JP5054337B2

JP5054337B2 - Infrared detector and manufacturing method thereof

Info

Publication number: JP5054337B2
Application number: JP2006197234A
Authority: JP
Inventors: 貞幸角; 尚之西川; 智宏上津; 雅也平田; 信佐藤; 佳治佐名川
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2006-07-19
Filing date: 2006-07-19
Publication date: 2012-10-24
Anticipated expiration: 2026-07-19
Also published as: JP2008026079A

Description

本発明は、焦電素子等の赤外線素子を用いた赤外線検出器及びその製造方法に関するものである。 The present invention relates to an infrared detector using an infrared element such as a pyroelectric element and a manufacturing method thereof.

一般に、人体を赤外線の変化量で検出する赤外線検出素子には、焦電素子と呼ばれるものが多く使用されている。このような焦電素子を用いた赤外線検出器は、防犯用の進入検知の他、照明などの負荷制御用として使われている。この赤外線検出器としては例えば図１０に示すように人体の動作により発生した赤外線を、レンズ１００により焦電素子Ｘの受光部に集光させ、赤外線の変化に応じて発生する焦電素子Ｘの分極による信号を電流電圧変換回路１０１で電圧信号に変換した後、バンドパスアンプ１０２で所定の周波数帯域を選択的に増幅し、予め閾値を設定しているウィンドコンパレータ１０３から”Ｈ”，”Ｌ”レベルの検出信号を出力するタイプのものがあり、このウィンドコンパレータ１０３から出力される検出信号が負荷制御に用いられるのである。 In general, a so-called pyroelectric element is often used as an infrared detecting element for detecting a human body by the amount of change in infrared rays. Infrared detectors using such pyroelectric elements are used for load control such as lighting in addition to detection of security entry. As this infrared detector, for example, as shown in FIG. 10, the infrared rays generated by the movement of the human body are condensed on the light receiving portion of the pyroelectric element X by the lens 100, and the pyroelectric element X generated according to the change in infrared rays after converting the signal due to the polarization current to a voltage conversion circuit 1 01 at voltage signal, and selectively amplify the predetermined frequency band by the band-pass amplifier 1 02, the window comparator 1 03 or we have set in advance threshold "H "," L "level has a type that outputs a detection signal of, is the detection signal output the window comparator 1 03 or we are used to load the control.

ところで、従来の赤外線検出器には図１１（ａ）に示すように焦電素子Ｘの両端部を回路基板１０４上に設けた電子回路素子からなる凸状支持部１０５、１０５間に橋渡すように固定して回路基板１０４から焦電素子Ｘを浮かして焦電素子Ｘの受光面と背方の回路基板１０４との間に熱絶縁用の空間を設け、焦電素子Ｘが赤外線を受光したときに赤外線のエネルギが逃げないようにし、焦電素子Ｘの感度を高めているものがある。そして焦電素子Ｘの電荷は非常に微小なため、非常に大きな増幅をしなければならず、その影響で、焦電素子Ｘの出力にわずかでもノイズが入ると、後段のバンドパスアンプ１０２でノイズも増幅され、本来の信号とノイズとの区別が困難となる。そこで図１１（ａ）に示すように金属製のキャップ（ＣＡＮ）１０６と、ステム１０７からなる容器の中に焦電素子Ｘ及び回路基板１０４を封止してシールドを図ったパッケージ構造によって、外来ノイズを遮断している（例えば特許文献１）。尚図１１（ａ）中１０８は出力端子、１０９はキャップ１０６の赤外線通過窓で、この赤外線通過窓１０９には所定の周波数域の赤外線のみを通過させるバンドパス型の光学フィルタ１１０が装着されている。 By the way, in the conventional infrared detector, as shown in FIG. 11A, both ends of the pyroelectric element X are bridged between the convex support portions 105 and 105 made of electronic circuit elements provided on the circuit board 104. between empty heat insulating disposed between the fixed and the circuit board 104 from the pyroelectric light receiving surface of floated X pyroelectric element X and Sekata circuit board 104, the pyroelectric element X is receiving infrared rays In some cases, the sensitivity of the pyroelectric element X is increased by preventing infrared energy from escaping. Since the electric charge of the pyroelectric element X is very small, very large amplification must be performed. If a slight noise enters the output of the pyroelectric element X due to the influence, the subsequent band-pass amplifier 102 As a result, noise is also amplified, making it difficult to distinguish between the original signal and noise. Therefore, as shown in FIG. 11A, a package structure in which the pyroelectric element X and the circuit board 104 are sealed in a container made of a metal cap (CAN) 106 and a stem 107 to provide a shield, thereby providing an external device. Noise is cut off (for example, Patent Document 1). In FIG. 11A, reference numeral 108 denotes an output terminal, 109 denotes an infrared passage window of the cap 106, and the infrared passage window 109 is provided with a band-pass type optical filter 110 that passes only infrared rays in a predetermined frequency range. ing.

ところで、特許文献１に開示されているパッケージ構造の赤外線検出器は、内部にインピーダンス変換回路のみであるため、図１１（ｂ）のような構成をとっており、プリント板１１１上に図１１（ｂ）に示すキャップ１０６とステム１０７からなる容器内に焦電素子Ｘを収納した赤外線検出器のほか、レンズ１１２、更にコンデンサや抵抗、ＩＣのチップなどの外付け電子回路素子１１３が実装され、上述の光学フィルタやウィンドウコンパレータ、更にはタイマ、出力アンプが付加されて用いられるのが一般的である。 By the way, since the infrared detector having the package structure disclosed in Patent Document 1 has only an impedance conversion circuit inside, it has a configuration as shown in FIG. In addition to the infrared detector in which the pyroelectric element X is housed in a container composed of a cap 106 and a stem 107 shown in b), an external electronic circuit element 113 such as a lens 112, a capacitor, a resistor, and an IC chip is mounted. In general, the above-mentioned optical filter, window comparator, timer, and output amplifier are added.

一方、図１２（ａ）〜（ｃ）に示すように樹脂成型品で製作される３次元回路ブロック（ＭＩＤ基板）２００に、焦電素子Ｘとバンドパスアンプやとウィンドウコンパレータを構成する電子回路素子２０１を実装し、キャップ１０６とステム１０７からなる容器内に収納して封止することにより、小型化を図った赤外線検出器が提供されている（例えば特許文献２）。この赤外線検出器に用いる３次元回路ブロック２００は、表立面と裏立面とを形成した縦方向に起立する縦長のブロックとなっており、立面には電子回路素子２０１を実装し、上部には焦電素子Ｘの熱絶縁をとるための空間を作る凹部２０２を一体形成し、凹部２０２の両端間に焦電素子Ｘを橋渡ししてある。
特開平５−３３２８２９号公報（図１、段落番号００１５〜１００６）特許第３２１１０７４号公報（図６〜図１３及び段落番号００１８〜００２１） On the other hand, as shown in FIGS. 12A to 12C, an electronic circuit constituting a pyroelectric element X, a band-pass amplifier, and a window comparator is formed on a three-dimensional circuit block (MID substrate) 200 made of a resin molded product. There has been provided an infrared detector that is miniaturized by mounting the element 201 and enclosing and sealing it in a container composed of a cap 106 and a stem 107 (for example, Patent Document 2). The three-dimensional circuit block 200 used for the infrared detector is a vertically long block that has a vertical surface and a vertical surface, and has an electronic circuit element 201 mounted on the vertical surface. In FIG. 2, a recess 202 for forming a space for thermal insulation of the pyroelectric element X is integrally formed, and the pyroelectric element X is bridged between both ends of the recess 202.
JP-A-5-332829 (FIG. 1, paragraph numbers 0015 to 1006) Japanese Patent No. 3211074 (FIGS. 6 to 13 and paragraph numbers 0018 to 0021)

