and the resin layer bodies 10 and 8 are formed so as to be integrally laminated on the substrates 7 and 9. Is done.

基板部３の上面となる樹脂層体１０の上面中央部には凹部１１を形成しており、この凹部１１は焦電素子Ｘの検知部（受光面）を空中に浮かすことによって熱絶縁を図るためのもので、凹部１１の両側の樹脂層体１０の上面部位が焦電素子Ｘの両側を支える支持受け部を構成する。この支持受け部には焦電素子Ｘの両側の電極を接合するランド（図示せず）を設けている。 A concave portion 11 is formed at the center of the upper surface of the resin layer body 10 which becomes the upper surface of the substrate portion 3, and the concave portion 11 achieves thermal insulation by floating the detecting portion (light receiving surface) of the pyroelectric element X in the air. Therefore, the upper surface portions of the resin layer body 10 on both sides of the recess 11 constitute a support receiving portion that supports both sides of the pyroelectric element X. The support receiving portion is provided with lands (not shown) for joining the electrodes on both sides of the pyroelectric element X.

このように基板部３の上面に設けた凹部１１で焦電素子Ｘの検知部の熱絶縁を図ることで、非常に感度の高い測定を可能としている。 As described above, the insulating portion of the pyroelectric element X is thermally insulated by the concave portion 11 provided on the upper surface of the substrate portion 3, thereby enabling very sensitive measurement.

基板９は、焦電素子Ｘの出力と後段のバンドパスアンプ（図６参照）との容量結合などによる発振現象を防ぐための金属箔（例えば銅箔）により形成したシールド層（図示せず）を上面又は下面若しくは両面に形成している。尚銅箔や金属板層のみでシールド層を形成しても勿論良い。また焦電素子Ｘの増幅部で余り大きく増幅しない場合は、容量結合などによる発振現象が起こりにくいため、シールド層を設けなくても良いため基板９を省略することができる。 The substrate 9 is a shield layer (not shown) formed of a metal foil (for example, copper foil) for preventing an oscillation phenomenon caused by capacitive coupling between the output of the pyroelectric element X and a subsequent bandpass amplifier (see FIG. 6). Are formed on the upper surface, lower surface or both surfaces. Of course, the shield layer may be formed only of copper foil or a metal plate layer. In addition, when the amplifying portion of the pyroelectric element X does not amplify too much, an oscillation phenomenon due to capacitive coupling or the like hardly occurs. Therefore, the substrate 9 can be omitted because it is not necessary to provide a shield layer.

最下層となる回路基板７は図１に示すように下面側に増幅器（図６参照）やウィンドウコンパレータ（図６参照）を構成するＩＣ素子１６を実装し、上面には図２（ｅ）に示すようにチップ状電子部品１７を実装する面とし、夫々の面にはこれら電子回路素子を接続することで赤外線検出器として必要な回路部を構成するための回路パターン（図示せず）を形成している。そしてチップ状電子部品１７をリフロー半田により回路パターンに接続実装し、ＩＣ素子１６をフリップチップ（或いはワイヤボンディング）により回路パターンに実装している。 As shown in FIG. 1, an IC element 16 constituting an amplifier (see FIG. 6) and a window comparator (see FIG. 6) is mounted on the lower surface of the circuit board 7 which is the lowest layer, and the upper surface is shown in FIG. 2 (e). As shown in the figure, the surface on which the chip-like electronic component 17 is mounted is formed, and a circuit pattern (not shown) for forming a circuit unit necessary as an infrared detector is formed on each surface by connecting these electronic circuit elements. doing. The chip-like electronic component 17 is connected and mounted on the circuit pattern by reflow soldering, and the IC element 16 is mounted on the circuit pattern by flip chip (or wire bonding).

回路基板７の上部と基板９との間に配置形成される樹脂層体８は回路基板７の上面側に実装された電子部品１７を内蔵する（埋め込む）ことで多層基板ユニット構造である基板部３全体の薄型化を図っている。 The resin layer body 8 arranged and formed between the upper part of the circuit board 7 and the board 9 incorporates (embeds) an electronic component 17 mounted on the upper surface side of the circuit board 7 so as to have a multilayer board unit structure. The whole 3 is made thin.

