JP2010054250A - Infrared detector - Google Patents

Infrared detector Download PDF

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Publication number
JP2010054250A
JP2010054250A JP2008217422A JP2008217422A JP2010054250A JP 2010054250 A JP2010054250 A JP 2010054250A JP 2008217422 A JP2008217422 A JP 2008217422A JP 2008217422 A JP2008217422 A JP 2008217422A JP 2010054250 A JP2010054250 A JP 2010054250A
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JP
Japan
Prior art keywords
cap
circuit block
infrared
cover
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2008217422A
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Japanese (ja)
Inventor
Makoto Sato
信 佐藤
Hiroshi Nakamura
浩 中村
Naoyuki Nishikawa
尚之 西川
Tomohiro Uetsu
智宏 上津
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Panasonic Electric Works Co Ltd
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Panasonic Electric Works Co Ltd
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Priority to JP2008217422A priority Critical patent/JP2010054250A/en
Publication of JP2010054250A publication Critical patent/JP2010054250A/en
Pending legal-status Critical Current

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  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To prevent contact of a circuit block with sealing compound while the clearance in a cap is sealed airtightly by the sealing compound, and to prevent reduction of the detection sensitivity of infrared rays and breakage of a circuit block. <P>SOLUTION: This infrared detector comprises an infrared detecting element 1, a circuit block 2 having a signal processing circuit, a stem 3, a cap 4, and a cover 5. The stem 3 is formed in a plate shape, and the circuit block 2 is mounted on one surface thereof. The cap 4 is formed in a closed-end cylindrical shape whose one end is opened, stores the circuit block 2 inside, and is stuck to the stem 3. An opening window section 4b is disposed on a bottom section 4a facing the infrared detecting element 1 of the cap 4. The cover 5 is made of light-transmitting material, and is arranged from the inside of the cap 4 so as to cover the window section 4b. The cap 4 has a stepped section 4d projected in the inside direction over the whole circumference in a side wall section 4c near the bottom section 4a, and the clearance between the cover 5 and the window section 4b is filled with the sealing compound. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、人体検知等に用いる赤外線検出器に関するものである。   The present invention relates to an infrared detector used for human body detection and the like.

従来より、赤外線の変化量を読み取ることで人体を検出する種々の赤外線検出器が提供
されている（例えば、特許文献１及び２参照）。そして、この様な赤外線検出器は、不審
者の進入を検知する防犯装置や、省エネルギー対策として照明等の負荷制御を行う制御装
置に幅広く使われている。 Conventionally, various infrared detectors that detect a human body by reading the amount of change in infrared rays have been provided (see, for example, Patent Documents 1 and 2). Such infrared detectors are widely used in crime prevention devices that detect the entry of suspicious persons and control devices that perform load control such as lighting as energy saving measures.

また、赤外線検出器の一例として、図９に示すようなものもある。この赤外線検出器は
、赤外線検出素子５１、及び赤外線検出素子５１から出力される信号を処理する信号処理
回路が設けられた回路ブロック５２と、ステム５３と、キャップ５４と、カバー５５とを
備える。ステム５３は、略円板状に形成されて、一面側には回路ブロック５２が載置され
る。キャップ５４は、一端が開口する有底円筒状に形成されて、内部に回路ブロック５２
を収納し且つステム５３に被着される。また、キャップ５４の赤外線検出素子５１に対向
する底部５４ａの中心部には、矩形状に開口してなる窓部５４ｂが設けられている。カバ
ー５５は、透光性材料によって全体として窓部５４ｂと略同形状に形成され、レンズ部５
５ａと鍔部５５ｂとを有し、キャップ５４の内側より窓部５４ｂを塞いでいる。レンズ部
５５ａは、外部からの赤外線を屈折させて、赤外線検出素子５１の受光面（図９の上面）
へ集光させる。鍔部５５ｂは、レンズ部５５ａの周縁から外側へ延設され、窓部５４ｂの
周縁に固着される。 An example of the infrared detector is shown in FIG. This infrared detector includes an infrared detection element 51 and a circuit block 52 provided with a signal processing circuit for processing a signal output from the infrared detection element 51, a stem 53, a cap 54, and a cover 55. The stem 53 is formed in a substantially disc shape, and the circuit block 52 is placed on one surface side. The cap 54 is formed in a bottomed cylindrical shape with one end opened, and the circuit block 52 is formed inside the cap 54.
And is attached to the stem 53. In addition, a window portion 54b that is opened in a rectangular shape is provided at the center portion of the bottom portion 54a that faces the infrared detection element 51 of the cap 54. The cover 55 is formed of a translucent material as a whole in substantially the same shape as the window portion 54b, and the lens portion 5
5a and a flange portion 55b, and closes the window portion 54b from the inside of the cap 54. The lens portion 55a refracts infrared light from the outside to receive the light receiving surface of the infrared detecting element 51 (upper surface in FIG. 9).
Condensed to The flange portion 55b extends outward from the periphery of the lens portion 55a and is fixed to the periphery of the window portion 54b.