上述の特許文献１に開示されているような赤外線検出器の場合、焦電素子Ｘが赤外線を受けたときに赤外線エネルギが逃げないようにするために焦電素子Ｘの受光面を回路基板１０４より浮かす支持部１０５を設けているが、この支持部１０５が回路基板１０４とは別部品であるため、別途部品実装工程が必要となりコストアップの要因となっていた。また別部品として支持部１０５を設ける場合、取り付け誤差により支持部１０５の高さが変わり、焦電素子Ｘの熱絶縁の効果にばらつきが発生するなどの問題があった。また特許文献１の赤外線検出器の場合、図１０のような外付け回路部が必要で、そのため電子回路部品１１３を大きなプリント基板１１１に実装する構成であるため回路規模が非常に大きくなるという問題があり、昨今の小型化・薄型化の要請には答えられないという問題があり、また回路部品が外付けになると電磁ノイズの影響を受けやすくなり、ノイズ環境が悪いところでは、誤動作の要因となっていた。これを防ぐために、外付け回路部に大きなシールド板を取り付けることが必要となるという問題もあった。 In the case of the infrared detector disclosed in the above-mentioned Patent Document 1, the light receiving surface of the pyroelectric element X is arranged on the circuit board 104 so that the infrared energy does not escape when the pyroelectric element X receives the infrared light. Although the support part 105 which floats more is provided, since this support part 105 is a separate component from the circuit board 104, a separate component mounting process is required, which causes a cost increase. Further, when the support part 105 is provided as a separate part, there is a problem that the height of the support part 105 changes due to an attachment error, and the thermal insulation effect of the pyroelectric element X varies. Further, in the case of the infrared detector of Patent Document 1, an external circuit unit as shown in FIG. 10 is necessary, and therefore the circuit scale becomes very large because the electronic circuit component 113 is mounted on a large printed board 111. However, there is a problem that the recent demands for miniaturization and thinning cannot be answered, and circuit components are susceptible to electromagnetic noise when they are externally attached. It was. In order to prevent this, there is a problem that it is necessary to attach a large shield plate to the external circuit portion.

一方特許文献２に開示されている赤外線検出器のように３次元回路ブロック２００を用いたものは、特許文献１に開示されている赤外線検出器の問題点を或る程度解決できる。 On the other hand, the one using the three-dimensional circuit block 200 like the infrared detector disclosed in Patent Document 2 can solve the problems of the infrared detector disclosed in Patent Document 1 to some extent.

すなわち３次元回路ブロック２００に直接焦電素子Ｘを浮かす凹部２０２を形成するためため、部品点数削減や低コスト化が可能となり、また電子回路素子２０１を金属製のキャップとステムからなる容器に収納するＣＡＮパッケージとすることで、小型化が可能となる上に、バンドパスアンプやウィンドコンパレータをＩＣ化することで回路部を小型化することも可能である。また焦電素子Ｘとバンドパスアンプの入力部までの距離を短くすることができるため、プリント基板による外付け部品で増幅する方法より外来ノイズが入りにくくなり、ノイズに強い構成となる。更に焦電素子Ｘと回路部全体を金属製キャップとステムからなる容器内に収納してシールドすることにより、外来ノイズに非常に強い構成が実現できるという利点がある。 That is, since the recess 202 for directly floating the pyroelectric element X is formed in the three-dimensional circuit block 200, the number of parts can be reduced and the cost can be reduced, and the electronic circuit element 201 is stored in a container made of a metal cap and stem. By using the CAN package, it is possible to reduce the size, and it is also possible to reduce the size of the circuit unit by making the bandpass amplifier and the window comparator into an IC. In addition, since the distance between the pyroelectric element X and the input part of the bandpass amplifier can be shortened, external noise is less likely to enter than a method of amplifying with an external component using a printed circuit board, and the configuration is strong against noise. Further, by housing and shielding the pyroelectric element X and the entire circuit unit in a container made of a metal cap and stem, there is an advantage that a configuration extremely resistant to external noise can be realized.

しかしながら、この特許文献２に開示されている赤外検出器では、３次元回路ブロック２００が縦長で起立して表立面と裏立面とを形成した回路部に電子部品やＩＣを実装しているため、パッケージが縦長になるのは避けられない。 However, in the infrared detector disclosed in Patent Document 2, an electronic component or an IC is mounted on a circuit portion in which the three-dimensional circuit block 200 stands vertically and forms a front surface and a back surface. Therefore, it is inevitable that the package becomes vertically long.

そのため、この特許文献２に開示されている赤外線検出器を取り付ける機器の厚みに制限が発生し薄型化が困難になるなど、更なる小型化、薄型化の要請には応えられなかった。また３次元回路ブロック２００を小型化して全体の大きさを小さくしようとした場合、更に以下の２つの問題が発生する。 For this reason, the thickness of a device to which the infrared detector disclosed in Patent Document 2 is restricted is limited, making it difficult to reduce the thickness, and the demand for further miniaturization and reduction in thickness cannot be met. In addition, when the three-dimensional circuit block 200 is downsized to reduce the overall size, the following two problems occur.

まずその１つ目は、実装スペースの不足の問題がある。つまり上述の３次元回路ブロック２００では、従長で起立して表立面と裏立面とを形成した部分を回路スペースとしてとることができるが、３次元回路ブロック２００を単純に小型化すると、回路部品を実装するスペースが確保できなくなり、小型化が実現できない点である。 First, there is a problem of lack of mounting space. That is, in the above-described three-dimensional circuit block 200, a portion where the front surface and the back surface are formed upright by the subordinate can be taken as a circuit space. However, if the three-dimensional circuit block 200 is simply reduced in size, The space for mounting circuit components cannot be secured, and downsizing cannot be realized.

２つ目は、焦電素子Ｘの出力と増幅された後段出力の距離が近くなることに起因する問題である。つまり焦電素子Ｘの電荷の変化は非常に微弱なため、後段の回路では、フェムトアンペアレベルの電流変化を数百ミリボルトレベルに増幅している一方電源供給のための電源供給部には、供給される電圧の他に、商用電源からの重畳ノイズや携帯電話からの輻射ノイズなどの外来（外乱）ノイズも乗ってくる。これらの外来ノイズのうちの僅かな信号でも焦電素子Ｘに影響を及ぼさないように、焦電素子Ｘと最終段出力と十分離すことが必要である。しかしこの距離が１ｍｍ程度になると、焦電素子Ｘと最終出力段との容量結合により、発振現象や周波数特性の劣化などの現象が発生するという問題が生じる。 The second problem is due to the fact that the distance between the output of the pyroelectric element X and the amplified subsequent stage output is close. In other words, since the change in the charge of the pyroelectric element X is very weak, the subsequent circuit amplifies the femtoampere level current change to several hundred millivolt level, while supplying power to the power supply unit for power supply. In addition to the generated voltage, extraneous (disturbance) noise such as superimposed noise from a commercial power supply and radiation noise from a mobile phone also rides. It is necessary to sufficiently separate the pyroelectric element X from the final stage output so that a slight signal of these external noises does not affect the pyroelectric element X. However, when the distance is about 1 mm, there arises a problem that a phenomenon such as an oscillation phenomenon or a deterioration in frequency characteristics occurs due to capacitive coupling between the pyroelectric element X and the final output stage.

本発明は、上述の課題に鑑みて為されたもので、その目的とするところは、低背で小型な構造の赤外線検出器において、赤外線検出素子の検出出力端を接合する電極と、信号処理用回路部の検出信号用端子ピンを接続する電極との間の容量結合を低コストで抑制することができる赤外線検出器及びその製造方法を提供することにある。 The present invention has been made in view of the above-described problems. The object of the present invention is to provide an electrode for joining a detection output end of an infrared detection element and signal processing in an infrared detector having a low profile and a small structure. Another object of the present invention is to provide an infrared detector capable of suppressing capacitive coupling with an electrode connected to a detection signal terminal pin of a circuit section at low cost, and a method for manufacturing the same.