上述のように構成される回路基板７、樹脂層体８、基板９、樹脂層体１０が積層されて多層の基板部３が構成されることになり、焦電素子Ｘの出力は基板部３の上面側から貫通させ、内面に導電メッキを施したスルーホール（図示せず）を介してＩＣ素子１６及び電子部品１７から構成される回路部に電気的に接続され、また上述のシールド層が所定の電位部位（例えばグランド電位）に接続されることになる。 The circuit board 7, the resin layer body 8, the substrate 9, and the resin layer body 10 configured as described above are laminated to form a multilayer substrate portion 3, and the output of the pyroelectric element X is the substrate portion 3. Is electrically connected to a circuit portion composed of the IC element 16 and the electronic component 17 through a through hole (not shown) having a conductive plating on the inner surface. It is connected to a predetermined potential site (for example, ground potential).

また基板部３は、ステム１に突出させてある３本の端子ピン１２に夫々対応させた貫通孔１８を下面から上面に形成するとともに、夫々の貫通孔１８の上側開口端周辺には端子ピン１２を導電性接着剤によって電気的に接続するとともに固定する電極等の接続部１９を形成してある。 Further, the substrate portion 3 is formed with through holes 18 corresponding to the three terminal pins 12 projecting from the stem 1 from the lower surface to the upper surface, and terminal pins around the upper opening end of each through hole 18. A connecting portion 19 such as an electrode for electrically connecting and fixing 12 with a conductive adhesive is formed.

ここで容器をキャップ２とで構成するステム１は金属製（ＳＰＣ、コバールなど）であって、上述したように中央部に基板搭載部１ａを、その周部にフランジ１ｂを形成している。そして基板搭載部１には周方向に所定間隔を開けた位置で３本の端子ピン１２を貫通させており、その３本の内の端子ピン１２の内、グランド電位に接続する端子ピン１２は基板搭載部１ａを直接貫通し、基板搭載部１の下面側において半田１３により貫通部位が封止される形でステム１に固定保持され、その他の端子ピン１２は基板搭載部１ａに貫通させた孔１ｃを埋める形で設けたガラス等の絶縁材１４にインサートされることでステム１に固定保持されている。 Here, the stem 1 that constitutes the container with the cap 2 is made of metal (SPC, Kovar, etc.), and as described above, the substrate mounting portion 1a is formed in the central portion and the flange 1b is formed in the peripheral portion thereof. Then, three terminal pins 12 are passed through the substrate mounting portion 1 at predetermined intervals in the circumferential direction, and among the three terminal pins 12, the terminal pins 12 connected to the ground potential are The board mounting portion 1a is directly passed through, and the penetration portion is fixed and held by the solder 13 on the lower surface side of the board mounting portion 1, and the other terminal pins 12 are passed through the board mounting portion 1a. The stem 1 is fixed and held by being inserted into an insulating material 14 such as glass provided so as to fill the hole 1c.

而して赤外線検出器を組み立てるに当たっては、まずステム１の基板搭載部１ａ上に絶縁樹脂製の円形枠状のスペーサ６を載置し、このスペーサ６の周囲に各端子ピン１２に対応させて形成している切欠６ａを介して各端子ピン１２の上端をスペーサ６の上方へ突出させる。 Thus, when assembling the infrared detector, first, a circular frame spacer 6 made of an insulating resin is placed on the substrate mounting portion 1a of the stem 1, and the terminal pins 12 are arranged around the spacer 6 so as to correspond to the terminal pins 12. The upper end of each terminal pin 12 protrudes above the spacer 6 through the notch 6a formed.

この状態で各端子ピン１２に対応して設けてある基板部３の貫通孔１８に各端子ピン１２を基板部３の下面側から貫挿させながら基板部３をスペーサ６上に載置する。この基板部３をスペーサ６上に載置した状態で、基板部３の上面側から各端子ピン１２の上端が上方へ突出することになる。 In this state, the substrate portion 3 is placed on the spacer 6 while the terminal pins 12 are inserted through the through holes 18 of the substrate portion 3 provided corresponding to the terminal pins 12 from the lower surface side of the substrate portion 3. With the substrate portion 3 placed on the spacer 6, the upper ends of the terminal pins 12 protrude upward from the upper surface side of the substrate portion 3.