上述の目的を達成するために、請求項１の赤外線検出器の発明では、樹脂からなる上部部材と、該上部部材の下方に配置される樹脂からなる下部部材とを積層するブロックをキャンパッケージ用の器台上方に配置するものであって、前記上部部材は、上面には熱絶縁部を介して赤外線検出素子を搭載し該赤外線検出素子の検出出力端に接続する電極を有し、下面にはシールド電位に接続するシールド用電極並びに前記下部部材との接続電極を形成し、前記下部部材は、信号処理用回路部の回路部品を埋設するとともに前記上部部材の接続電極に対応する上面位置に接続電極を設けて対応する前記上部部材の接続電極に接合し、前記器台は上方に突出させた複数の端子ピンを前記下部部材を貫通する貫通孔に前記下部部材の下面側から上面側に貫挿させるとともに、前記端子ピンの内の少なくとも検出信号用端子ピンの上端部を、該上端部周囲の前記下部部材の上面部に臨む前記信号処理用回路部の検出信号出力用電極と電気的に接合しており、前記シールド用電極は、前記赤外線検出素子の検出出力端に接続する電極と、前記検出信号出力用電極との間に前記シールド用電極を挟む形で位置され、前記シールド用電極が前記検出信号用端子ピンの上端部と対向配置されていることを特徴とする。 In order to achieve the above-mentioned object, in the invention of the infrared detector according to claim 1, a block in which an upper member made of resin and a lower member made of resin arranged below the upper member are stacked is used for a can package. The upper member has an electrode connected to the detection output end of the infrared detection element on the upper surface with an infrared detection element mounted on the upper surface through a heat insulating part, Forms a shield electrode connected to a shield potential and a connection electrode with the lower member, and the lower member embeds a circuit component of the signal processing circuit section and is located at an upper surface position corresponding to the connection electrode of the upper member. A connection electrode is provided and joined to the corresponding connection electrode of the upper member, and the terminal block has a plurality of terminal pins protruding upward from a lower surface side of the lower member to an upper surface side through a through hole that penetrates the lower member. And at least an upper end portion of the terminal pin for detection signal in the terminal pin is electrically connected to an electrode for detection signal output of the signal processing circuit portion facing the upper surface portion of the lower member around the upper end portion. The shield electrode is positioned such that the shield electrode is sandwiched between an electrode connected to a detection output terminal of the infrared detection element and the detection signal output electrode; The electrode is disposed opposite to the upper end portion of the detection signal terminal pin .

請求項１の赤外線検出器の発明によれば、低背で小型な構造の赤外線検出器を実現でき、しかも信号処理用回路部の検出信号出力用電極と赤外線検出素子の検出が接続される電極と上部部材下面のシールド電位の電極を挟む形で位置することによって、両電極での容量結合を抑制して最上面で近接するような構造を回避し、赤外線検出素子の感度を損なうことがなく、その上同じ面において近接させる場合のように赤外線検出素子の検出出力端を接続する電極と、信号処理用回路部の検出信号出力用電極との間にシールド電位の電極を介在させる構造に比して、上部部材の下面にシールド電位の電極を低コストで容易に形成できる。 According to the infrared detector of the first aspect, an infrared detector having a low profile and a small structure can be realized, and the detection signal output electrode of the signal processing circuit unit and the detection of the infrared detection element are connected to each other. And a shield potential electrode on the lower surface of the upper member, so that the capacitive coupling between the two electrodes is suppressed, avoiding a structure that is close to the top surface, and without impairing the sensitivity of the infrared detection element In addition, compared to a structure in which an electrode having a shield potential is interposed between the electrode connecting the detection output terminal of the infrared detection element and the detection signal output electrode of the signal processing circuit unit as in the case where they are close to each other on the same surface. Thus, an electrode having a shield potential can be easily formed at a low cost on the lower surface of the upper member.

本願とは別の赤外線検出器の発明では、樹脂からなる上部部材と、該上部部材の下方に配置される樹脂からなる下部部材とを積層するブロックをキャンパッケージ用の器台上方に配置するものであって、前記上部部材は、上面には熱絶縁部を介して赤外線検出素子を搭載し、下面にはシールド電位の電極並びに前記下部部材との接続電極を形成し、前記下部部材は、回路部品を埋設するとともに前記上部部材の接続電極に対応する上面位置に接続電極を設けて対応する前記上部部材の接続電極に接合し、前記器台は上方に突出させた複数の端子ピンを前記下部部材の下面から上面側に貫通させるとともに、前記端子ピンの内の少なくとも検出信号用端子ピンの上端部を、該上端部周囲の前記下部部材の上面部に臨む検出信号出力用電極に電気的に接合している発明において、前記端子ピンの内少なくとも検出信号用端子ピンの上端部の上方の前記上部部材に下面から上面に貫通する窓孔を設けていることを特徴とする。 In the invention of the infrared detector different from the present application, a block in which an upper member made of a resin and a lower member made of a resin arranged below the upper member are stacked is arranged above the stand for the can package. The upper member has an infrared detection element mounted on the upper surface via a thermal insulating part, and a shield potential electrode and a connection electrode to the lower member are formed on the lower surface. A part is embedded and a connection electrode is provided at an upper surface position corresponding to the connection electrode of the upper member to be joined to the corresponding connection electrode of the upper member. The lower end of the member is penetrated from the lower side to the upper side, and at least the upper end of the terminal pin for the detection signal is electrically connected to the detection signal output electrode facing the upper surface of the lower member around the upper end. In inventions which are joined to, characterized in that it provided a window hole penetrating from the lower surface to the upper surface to the upper member above the upper end of at least the detection signal terminal pins of the terminal pin.

本願とは別の赤外線検出器の発明によれば、検出信号用端子ピンが上部部材に隠されることがないため、最終外観検査を行うことができ、工程歩留まりが向上するほか、赤外線検出素子の接合と検出信号用端子ピンの接合を上面側から同時に行うことも可能になるため、生産性を向上させることができる。 According to the invention of the infrared detector different from the present application, since the detection signal terminal pin is not hidden by the upper member, the final appearance inspection can be performed, the process yield is improved, and the infrared detection element Since it is possible to simultaneously join the detection signal terminal pins from the upper surface side, productivity can be improved.

請求項２の赤外線検出器の発明では、請求項１の発明において、前記検出信号用端子ピンの上端部周囲の前記下部部材上面に凹み部を形成していることを特徴とする。 According to a second aspect of the present invention, there is provided an infrared detector according to the first aspect , wherein a recess is formed on the upper surface of the lower member around the upper end of the detection signal terminal pin.

請求項２の赤外線検出器の発明によれば、端子接合に用いる接合材の塗布量を増やし．工程条件幅を広げることによって、工程生産性を上げることが可能になる。 According to the invention of the infrared detector of claim 2, the application amount of the bonding material used for terminal bonding is increased. By increasing the range of process conditions, it becomes possible to increase process productivity.

請求項３の赤外線検出器の発明では、請求項１又は２の発明において、少なくとも前記検出信号用端子ピンの上端部直上の前記上部部材下面に下向き開口の空所を設けるとともに、該空所にシールド層を形成していることを特徴とする。 In the invention of the infrared detector according to claim 3, in claim 1 or 2 of the invention, together with at least the said upper member lower surface directly above the upper end portion of the detection signal terminal pins provided voids downward opening, said cavity And a shield layer is formed.

請求項３の赤外線検出器の発明によれば、検出信号用端子ピンの許容高さを広く設定でき、そのため、器台製造工程の負荷を軽減でき、コストを下げることができ、また、端子接合用の接合材量の許容量も増えるため、工程生産性を向上できる。 According to the invention of the infrared detector of claim 3, the allowable height of the detection signal terminal pin can be set widely, so that the load on the device manufacturing process can be reduced, the cost can be reduced, and the terminal joining Since the allowable amount of the bonding material for use increases, process productivity can be improved.

請求項４の赤外線検出器の発明では、請求項１乃至３の何れかの発明において、前記下部部材の厚み方向の中間部位にシールド層を介在させていることを特徴とする。 In the invention of the infrared detector according to claim 4, in any one of the claims 1乃optimum 3, characterized in that it is interposed shield layer in the middle portion in the thickness direction of the lower member.

請求項４の赤外線検出器の発明によれば、下部部材の上部部材との接続電極を設けることによるシールド層の欠落がなくなり、容量結合性の低下が抑えられ、これにより高い感度を確保することができる。 According to the invention of the infrared detector of claim 4, the loss of the shield layer due to the provision of the connection electrode with the upper member of the lower member is eliminated, and the decrease in capacitive coupling is suppressed, thereby ensuring high sensitivity. Can do.

請求項５の赤外線検出器の製造方法の発明では、請求項１の赤外線検出器の製造方法であって、上面側に凹部からなる熱絶縁部を設けた上部部材を形成する工程と、前記熱絶縁部の周囲の前記上部部材上面に赤外線検出素子の検出出力端を接合する電極を形成し、且つ前記上部部材の下面に接続電極を形成する工程と、回路部品を実装した回路基板と樹脂材とを一体成形して下部部材を形成するとともに該下部部材の形成と同時に又は下部部材の形成後に前記貫通孔を設ける工程と、前記上部部材の接続電極に対応する接続電極を前記下部部材上面に形成し、且つ前記貫通孔の上端開口周縁から該貫通孔の内周面に亘って端子接続部用の電極を形成する工程と、キャンパッケージ用の器台の上面に突出している端子ピンを対応する前記下部部材の前記貫通孔に貫挿させて前記下部部材を前記器台上に搭載し、各貫通孔の上端開口に臨んだ各端子ピンの上端部を前記端子接続部用の電極に電気的に接合する工程と、前記下部部材の上面側に前記上部部材を乗せて下部部材の上面側の接続電極と前記上部部材の下面側の接続電極とを電気的に接合する工程と、前記上部部材の上面の素子用電極に赤外線検出素子の検出出力端を電気的に接合して赤外線検出素子を前記上部部材に実装する工程と、前記下部部材及び上部部材からなる回路ブロックを内部に収めながらキャップを前記器台上に被着封止する工程とを有することを特徴とする。 The invention of the infrared detector manufacturing method of claim 5 is the infrared detector manufacturing method of claim 1, wherein a step of forming an upper member provided with a heat insulating portion formed of a recess on the upper surface side, and the heat Forming an electrode for joining the detection output end of the infrared detection element on the upper surface of the upper member around the insulating portion, and forming a connection electrode on the lower surface of the upper member; and a circuit board on which circuit components are mounted and a resin material Forming a lower member and forming the through hole simultaneously with the formation of the lower member or after the formation of the lower member, and a connection electrode corresponding to the connection electrode of the upper member on the upper surface of the lower member The step of forming and forming the electrode for the terminal connection portion from the peripheral edge of the upper end opening of the through hole to the inner peripheral surface of the through hole corresponds to the terminal pin protruding from the upper surface of the can package base The lower part to The lower member is mounted on the instrument base by being inserted into the through-holes, and the upper ends of the terminal pins facing the upper-end openings of the through-holes are electrically joined to the electrodes for the terminal connection portions. A step of placing the upper member on the upper surface side of the lower member to electrically connect the connection electrode on the upper surface side of the lower member and the connection electrode on the lower surface side of the upper member; A step of electrically connecting the detection output end of the infrared detection element to the element electrode and mounting the infrared detection element on the upper member; and a cap while the circuit block comprising the lower member and the upper member is housed inside And a step of depositing and sealing on the table.

請求項５の赤外線検出器の製造方法の発明によれば、請求項１の発明の効果を奏する赤外線検出器を製造することができる。 According to the invention of the method for manufacturing an infrared detector of claim 5, the infrared detector having the effect of the invention of claim 1 can be manufactured.

本願とは別の赤外線検出器の製造方法の発明では、請求項６の発明において、前記下部部材を形成する工程において、前記貫通孔の上端開口周縁に凹み部を形成することを特徴とする。 In an invention of an infrared detector manufacturing method different from that of the present application, in the invention of claim 6, in the step of forming the lower member, a recess is formed at the periphery of the upper end opening of the through hole.

上述の本願とは別の赤外線検出器の製造方法の発明によれば、端子接合に用いる接合材の塗布量を増やし、工程条件幅を広げることによって、工程生産性を上げることを可能とする凹み部を下部部材を形成する工程で同時に形成できる。 According to the invention of another method of manufacturing an infrared detector with the above-mentioned application, the coating amount of the bonding material increase or to be used for terminal connection, Engineering by widening the condition range as, allows to increase the process productivity the recess to be formed simultaneously in the process form a lower member.

本発明は、低背で且つ小型化が図れ、しかも赤外線検出素子の検出出力端を接合する電極と、信号処理用回路部の検出信号用端子ピンを接続する電極との間の容量結合を低コストで抑制することができるという効果を奏する。 The present invention is low in profile and can be reduced in size, and has low capacitive coupling between the electrode that joins the detection output terminal of the infrared detection element and the electrode that connects the detection signal terminal pin of the signal processing circuit unit. There exists an effect that it can control at cost.

以下本発明を実施形態により説明する。 Embodiments of the present invention will be described below.

（実施形態１）
図１（ａ）、（ｂ）、（ｃ）は本実施形態の赤外線検出器Ａを示しており、赤外線検出素子Ｘと信号処理用回路部を実装した回路ブロック１は、夫々をコンポジット樹脂により形成した下部部材２と、上部部材６とを電極接合によって一体的に積層形成したものであって、器台たるステム９上に絶縁材からなるスペーサ１０を介して搭載される。 (Embodiment 1)
1 (a), (b), and (c) show an infrared detector A of the present embodiment. A circuit block 1 on which an infrared detection element X and a signal processing circuit unit are mounted is made of a composite resin. The formed lower member 2 and the upper member 6 are integrally laminated by electrode bonding, and are mounted on a stem 9 serving as a table via a spacer 10 made of an insulating material.

上部部材２は、円盤状に形成され、上面の中央には従来例と同様に熱絶縁部を空間部で形成するための凹部７を形成するとともに、この凹部７の両側に焦電素子（或いはサーモパイル等）からなる赤外線検出素子Ｘの検出出力端を接続する電極ＳＩＮを形成している。 The upper member 2 is formed in a disc shape, and in the center of the upper surface, a recess 7 for forming a heat insulating portion in the space is formed in the same manner as in the conventional example, and pyroelectric elements (or alternatively) are formed on both sides of the recess 7. An electrode SIN for connecting a detection output terminal of the infrared detection element X made of a thermopile or the like is formed.

これらの電極ＳＩＮは、配線パターン２３、２３と、上部部材２を貫通するスルーホール２４、２４の導電メッキとを介して上部部材６の中央部に形成している接続電極１８ａ、１８ａの配線パターンに接続される。 These electrodes SIN are the wiring patterns of the connection electrodes 18a, 18a formed in the central part of the upper member 6 through the wiring patterns 23, 23 and the conductive plating of the through holes 24, 24 penetrating the upper member 2. Connected to.

これらの接続電極１８ａ、１８ａの周囲には、グランド電位に接続されたシールド用電極１７ａ、１７ａを形成している。 Shield electrodes 17a and 17a connected to the ground potential are formed around these connection electrodes 18a and 18a.

下部部材２は、上部部材６と同様に円盤状に形成され、後述する成形時回路基板３に実装している信号処理用回路部の電子部品４と回路基板３とを一体に埋設し、ＩＣ５を実装する回路基板３の下面側を露出させているもので、上面の中央にはグランド電位（シールド電位）に接続したシールド用電極１７ｂを形成し、このシールド用電極１７ｂの両側には前記接続電極１８ａ、１８ａに対応する接続電極１８ｂ、１８ｂを形成し、この接続電極１８ｂ、１８ｂと上部部材６の接続電極１８ａ、１８ａとを例えば導電接着剤（或いは半田）１９により接合固定している。 Lower member 2 is formed in the same manner as disc-shaped upper member 6, embedded in integrating the electronic components 4 and the circuit board 3 of the signal processing circuit section which is mounted on the molding time of the circuit board 3 to be described later, The lower surface side of the circuit board 3 on which the IC 5 is mounted is exposed. A shield electrode 17b connected to the ground potential (shield potential) is formed at the center of the upper surface, and the shield electrode 17b is formed on both sides of the shield electrode 17b. Connection electrodes 18b and 18b corresponding to the connection electrodes 18a and 18a are formed, and the connection electrodes 18b and 18b and the connection electrodes 18a and 18a of the upper member 6 are bonded and fixed by, for example, a conductive adhesive (or solder) 19. .