次に各端子ピン１２の突出部位の基部を基板部３の上面に設けた接続部１９上に塗布充填した銀ペースト等の導電性接着剤により接続部１９に接着固定して基板部３を端子ピン１２に固定するとともに接続部１９を対応する端子ピン１２に電気的に接続する。ここで接続部１９が接着剤保持部を兼ねることになる。 Next, the base portion of the protruding portion of each terminal pin 12 is bonded and fixed to the connection portion 19 with a conductive adhesive such as silver paste applied and filled on the connection portion 19 provided on the upper surface of the substrate portion 3 to fix the substrate portion 3 to the terminal. While fixing to the pin 12, the connection part 19 is electrically connected to the corresponding terminal pin 12. FIG. Here, the connecting portion 19 also serves as an adhesive holding portion.

このようにしてスペーサ６を介して基板部３をステム１の基板搭載部１ａ上に載置するとともに端子ピン１２に固定させることで、端子ピン１２を通じて基板部３の回路からの検出出力を容器外へ取り出すことができるようになる。尚基板部３の下面側に実装されたＩＣ素子１６は基板搭載部１ａの上面から浮いた状態に配置される。 In this way, the substrate portion 3 is placed on the substrate mounting portion 1a of the stem 1 via the spacer 6 and is fixed to the terminal pin 12 so that the detection output from the circuit of the substrate portion 3 is received through the terminal pin 12 in the container. It can be taken out. The IC element 16 mounted on the lower surface side of the substrate unit 3 is arranged in a state of being lifted from the upper surface of the substrate mounting unit 1a.

また端子ピン１２の上端は基板部３の上面より突出するため、その突出量をキャップ２の天井面に当たらないように設定している。また接続部１９に対する端子ピン１２の固定は導電性接着剤を用いて行うが、接着固定だけで基板部３を保持できる場合にはスペーサ６が不要となる。 Further, since the upper end of the terminal pin 12 protrudes from the upper surface of the substrate portion 3, the protruding amount is set so as not to hit the ceiling surface of the cap 2. The terminal pin 12 is fixed to the connection portion 19 using a conductive adhesive. However, when the substrate portion 3 can be held only by adhesive fixing, the spacer 6 is not necessary.

さて基板部３を上述のように基板搭載部１ａの上方にスペーサ６を介して配置固定した後、キャップ２の鍔部２ａをステム１のフランジ１ａ上に載せて抵抗溶接等により接合して封止することで、ステム１とキャップ２とからなる気密構造の容器内に基板部３を収納した所望の赤外線検出器Ａが完成することになる。 Now, after the substrate portion 3 is arranged and fixed above the substrate mounting portion 1a via the spacer 6 as described above, the flange portion 2a of the cap 2 is placed on the flange 1a of the stem 1 and joined by resistance welding or the like and sealed. By stopping, a desired infrared detector A in which the substrate portion 3 is housed in an airtight container composed of the stem 1 and the cap 2 is completed.

このように完成された本実施形態の赤外線検出器Ａは電子回路素子の一部を内蔵した基板部３を用いるため薄型化が図れ、しかもステム１の端子ピン１２と基板部３との接着固定を基板部３の上面側から直接行うことができ、また端子ピン１２の欠損などの不良検出を目視で効率よく行うことができ、生産性の向上、ひいてはコストを抑えることができる。 The infrared detector A of the present embodiment completed in this way uses the substrate part 3 containing a part of the electronic circuit element, so that the thickness can be reduced, and the terminal pin 12 of the stem 1 and the substrate part 3 are bonded and fixed. Can be directly performed from the upper surface side of the substrate part 3, and defect detection such as a defect of the terminal pin 12 can be efficiently performed with the naked eye, so that productivity can be improved and cost can be reduced.