一方、下部部材２の両側部にはステム９の上面側から突出している検出信号用端子ピン１１ａ、１１ｂを夫々貫挿させる貫通孔２０、２０を貫通させており、各貫通孔２０の上端開口の直上に上部部材６の下面のシールド用電極１７ａ、１７ａが位置するようになっている。 On the other hand, through holes 20, 20 through which detection signal terminal pins 11 a, 11 b projecting from the upper surface side of the stem 9 are respectively inserted are inserted into both side portions of the lower member 2. The shield electrodes 17a and 17a on the lower surface of the upper member 6 are positioned immediately above the upper surface of the upper member 6.

これら貫通孔２０は、内周面から上端開口周縁の下部部材２の上面に臨むように検出信号出力用電極２１をメッキにより形成しており、この電極２１の内周面に塗布している導電性接着剤２２（又は半田）により端子ピン１１ａ、１１ｂの上端部の外周面と電極２１の内周面とを接合している。この接合によって端子ピン１１ａ、１１ｂは信号処理用回路部の検出信号出力端に電極２１を介して接続されることになる。 These through holes 20 are formed by plating a detection signal output electrode 21 so as to face the upper surface of the lower member 2 at the periphery of the upper end opening from the inner peripheral surface, and the conductive material applied to the inner peripheral surface of the electrode 21. The outer peripheral surface of the upper end portion of the terminal pins 11 a and 11 b and the inner peripheral surface of the electrode 21 are joined together by the adhesive 22 (or solder). By this joining, the terminal pins 11a and 11b are connected to the detection signal output terminal of the signal processing circuit section via the electrode 21.

図１（ｂ）、（ｃ）で示している中央の端子ピン１１ｃは電源供給用のピンであって、上述の端子ピン１１ａ、１１ｂと同様に下部部材２を貫通する貫通孔（図示せず）に貫挿させて、下部部材２の上面側で電源路の電極に接続されるようになっている。尚電源のグランド用の端子は上述の検出信号用の端子ピン１１ａと共用している。 A central terminal pin 11c shown in FIGS. 1B and 1C is a power supply pin, and is a through hole (not shown) penetrating the lower member 2 like the above-described terminal pins 11a and 11b. ) To be connected to the electrode of the power supply path on the upper surface side of the lower member 2. The ground terminal of the power supply is shared with the detection signal terminal pin 11a.

尚図１（ａ）の断面図では端子ピン１１ａ、１１ｂの長さを短く示しているが、実際には（ｂ），（ｃ）の斜視図に示すように長い（後述する他の実施形態での断面図も同様に示している）。 In addition, in the cross-sectional view of FIG. 1A, the lengths of the terminal pins 11a and 11b are shown to be short, but in reality, they are long as shown in the perspective views of FIGS. sectional view also shows similar in).

またステム９は、従来例と同様に端子ピン１１ａ〜１１ｃをガラス封止材１６で封止と絶縁を図りながら上下方向に貫通させ、またキャンパッケージ用の金属製のキャップ８を被着してキャップ８の鍔部を周縁上部に溶接することで、キャップ８を固着するとともにキャップ８の鍔部と周縁上部との間をキャップ８内が気密となるように封止している。またキャップ８は従来と同様に光学フィルタ１４を装着した赤外線通過窓１５を中央部に設けてある。 Similarly to the conventional example, the stem 9 penetrates the terminal pins 11a to 11c in the vertical direction while sealing and insulating with a glass sealing material 16, and a metal cap 8 for can package is attached. By welding the flange portion of the cap 8 to the upper peripheral edge, the cap 8 is fixed and sealed between the flange portion and the upper peripheral edge of the cap 8 so that the inside of the cap 8 is airtight. In addition, the cap 8 is provided with an infrared passage window 15 fitted with an optical filter 14 at the center as in the conventional case.

次に本実施形態の製造方法を図２〜図４により説明する。 Next, the manufacturing method of this embodiment is demonstrated with reference to FIGS.

図２は下部部材２の形成工程を示しており、この工程では図２（ａ）に示すように、チップ状の電子部品４を導電性接着剤１３やリフロー半田を用いて配線パターンに接合して一面に実装した回路基板３を準備し、この回路基板３を、Ｂステージ状態のエポキシ樹脂材にシリカ（ＳｉＯ_２）のような無機フィラーを高充填（例えば８５ｗｔ％）し、高い伸びと引張強度を持ち、常温では強靱性があって破れ難いコンポジット樹脂材を複数枚、回路基板３上に重ね、この重ねた状態でプレスの金型内に投入し、この投入した状態で真空引きしながら加熱（例えば１００℃）してコンポジット樹脂材を熱溶解させ、一定時間加圧（例えば３Ｍｐａ）する。この加熱プレスにより回路基板３上のチップ状電子部品４の凹凸及びその下部の隙間に溶解樹脂が流れ込むことになり、その後所定の温度（例えば１７５℃）で昇温して完全硬化させる。この硬化によって回路基板３上ではチップ状の電子部品４を埋設した下部部材２の樹脂部位が回路基板３と一体となって形成される。 FIG. 2 shows a process of forming the lower member 2. In this process, as shown in FIG. 2A, the chip-like electronic component 4 is bonded to the wiring pattern using the conductive adhesive 13 or reflow solder. A circuit board 3 mounted on one surface is prepared, and this circuit board 3 is filled with an inorganic filler such as silica (SiO ₂ ) in an epoxy resin material in a B-stage state (for example, 85 wt%), and has high elongation and tension. A plurality of composite resin materials that have strength and are tough at room temperature and are not easily torn are stacked on the circuit board 3 and placed in the press mold in this stacked state, The composite resin material is melted by heating (for example, 100 ° C.) and pressurized (for example, 3 Mpa) for a certain time. By this heating press, the molten resin flows into the irregularities of the chip-like electronic component 4 on the circuit board 3 and the gaps below the chip-like electronic component 4, and then the temperature is raised at a predetermined temperature (for example, 175 ° C.) to be completely cured. By this curing, the resin portion of the lower member 2 in which the chip-like electronic component 4 is embedded is formed integrally with the circuit board 3 on the circuit board 3.

この樹脂部位形成後、ルータで各層を貫通するスルーホール２４や及び端子ピン１１ａ〜１１ｂを貫挿させる貫通孔２０を形成し、更に表面及びスルーホール２４や貫通孔２０の内周面を含めた樹脂部位の表面にメッキ層３０を形成する（図２（ｂ））。尚貫通孔２０の形成は樹脂部位形成と同時に形成するようにしても良い。 After forming the resin part, the through hole 24 penetrating each layer and the through hole 20 through which the terminal pins 11a to 11b are inserted are formed by the router, and the surface and the inner peripheral surface of the through hole 24 and the through hole 20 are further included. A plating layer 30 is formed on the surface of the resin part (FIG. 2B). The through hole 20 may be formed simultaneously with the formation of the resin part.

この後、メッキ層３０をエッチングして、シールド用電極１７ｂ及び接続電極１８ｂを形成するとともに、端子ピン１１ａ、１１ｂに対応する各貫通孔２０の内周面及び上端開口周縁には検出信号出力用電極２１を形成する。同様に端子ピン１１ｃに対応する貫通孔（図示せず）の内周面及び上端開口周縁にも電極（図示せず）を形成する。この後、回路基板３の下面にＩＣ５を実装することで、図２（ｃ）に示すように下部部材２が完成することになる。 Thereafter, the plating layer 30 is etched to form the shield electrode 17b and the connection electrode 18b, and the detection signal output is provided on the inner peripheral surface and the upper end opening periphery of each through hole 20 corresponding to the terminal pins 11a and 11b. The electrode 21 is formed. Similarly, electrodes (not shown) are also formed on the inner peripheral surface of the through hole (not shown) corresponding to the terminal pin 11c and the peripheral edge of the upper end opening. After that, by mounting the IC 5 on the lower surface of the circuit board 3, the lower member 2 is completed as shown in FIG.

図３は上部部材６の形成工程を示しており、まず下部部材２と同様にコンポジット樹脂材を用いて上部部材６の樹脂部位を形成する。この樹脂部位形成時に同時に熱絶縁部を構成する凹部７を同時に形成する。この樹脂部位形成後に樹脂部位の上、下面にメッキ層３１を形成する（図３（ａ））。 FIG. 3 shows a process of forming the upper member 6. First, the resin portion of the upper member 6 is formed using a composite resin material in the same manner as the lower member 2. At the same time as forming the resin part, the recesses 7 constituting the heat insulating part are simultaneously formed. After the resin part is formed, the plating layer 31 is formed on the upper and lower surfaces of the resin part (FIG. 3A).

この形成後、メッキ層３１をエッチングして、電極ＳＩＮ、シールド用電極１７ａ及び接続電極１８ａを形成することで、図３（ｂ）に示すように上部部材６が完成することになる。 After this formation, the plating layer 31 is etched to form the electrode SIN, the shield electrode 17a, and the connection electrode 18a, whereby the upper member 6 is completed as shown in FIG.

上述の工程で下部部材２、上部部材６を形成した後、図４に示す組立工程を経て所望の赤外線検出器Ａを完成させるのである。 After the lower member 2 and the upper member 6 are formed in the above-described process, a desired infrared detector A is completed through an assembly process shown in FIG.

この組立工程では、まずスペーサ１０を介してステム９上に下部部材２を載置するとともに端子ピン１１ａ、１１ｂを下部部材２に形成している貫通孔２０、２０に下面側から夫々貫挿させる。同様に端子ピン１１ｃを対応する貫通孔に貫挿させる（図４（ａ））。 In this assembly process, first, the lower member 2 is placed on the stem 9 via the spacer 10, and the terminal pins 11a and 11b are inserted through the through holes 20 and 20 formed in the lower member 2 from the lower surface side. . Similarly, the terminal pin 11c is inserted into the corresponding through hole (FIG. 4A).

次に下部部材２上に上部部材６を載置するとともに、接続電極１８ａ、１８ｂを導電性接着剤（或いは半田）１９によって接合固定する（図４（ｂ））。この際貫通孔２０の上端開口の直上に上部部材６のシールド用電極１７ａが位置し、また下部部材２のシールド用電極１７ｂが上部部材６の凹部７の下方に位置することになる。 Next, the upper member 6 is placed on the lower member 2, and the connection electrodes 18a and 18b are joined and fixed with a conductive adhesive (or solder) 19 (FIG. 4B). At this time, the shield electrode 17 a of the upper member 6 is positioned immediately above the upper end opening of the through hole 20, and the shield electrode 17 b of the lower member 2 is positioned below the recess 7 of the upper member 6.

次に凹部７の両側の電極ＳＩＮに赤外線検出素子Ｘの検出出力端を接合して赤外線検出素子Ｘを凹部７の上方に実装する（図４（ｃ））。これにより上部部材６と下部部材２とからなる回路ブロック１がステム９上に搭載されたことになる。 Next, the detection output ends of the infrared detection element X are joined to the electrodes SIN on both sides of the recess 7 to mount the infrared detection element X above the recess 7 (FIG. 4C). As a result, the circuit block 1 including the upper member 6 and the lower member 2 is mounted on the stem 9.

この後、回路ブロック１を内部に収めながらキャップ８をステム９上に被着して封止すれば、図１（ａ）に示す赤外線検出器Ａが完成することになるのである。 Thereafter, if the cap 8 is attached onto the stem 9 and sealed while the circuit block 1 is housed inside, the infrared detector A shown in FIG. 1A is completed.

以上のように構成された本実施形態では、検出信号出力用電極２１と赤外線検出素子Ｘの検出出力端を接続する電極ＳＩＮとの間にシールド用電極１７ａ、１７ｂが介在することで、両電極２１、ＳＩＮでの容量結合を抑制して最上面で近接するような構造を回避し、赤外線検出素子Ｘの感度を損なうことがなく、その上同じ面において近接させる場合のように赤外線検出素子Ｘの検出出力端を接続する電極と、信号処理用回路部の検出信号出力用電極との間にシールド電位の電極を介在させる構造に比して、上部部材６の下面にシールド用電極１７ａを低コストで容易に形成できるという利点がある。 In the present embodiment configured as described above, the shield electrodes 17a and 17b are interposed between the detection signal output electrode 21 and the electrode SIN connecting the detection output terminal of the infrared detection element X. 21. Suppressing capacitive coupling in SIN to avoid a structure that is close to the uppermost surface, without impairing the sensitivity of the infrared detecting element X, and in addition to making the infrared detecting element X close to the same surface Compared to a structure in which an electrode having a shield potential is interposed between the electrode connecting the detection output terminals of the first signal output terminal and the detection signal output electrode of the signal processing circuit unit, the shield electrode 17a is provided on the lower surface of the upper member 6 at a lower level. There is an advantage that it can be easily formed at low cost.

（実施形態２）
本実施形態は、図５に示すように端子ピン１１ａ、１１ｂを貫挿させる下部部材２の貫通孔２０及び端子ピン１１ｃを貫挿させる貫通孔（図示せず）の直上に位置する上部部材６に窓孔３２を設けた点で実施形態１と相違する。この窓孔３２は、下部部材２上に上部部材６を載せた状態が完了した後、キャップ８をステム９に被着する前の最終外観検査時に窓孔３２を介して電極２１に対する端子ピン１１ａ、１１ｂ（及び１１ｃ）の接合状態を目視するためのものである。 (Embodiment 2)
In the present embodiment, as shown in FIG. 5, the upper member 6 is located directly above the through hole 20 of the lower member 2 through which the terminal pins 11a and 11b are inserted and the through hole (not shown) through which the terminal pin 11c is inserted. The difference from the first embodiment is that a window hole 32 is provided in the first embodiment. After the state in which the upper member 6 is placed on the lower member 2 is completed, the window hole 32 is connected to the terminal pin 11a with respect to the electrode 21 through the window hole 32 during the final appearance inspection before the cap 8 is attached to the stem 9. 11b (and 11c) for visual observation.

この窓孔３２は、図６（ａ）、（ｂ）の工程（図３（ａ）、（ｂ）の工程と同じ）を終了後、図６（ｃ）に穿設されるもので、穿設によって本実施形態の上部部材６が完成する。 This window hole 32 is formed in FIG. 6C after finishing the steps of FIGS. 6A and 6B (same as the steps of FIGS. 3A and 3B). Thus, the upper member 6 of this embodiment is completed.

尚下部部材２の形成工程は上述の実施形態１の場合と同じであるので、図示及びその説明は省略する。 In addition, since the formation process of the lower member 2 is the same as the case of the above-mentioned Embodiment 1, illustration and its description are abbreviate | omitted.

図７（ａ）〜（ｃ）は本実施形態の組立工程を示しており、この工程は最終外観検査時に窓孔３２を利用する点以外は実施形態１の図４（ａ）〜（ｃ）の工程と同じであるので、工程の説明は省略する。 FIGS. 7A to 7C show the assembly process of this embodiment, and this process is the same as FIGS. 4A to 4C of Embodiment 1 except that the window hole 32 is used during the final appearance inspection. Since it is the same as the process of, description of the process is omitted.

尚端子ピン１１ａ、１１ｂ（及び１１ｃ）の電極２１への接合を、上部部材６を下部部材２上に載置後に、赤外線検出素子Ｘの接合と同時に窓孔３２を介して行うようにしても良い。この場合接合工数を削減することができる。 The terminal pins 11a, 11b (and 11c) may be joined to the electrode 21 through the window hole 32 simultaneously with the joining of the infrared detecting element X after the upper member 6 is placed on the lower member 2. good. In this case, the number of joining steps can be reduced.