尚端子ピン１２を基板部３の貫通孔１８の下端開口側において接着固定しても良く、この場合下端開口側にも導電性接着剤を充填する接着剤保持部を設ける。そして下端開口側でも接着固定することで、端子ピン１２と基板部３との接着面積を広げられ、結果基板部３を安定良く固定できて信頼性の向上が図れ、また導電性接着剤の規定量を多くして塗布量の流動管理幅を広げて生産性を更に向上させることも可能となる。
（実施形態２）
実施形態１では基板部３の上面に設けた接続部１９を接着剤保持部として用い、この接続部１９に充填する導電性接着剤によって端子ピン１２と接続部１９とを接着固定するものであったが、本実施形態は、図３（ａ）、（ｂ）に示すように基板部３を構成する樹脂層体１０に接着剤保持部を構成する切欠状の凹部２０を形成するとともに凹部２０の底部に貫通孔１８の上側開口端を臨ませ且つその開口周辺に接続部１９を形成した点に特徴がある。 Note that the terminal pin 12 may be bonded and fixed on the lower end opening side of the through hole 18 of the substrate portion 3, and in this case, an adhesive holding portion for filling a conductive adhesive is also provided on the lower end opening side. By bonding and fixing even at the lower end opening side, the bonding area between the terminal pins 12 and the board part 3 can be expanded, and as a result, the board part 3 can be fixed stably and the reliability can be improved, and the conductive adhesive is specified. It is also possible to further increase the productivity by increasing the amount and expanding the flow control range of the coating amount.
(Embodiment 2)
In the first embodiment, the connection part 19 provided on the upper surface of the substrate part 3 is used as an adhesive holding part, and the terminal pin 12 and the connection part 19 are bonded and fixed by a conductive adhesive filling the connection part 19. However, in the present embodiment, as shown in FIGS. 3A and 3B, a notch-like recess 20 that forms an adhesive holding portion is formed in the resin layer body 10 that forms the substrate portion 3, and the recess 20. This is characterized in that the upper opening end of the through-hole 18 is faced to the bottom of each of the openings, and the connection portion 19 is formed around the opening.

上述以外の構成は実施形態１と同じであるため、図３（ａ）、（ｂ）において、図１（ａ）、（ｂ）及び図２（ａ）、（ｂ）で示す構成要素と同じ構成要素には同じ符号を付し、説明を省略する。 Since the configuration other than the above is the same as that of the first embodiment, the components shown in FIGS. 3A and 3B are the same as those shown in FIGS. 1A and 1B and FIGS. 2A and 2B. Constituent elements are denoted by the same reference numerals and description thereof is omitted.

而して凹部２０に導電性接着剤を充填し、この充填した導電性接着剤によって凹部２０の底部に開口した貫通孔１８から突出する端子ピン１２と接続部１９との接着固定を行うのである。 Thus, the concave portion 20 is filled with a conductive adhesive, and the terminal pin 12 protruding from the through hole 18 opened at the bottom of the concave portion 20 and the connection portion 19 are bonded and fixed by the filled conductive adhesive. .

本実施形態によれば、端子ピン１２の上端を樹脂層体１０の上面、つまり基板部３の上面位置より低くして凹部２０内に収まるようにすることで、キャップ２の高さ寸法を小さくすることが可能となって実施形態１に比して全体構成の薄型化が図れる。
（実施形態３）
実施形態２では切欠状の凹部２０を形成して接着剤保持部を構成しているが、本実施形態は基板部３を構成する樹脂層体１０に図４（ａ）、（ｂ）に示すようにザグリ孔からなる枠部２１を設け、この枠部２１の底部に露出する基板９の上面に貫通孔１８の上端側を開口させるとともにこの開口周辺に接続部１９を設け、枠部２１により接着剤保持部を構成している。 According to this embodiment, the height of the cap 2 is reduced by making the upper end of the terminal pin 12 lower than the upper surface position of the resin layer body 10, that is, the upper surface position of the substrate portion 3, so as to fit in the recess 20. As a result, the overall configuration can be made thinner than in the first embodiment.
(Embodiment 3)
In Embodiment 2, the notch-shaped recess 20 is formed to constitute the adhesive holding portion, but in this embodiment, the resin layer body 10 constituting the substrate portion 3 is shown in FIGS. 4A and 4B. In this way, a frame portion 21 made of counterbored holes is provided, the upper end side of the through hole 18 is opened on the upper surface of the substrate 9 exposed at the bottom of the frame portion 21, and a connection portion 19 is provided around the opening. It constitutes an adhesive holding part.