（実施形態３）
本実施形態は、図８（ａ）に示すように下部部材２の貫通孔２０の上端開口周縁に内周面がテーパー状の凹み部３３を形成した点で実施形態２の構成と相違する。この凹み部３３は、端子ピン１１ａ、１１ｂを電極２１に接合に用いる導電性接着剤（又は半田）２２の塗布量を増やすためのもので、塗布量を増やすことで、工程条件幅を広げて生産性の向上を図れるようにしてある。 (Embodiment 3)
As shown in FIG. 8A, the present embodiment is different from the configuration of the second embodiment in that a recess 33 having a tapered inner peripheral surface is formed on the periphery of the upper end opening of the through hole 20 of the lower member 2. The recess 33 is for increasing the application amount of the conductive adhesive (or solder) 22 used for joining the terminal pins 11a and 11b to the electrode 21. By increasing the application amount, the process condition width is widened. Productivity can be improved.

尚その他の構成は実施形態２と同じであるので説明は省略する。また本実施形態の構成を実施形態１に採用しても良い。 Since other configurations are the same as those of the second embodiment, description thereof is omitted. The configuration of the present embodiment may be adopted in the first embodiment.

（実施形態４）
本実施形態は、図８（ｂ）に示すように下部部材２の貫通孔２０の上端開口に対向する上部部材６の下面に下向き開口の空所３４を形成し、この空所３４の内面にグランド電位に接続されたシールド用電極１７ａを形成した点で実施形態１と相違する。 (Embodiment 4)
This embodiment forms a cavity 34 downward opening in the lower surface of the upper member 6 which faces the upper opening of the lower portion member 2 of the through hole 20 as shown in FIG. 8 (b), the inner surface of the cavity 34 The second embodiment is different from the first embodiment in that a shield electrode 17a connected to the ground potential is formed.

この空所３４によって端子ピン１１ａ、１１ｂの高さ寸法の許容を広く設定でき、ステム９の製造工程の負荷を軽減できて、ステム９の製造コストを下げることができ、また端子ピン１１ａ、１１ｂを電極２１に接続するために用いる導電性接着剤（又は半田）２２の塗布量の許容値も増やすことができ、生産性の向上も図れる。 The space 34 allows a wide tolerance for the height of the terminal pins 11a and 11b, reduces the load in the manufacturing process of the stem 9, reduces the manufacturing cost of the stem 9, and reduces the manufacturing cost of the terminal pins 11a and 11b. The allowable value of the coating amount of the conductive adhesive (or solder) 22 used for connecting the electrode to the electrode 21 can be increased, and the productivity can be improved.

尚端子ピン１１ａ、１１ｂとシールド用電極１７ａとの短絡を防ぐために、シールド層３５の表面に絶縁層（レジスト）を形成しても勿論良い。 Of course, an insulating layer (resist) may be formed on the surface of the shield layer 35 in order to prevent a short circuit between the terminal pins 11a and 11b and the shield electrode 17a.

尚その他の構成は実施形態１と同じであるので説明は省略する。また本実施形態の構成を実施形態２に採用しても良い。 Since other configurations are the same as those of the first embodiment, description thereof is omitted. The configuration of the present embodiment may be adopted in the second embodiment.

（実施形態５）
本実施形態は、図８（ｃ）に示すように下部部材２の肉厚を太くして、その中間部位にシールド層３５を形成した点に特徴ある。 (Embodiment 5)
As shown in FIG. 8C, the present embodiment is characterized in that the thickness of the lower member 2 is increased and a shield layer 35 is formed at an intermediate portion thereof.

本実施形態は、グランド電位に接続されたシールド電極層３５を下部部材２の中間層として設けることで、上部部材６の接続電極１８ａに接続する接続電極１８ｂを下部部材２に設けることによるシールド用電極の欠落がなくなり、容量結合性の低下が抑えられ、これにより高い感度を確保することができる。 In the present embodiment, the shield electrode layer 35 connected to the ground potential is provided as an intermediate layer of the lower member 2, so that the connection electrode 18 b connected to the connection electrode 18 a of the upper member 6 is provided on the lower member 2. Loss of the electrode is eliminated, and a decrease in capacitive coupling can be suppressed, thereby ensuring high sensitivity.

尚下部部材２、上部部材６の形成は上述した加熱プレス以外に機械加工によって形成しても良い。 The lower member 2 and the upper member 6 may be formed by machining other than the above-described heating press.

（実施形態６）
ところで実施形態１乃至５は、ＩＣ５を回路基板３にフリップ実装するものであったが、本実施形態はＩＣ５をワイヤボンディング４０により実装したものである。 (Embodiment 6)
In the first to fifth embodiments, the IC 5 is flip-mounted on the circuit board 3, but in this embodiment, the IC 5 is mounted by wire bonding 40.

本実施形態の場合、図９（ａ）に示すように回路基板３の下面にＩＣ５を実装し、電子部品４を下部部材２に埋設して回路ブロック１を形成している。そしてステム９上に回路ブロック１を実装する際には、図９（ｂ）に示すようにＩＣ５を実装した面側にスペーサ１０を載置してスペーサ１０の中央孔１０ａにＩＣ５を収めるとともに、スペーサ１０を回路基板３に接着固定し、この接着固定後、図９（ｃ）に示すように中央孔１０ａに樹脂４１を充填して封止し、その後図９（ｄ）に示すように接着固定したスペーサ１０を介して回路ブロック１をステム９上に搭載してスペーサ１０をステム９に接着固定するのである。 In the case of this embodiment, as shown in FIG. 9A, the IC 5 is mounted on the lower surface of the circuit board 3, and the electronic component 4 is embedded in the lower member 2 to form the circuit block 1. When the circuit block 1 is mounted on the stem 9, as shown in FIG. 9B, the spacer 10 is placed on the surface side where the IC 5 is mounted, and the IC 5 is accommodated in the central hole 10a of the spacer 10, The spacer 10 is bonded and fixed to the circuit board 3, and after this bonding and fixing, the resin 41 is filled in the central hole 10a and sealed as shown in FIG. 9C, and then bonded as shown in FIG. 9D. The circuit block 1 is mounted on the stem 9 via the fixed spacer 10, and the spacer 10 is bonded and fixed to the stem 9.

尚その他の構成等は実施形態１〜５の何れの構成でも良いので、ここでは、図示及び説明を省略し、また同じ構成要素には同じ符号を付す。また下部部材２にＩＣ５を埋設する場合にあっても加熱プレス時にワイヤが断線しなければ、実施形態１の構成にも採用しても勿論良い。 Since other configurations may be any of the configurations of the first to fifth embodiments, illustration and description are omitted here, and the same components are denoted by the same reference numerals. Further, even when the IC 5 is embedded in the lower member 2, it is of course possible to adopt the configuration of the first embodiment as long as the wire is not broken at the time of heat pressing.

（ａ）は実施形態１の断面図、（ｂ）は実施形態１のキャップを外した状態の斜視図、（ｃ）は実施形態１の斜視図である。(A) is sectional drawing of Embodiment 1, (b) is a perspective view of the state which removed the cap of Embodiment 1, (c) is a perspective view of Embodiment 1. FIG. 実施形態１の下部部材の形成工程の説明図である。FIG. 5 is an explanatory diagram of a lower member forming process according to the first embodiment. 実施形態１の上部部材の形成工程の説明図である。FIG. 6 is an explanatory diagram of an upper member forming process according to the first embodiment. 実施形態１の組立工程の説明図である。FIG. 6 is an explanatory diagram of an assembly process of the first embodiment. 実施形態２の断面図である。6 is a cross-sectional view of a second embodiment. FIG. 実施形態２の上部部材の形成工程説明図である。FIG. 11 is an explanatory diagram of a process for forming an upper member according to the second embodiment. 実施形態２の組立説明図である。FIG. 6 is an assembly explanatory diagram of Embodiment 2. （ａ）は実施形態３の断面図、（ｂ）は実施形態４の断面図、（ｃ）は実施形態５の断面図である。(A) is sectional drawing of Embodiment 3, (b) is sectional drawing of Embodiment 4, (c) is sectional drawing of Embodiment 5. FIG. （ａ）は実施形態６の回路ブロックの斜視図、（ｂ）〜（ｄ）は実施形態６の回路ブロックのステムへの搭載工程の説明図である。(A) is a perspective view of the circuit block of Embodiment 6, (b)-(d) is explanatory drawing of the mounting process to the stem of the circuit block of Embodiment 6. FIG. 赤外線検出器の回路構成図である。It is a circuit block diagram of an infrared detector. （ａ）は従来例の断面図、（ｂ）は従来例の実使用時の分解斜視図である。(A) is sectional drawing of a prior art example, (b) is an exploded perspective view at the time of actual use of a prior art example. （ａ）は別の従来例の３次元回路ブロックの分解斜視図、（ｂ）は別の従来例のキャップを外した状態の斜視図、（ｃ）は別の従来例の斜視図である。(A) is an exploded perspective view of a three-dimensional circuit block of another conventional example, (b) is a perspective view with a cap of another conventional example removed, and (c) is a perspective view of another conventional example.

符号の説明Explanation of symbols

Ａ赤外線検出器
Ｘ赤外線検出素子
ＳＩＮ電極
１回路ブロック
２下部部材
３回路基板
４電子部品
５ＩＣ
６上部部材
７凹部
８キャップ
９ステム
１０スペーサ
１１ａ〜１１ｃ端子ピン
１３導電性接着剤
１４光学フィルタ
１５赤外線通過窓
１６ガラス封止材
１７ａ、１７ｂシールド用電極
１８ａ、１８ｂ接続電極
１９導電性接着剤
２０貫通孔
２１検出信号出力用電極
２２導電性接着剤
２３配線パターン
２４スルーホール A Infrared detector X Infrared detector SIN Electrode 1 Circuit block 2 Lower member 3 Circuit board 4 Electronic component 5 IC
6 Upper member 7 Recess 8 Cap 9 Stem 10 Spacers 11a to 11c Terminal pin 13 Conductive adhesive 14 Optical filter 15 Infrared passage window 16 Glass sealing material 17a, 17b Shielding electrodes 18a, 18b Connection electrode 19 Conductive adhesive 20 Through hole 21 Detection signal output electrode 22 Conductive adhesive 23 Wiring pattern 24 Through hole

Claims

樹脂からなる上部部材と、該上部部材の下方に配置される樹脂からなる下部部材とを積層するブロックをキャンパッケージ用の器台上方に配置するものであって、
前記上部部材は、上面には熱絶縁部を介して赤外線検出素子を搭載し該赤外線検出素子の検出出力端に接続する電極を有し、下面にはシールド電位に接続するシールド用電極並びに前記下部部材との接続電極を形成し、
前記下部部材は、信号処理用回路部の回路部品を埋設するとともに前記上部部材の接続電極に対応する上面位置に接続電極を設けて対応する前記上部部材の接続電極に接合し、
前記器台は上方に突出させた複数の端子ピンを前記下部部材を貫通する貫通孔に前記下部部材の下面側から上面側に貫挿させるとともに、前記端子ピンの内の少なくとも検出信号用端子ピンの上端部を、該上端部周囲の前記下部部材の上面部に臨む前記信号処理用回路部の検出信号出力用電極と電気的に接合しており、前記シールド用電極は、前記赤外線検出素子の検出出力端に接続する電極と、前記検出信号出力用電極との間に前記シールド用電極を挟む形で位置され、前記シールド用電極が前記検出信号用端子ピンの上端部と対向配置されていることを特徴とする赤外線検出器。 A block for laminating an upper member made of resin and a lower member made of resin arranged below the upper member is arranged above the stand for the can package,
The upper member has an electrode connected to a detection output end of the infrared detection element mounted on the upper surface via a thermal insulating portion on the upper surface, and a shield electrode connected to a shield potential on the lower surface and the lower portion Forming a connection electrode with the member,
The lower member embeds a circuit component of the signal processing circuit unit and provides a connection electrode at an upper surface position corresponding to the connection electrode of the upper member, and joins to the corresponding connection electrode of the upper member,
The instrument base has a plurality of terminal pins projecting upward inserted into a through hole penetrating the lower member from the lower surface side to the upper surface side of the lower member, and at least the detection signal terminal pin of the terminal pin Is electrically joined to the detection signal output electrode of the signal processing circuit unit facing the upper surface of the lower member around the upper end, and the shield electrode is connected to the infrared detection element. The shield electrode is positioned between the electrode connected to the detection output terminal and the detection signal output electrode, and the shield electrode is disposed opposite to the upper end of the detection signal terminal pin. An infrared detector.

前記検出信号用端子ピンの上端部周囲の前記下部部材上面に凹み部を形成していることを特徴とする請求項１記載の赤外線検出器。 2. The infrared detector according to claim 1 , wherein a recess is formed on the upper surface of the lower member around the upper end of the detection signal terminal pin .

前記検出信号用端子ピンの上端部の上方の前記上部部材下面に下向き開口の空所を設けるとともに、該空所にシールド層を形成していることを特徴とする請求項１又は２記載の赤外線検出器。 3. The infrared ray according to claim 1 , wherein a space of a downward opening is provided in the lower surface of the upper member above the upper end portion of the detection signal terminal pin, and a shield layer is formed in the space. Detector.

前記下部部材の厚み方向の中間部位にシールド層を介在させていることを特徴とする請求項１乃至３の何れか１項記載の赤外線検出器。 Infrared detector of any one Kouki placement of claims 1 to 3, characterized in that it is interposed shield layer in the middle portion in the thickness direction of the lower member.

請求項１の赤外線検出器の製造方法であって、上面側に凹部からなる熱絶縁部を設けた上部部材を形成する工程と、
前記熱絶縁部の周囲の前記上部部材上面に赤外線検出素子の検出出力端を接合する電極を形成し、且つ前記上部部材の下面に接続電極を形成する工程と、
回路部品を実装した回路基板と樹脂材とを一体成形して下部部材を形成するとともに該下部部材の形成と同時に又は下部部材の形成後に前記貫通孔を設ける工程と、
前記上部部材の接続電極に対応する接続電極を前記下部部材上面に形成し、且つ前記貫通孔の上端開口周縁から該貫通孔の内周面に亘って端子接続部用の電極を形成する工程と、
キャンパッケージ用の器台の上面に突出している端子ピンを対応する前記下部部材の前記貫通孔に貫挿させて前記下部部材を前記器台上に搭載し、各貫通孔の上端開口に臨んだ各端子ピンの上端部を前記端子接続部用の電極に電気的に接合する工程と、
前記下部部材の上面側に前記上部部材を乗せて下部部材の上面側の接続電極と前記上部部材の下面側の接続電極とを電気的に接合する工程と、
前記上部部材の上面の素子用電極に赤外線検出素子の検出出力端を電気的に接合して赤外線検出素子を前記上部部材に実装する工程と、
前記下部部材及び上部部材からなる回路ブロックを内部に収めながらキャップを前記器台上に被着封止する工程とを有することを特徴とする赤外線検出器の製造方法。 The method of manufacturing an infrared detector according to claim 1, wherein a step of forming an upper member provided with a heat insulating portion formed of a recess on the upper surface side;
Forming an electrode for joining a detection output end of an infrared detection element on the upper surface of the upper member around the thermal insulating portion, and forming a connection electrode on the lower surface of the upper member;
Forming a lower member by integrally molding a circuit board on which a circuit component is mounted and a resin material, and providing the through hole simultaneously with the formation of the lower member or after the formation of the lower member;
Forming a connection electrode corresponding to the connection electrode of the upper member on the upper surface of the lower member, and forming an electrode for a terminal connection portion from the periphery of the upper end opening of the through hole to the inner peripheral surface of the through hole; ,
A terminal pin protruding from the upper surface of the can package base is inserted into the corresponding through hole of the lower member so that the lower member is mounted on the base and faces the upper end opening of each through hole. Electrically bonding the upper end of each terminal pin to the electrode for the terminal connection;
Placing the upper member on the upper surface side of the lower member and electrically joining the connection electrode on the upper surface side of the lower member and the connection electrode on the lower surface side of the upper member;
Electrically bonding the detection output end of the infrared detection element to the element electrode on the upper surface of the upper member to mount the infrared detection element on the upper member;
The lower member and a manufacturing method of the infrared detector you, characterized in that the circuit block consisting of an upper member and a step of the Chakufutome the cap on the instrument table while contained therein.