上述以外の構成は実施形態１と同じであるため、図４（ａ）、（ｂ）において、図１（ａ）、（ｂ）及び図２（ａ）、（ｂ）で示す構成要素と同じ構成要素には同じ符号を付し、説明を省略する。 Since the configuration other than the above is the same as that of the first embodiment, in FIGS. 4A and 4B, the same components as those shown in FIGS. 1A and 1B and FIGS. 2A and 2B are used. Constituent elements are denoted by the same reference numerals and description thereof is omitted.

本実施形態によれば、導電性接着剤を塗布する範囲を枠部２１で容易に規定することができ、塗布量の流動管理幅を広げて生産性を更に向上させることも可能となる。また導電性接着剤の漏れ防止も図れるため生産性を更に向上させてコスト上昇を抑えることもできる。
（実施形態４）
実施形態１〜３では基板部３とステム１の基板搭載部１ａとの間にスペーサ６を介在させる構成であったが、本実施形態では図５（ａ）、（ｂ）に示すように基板搭載部１ａを貫通する端子ピン１２の部位に基板部３の貫通孔１８の内径より大きな外径を持つ太径部１２ａを設け、この太径部１２ａの上端部の上向き面を基板部３の下面を支持するオフセット部１２ｂとすることで、基板搭載部１ａと基板部３の下面との間の距離を一定間隔に保持できるようにし、スペーサを不要とした点に特徴がある。ここで基板搭載部１ａの上面と基板部３の下面との間の距離を基板部３の下面に実装しているＩＣ素子１６の厚さ寸法よりも大きくしてＩＣ素子１６を基板搭載部１ａの上面より浮かしている。 According to this embodiment, the range in which the conductive adhesive is applied can be easily defined by the frame portion 21, and the flow management width of the application amount can be widened to further improve the productivity. Further, since leakage of the conductive adhesive can be prevented, productivity can be further improved and cost increase can be suppressed.
(Embodiment 4)
In the first to third embodiments, the spacer 6 is interposed between the substrate portion 3 and the substrate mounting portion 1a of the stem 1, but in this embodiment, as shown in FIGS. A large-diameter portion 12a having an outer diameter larger than the inner diameter of the through hole 18 of the substrate portion 3 is provided at a portion of the terminal pin 12 that penetrates the mounting portion 1a. The offset portion 12b that supports the lower surface is characterized in that the distance between the substrate mounting portion 1a and the lower surface of the substrate portion 3 can be maintained at a constant interval, and a spacer is unnecessary. Here, the distance between the upper surface of the substrate mounting portion 1 a and the lower surface of the substrate portion 3 is made larger than the thickness dimension of the IC element 16 mounted on the lower surface of the substrate portion 3, thereby making the IC element 16 the substrate mounting portion 1 a. Floating from the top of

尚図示例では接着剤保持部の構成を実施形態１と同じ構成としているが、実施形態２の接着剤保持部の構成を採用しても良い。また端子ピン１２に設ける基板部支持用のオフセット部１２ｂを、図５（ｃ）に示すように貫通孔１８に挿通させる部位より下側を基板部３の貫通孔１８の内径より大きな外径とした太径部１２ａ’とし、この太径部１２ａ’の上端部の上向き面で構成しても良く、また図５（ｄ）に示すように端子ピン１２の周部に貫通孔１８の内径よりも大きな外径を持つ環状膨出部１２ｃを形成してその膨出部１２ｃの上向き面で構成しても良い。 In the illustrated example, the configuration of the adhesive holding portion is the same as that of the first embodiment, but the configuration of the adhesive holding portion of the second embodiment may be adopted. Further, the substrate portion supporting offset portion 12b provided on the terminal pin 12 has an outer diameter larger than the inner diameter of the through hole 18 of the substrate portion 3 below the portion where the offset portion 12b is inserted into the through hole 18 as shown in FIG. The upper diameter portion 12a ′ may be an upward surface of the upper end portion of the large diameter portion 12a ′. Further, as shown in FIG. Alternatively, an annular bulging portion 12c having a large outer diameter may be formed and the bulging portion 12c may be configured with an upward surface.

尚上述以外の構成は実施形態１と同じであるため、図５（ａ）、（ｂ）において、図１（ａ）、（ｂ）及び図２（ａ）、（ｂ）で示す構成要素と同じ構成要素には同じ符号を付し、説明を省略する。 Since the configuration other than the above is the same as that of the first embodiment, the components shown in FIGS. 1A and 1B and FIGS. 2A and 2B are the same as those shown in FIGS. The same components are denoted by the same reference numerals, and description thereof is omitted.

而して本実施形態の赤外線検出器Ａでは、基板部３の下面を端子ピン１２に形成したオフセット部１２ｂで支持することで、基板部３の上面と、端子ピン１２の上端との位置関係の精度が高くなり、キャップ２の天井面との接触を避けるために、高さ方向で見なければならない余裕分を低く見積もることができる。 Thus, in the infrared detector A of the present embodiment, the lower surface of the substrate portion 3 is supported by the offset portion 12b formed on the terminal pin 12, so that the positional relationship between the upper surface of the substrate portion 3 and the upper end of the terminal pin 12 is achieved. In order to avoid the contact with the ceiling surface of the cap 2, it is possible to estimate the margin that must be viewed in the height direction.

また基板部３の下面をオフセット部１２ｂで保持するため、基板部３の下面と、ステム１の基板搭載部１ａの上面との距離を精度良く保つことができ、そのためスペーサを用いずとも所定の絶縁状態を維持でき、更にスペーサが不要となるため、その分だけ高さ寸法を小さくすることが可能となって、部品点数の削減と全体構成の薄型化が図れる。 Further, since the lower surface of the substrate portion 3 is held by the offset portion 12b, the distance between the lower surface of the substrate portion 3 and the upper surface of the substrate mounting portion 1a of the stem 1 can be accurately maintained. Since the insulation state can be maintained and the spacer is unnecessary, the height dimension can be reduced accordingly, and the number of parts can be reduced and the overall configuration can be reduced in thickness.

更に精度の低い別部品であるスペーサを用いないため基板部３の上面側に実装される焦電素子Ｘと、別部品として設ける例えば集光用レンズとの間の位置精度が高くなって感度などの検出性能を向上させることも可能となる。 Furthermore, since a separate component with low accuracy is not used, the positional accuracy between the pyroelectric element X mounted on the upper surface side of the substrate unit 3 and a separate component, for example, a condensing lens is increased, and the sensitivity is increased. It is also possible to improve the detection performance.

（ａ）は実施形態１の断面図、（ｂ）は実施形態１の斜めから見た断面図である。(A) is sectional drawing of Embodiment 1, (b) is sectional drawing seen from the diagonal of Embodiment 1. FIG. （ａ）は実施形態１の斜視図、（ｂ）はキャップを外した状態の斜視図である。(A) is a perspective view of Embodiment 1, (b) is a perspective view of the state which removed the cap. （ａ）は実施形態２の断面図、（ｂ）は実施形態２の斜めから見た断面図である。(A) is sectional drawing of Embodiment 2, (b) is sectional drawing seen from the diagonal of Embodiment 2. FIG. （ａ）は実施形態３の斜視図、（ｂ）はキャップを外した状態の斜視図である。(A) is a perspective view of Embodiment 3, (b) is a perspective view of the state which removed the cap. （ａ）は実施形態４の断面図、（ｂ）は実施形態４の斜めから見た断面図、（ｃ）は実施形態４に用いる端子ピンの別の例の正面図、（ｄ）は実施形態４に用いる端子ピンの他の例の正面図である。(A) is sectional drawing of Embodiment 4, (b) is sectional drawing seen from the diagonal of Embodiment 4, (c) is a front view of another example of the terminal pin used for Embodiment 4, (d) is implementation. It is a front view of the other example of the terminal pin used for the form 4. 赤外線検出器の回路構成図である。It is a circuit block diagram of an infrared detector. （ａ）は従来例の断面図、（ｂ）は従来例の実使用時の分解斜視図である。(A) is sectional drawing of a prior art example, (b) is an exploded perspective view at the time of actual use of a prior art example. （ａ）は別の従来例の３次元回路ブロックの分解斜視図、（ｂ）は別の従来例のキャップを外した状態の斜視図、（ｃ）は別の従来例の斜視図である。(A) is an exploded perspective view of a three-dimensional circuit block of another conventional example, (b) is a perspective view with a cap of another conventional example removed, and (c) is a perspective view of another conventional example.

符号の説明Explanation of symbols

１ステム
１ａ基板搭載部
１ｂフランジ
２キャップ
３基板部
４赤外線通過窓
５光学フィルタ
６スペーサ
７回路基板
８樹脂層体
９基板
１０樹脂層体
１１凹部
１２端子ピン
１３半田
１６ＩＣ素子
１７電子部品
１８貫通孔
１９接続部
Ａ赤外線検出器
Ｘ焦電素子 DESCRIPTION OF SYMBOLS 1 Stem 1a Board | substrate mounting part 1b Flange 2 Cap 3 Board | substrate part 4 Infrared passage window 5 Optical filter 6 Spacer 7 Circuit board 8 Resin layer body 9 Substrate 10 Resin layer body 11 Recess 12 Terminal pin 13 Solder 16 IC element 17 Electronic component 18 Through Hole 19 Connection A Infrared detector X Pyroelectric element

Claims

ステムと、該ステム上に被着するキャップとからなる容器内部に、赤外線検知素子とＩＣ素子を含む電子回路素子とを実装するとともに実装する一部の電子回路素子を内蔵した基板部を収納するものであって、前記基板部は、金属箔により形成したシールド層を片面又は両面に形成した基板を有し、
前記ステムは前記基板部に向かって端子ピンを突出させ、前記基板部は前記端子ピンを下面から上面へ貫挿させる貫通孔を設けるとともに前記端子ピンを前記基板部に接着固定し且つ電気接続するための導電性接着剤を充填する接着剤保持部は前記貫通孔の開口端周辺の基板部面に形成した凹部により構成され、前記凹部の底部は前記赤外線検知素子よりも下方に位置することを特徴とする赤外線検出器。 An infrared detection element and an electronic circuit element including an IC element are mounted in a container composed of a stem and a cap attached to the stem, and a substrate part including a part of the electronic circuit element to be mounted is housed. The substrate portion has a substrate formed with a shield layer formed of metal foil on one or both sides,
The stem projects terminal pins toward the substrate portion, and the substrate portion is provided with a through hole through which the terminal pin is inserted from the lower surface to the upper surface, and the terminal pins are bonded and fixed to the substrate portion and electrically connected. The adhesive holding portion for filling the conductive adhesive is formed by a concave portion formed in the substrate portion surface around the opening end of the through hole, and the bottom portion of the concave portion is positioned below the infrared detection element. Infrared detector featured.

ステムと、該ステム上に被着するキャップとからなる容器内部に、赤外線検知素子とＩＣ素子を含む電子回路素子とを実装するとともに実装する一部の電子回路素子を内蔵した基板部を収納するものであって、前記基板部は、金属箔により形成したシールド層を片面又は両面に形成した基板を有し、
前記ステムは前記基板部に向かって端子ピンを突出させ、前記基板部は前記端子ピンを下面から上面へ貫挿させる貫通孔を設けるとともに前記端子ピンを前記基板部に接着固定し且つ電気接続するための導電性接着剤を充填する接着剤保持部は前記貫通孔の開口端を囲繞するように基板部面に立設された枠部により構成され、前記枠部の底部は前記赤外線検知素子よりも下方に位置することを特徴とする赤外線検出器。 An infrared detection element and an electronic circuit element including an IC element are mounted in a container composed of a stem and a cap attached to the stem, and a substrate part including a part of the electronic circuit element to be mounted is housed. The substrate portion has a substrate formed with a shield layer formed of metal foil on one or both sides,
The stem projects terminal pins toward the substrate portion, and the substrate portion is provided with a through hole through which the terminal pin is inserted from the lower surface to the upper surface, and the terminal pins are bonded and fixed to the substrate portion and electrically connected. An adhesive holding portion that is filled with a conductive adhesive is configured by a frame portion standing on the surface of the substrate portion so as to surround the open end of the through hole, and the bottom portion of the frame portion is formed by the infrared detection element . An infrared detector characterized in that it is also located below.

前記端子ピンの周部には前記基板部の貫通孔の内径寸法よりも大きく外方へ突出させた基板部下面支持用オフセット部を設けていることを特徴とする請求項１又は２記載の赤外線検出器。 3. The infrared ray according to claim 1, wherein an offset portion for supporting the lower surface of the substrate portion is provided on a peripheral portion of the terminal pin so as to protrude outward larger than an inner diameter dimension of the through hole of the substrate portion. Detector .