ところでこのカバー５５をキャップ５４の窓部５４ｂに固着する作業手順について、図
１０を参照して簡単に説明する。先ず、図１０（ａ）に示すように、窓部５４ｂの周縁の
接着部５６に導電性接着剤を塗布する。次に、図１０（ｂ）に示すように、レンズ部５５
ａをキャップ５４の内側より窓部５４ｂに嵌め込み、導電性接着剤を介して鍔部５５ｂを
接着部５６に接着する。しかし、導電性接着剤による接着だけでは、カバー５５と窓部５
４ｂとの隙間を完全に封止することはできない。そこで、図１０（ｃ）に示すように、導
電性接着剤が十分に硬化した後、封止剤を鍔部５５ｂの周縁に流し込むことで前記隙間を
封止する。尚、封止部５７は、封止剤が固化した状態の部材である。
特開２００８−２０４２０号公報 特開２００８−１２８９１２号公報 By the way, an operation procedure for fixing the cover 55 to the window portion 54b of the cap 54 will be briefly described with reference to FIG. First, as shown to Fig.10 (a), a conductive adhesive is apply | coated to the adhesion part 56 of the periphery of the window part 54b. Next, as shown in FIG.
A is fitted into the window portion 54b from the inside of the cap 54, and the flange portion 55b is bonded to the bonding portion 56 via a conductive adhesive. However, the cover 55 and the window portion 5 are only bonded by the conductive adhesive.
The gap with 4b cannot be completely sealed. Therefore, as shown in FIG. 10C, after the conductive adhesive is sufficiently cured, the gap is sealed by pouring the sealant into the periphery of the flange portion 55b. The sealing portion 57 is a member in a state where the sealing agent is solidified.
JP 2008-20420 A JP 2008-128912 A

しかしながら、従来の赤外線検出器の場合、底部５４ａ近傍の側壁部５４ｃと接する封
止剤が、図１１に示すように、表面張力によって側壁部５４ｃに沿ってキャップ５４の開
口側（図１１の下方向）へ這い上がる場合がある。そして、封止剤がこの這い上がり状態
のまま封止部５７として固化すれば、キャップ５４をステム５３に被着する際、回路ブロ
ック５２の端部が、キャップ５４内で前記這い上がり部分と接触する。この接触により、
赤外線検出素子５１の受光面の中心部と、レンズ部５５ａの光軸との間にズレが生じたり
、前記光軸方向に対する前記受光面とレンズ部５５ａとの距離に差異が生じたりする。因
って、赤外線の検出感度が低下するという問題があった。また、この接触により回路ブロ
ック５２が破損するという問題もあった。 However, in the case of a conventional infrared detector, the sealant that contacts the side wall 54c in the vicinity of the bottom 54a is exposed to the opening side of the cap 54 along the side wall 54c by the surface tension as shown in FIG. Direction). Then, if the sealing agent is solidified as the sealing portion 57 in this scooping state, the end portion of the circuit block 52 contacts the scooping portion in the cap 54 when the cap 54 is attached to the stem 53. To do. This contact
There is a difference between the center of the light receiving surface of the infrared detecting element 51 and the optical axis of the lens portion 55a, or there is a difference in the distance between the light receiving surface and the lens portion 55a with respect to the optical axis direction. Therefore, there has been a problem that the detection sensitivity of infrared rays is lowered. Further, there is a problem that the circuit block 52 is damaged by this contact.

本発明は上記事由に鑑みて為されたものであり、その目的は、キャップ内の隙間を封止
剤で気密に封止しつつ、回路ブロックと封止剤との接触を防ぎ、赤外線の検出感度の低下
、及び回路ブロックの破損を防ぐことができる赤外線検出器を提供することにある。 The present invention has been made in view of the above reasons, and its purpose is to prevent contact between the circuit block and the sealant while airtightly sealing the gap in the cap with the sealant, and to detect infrared rays. An object of the present invention is to provide an infrared detector capable of preventing a reduction in sensitivity and a circuit block from being damaged.

請求項１の発明は、上記目的を達成するために、赤外線検出素子、及び前記赤外線検出
素子から出力される信号を処理する信号処理回路が設けられた回路ブロックと、板状に形
成されて前記回路ブロックが一面側に載置されるステムと、一端が開口する有底筒状に形
成されて内部に前記回路ブロックを収納し且つ前記ステムに被着されるキャップと、前記
キャップの前記赤外線検出素子に対向する底部に開口した窓部を塞ぐ透光性のカバーとを
備え、前記カバーは、前記赤外線検出素子の受光面へ赤外線を集光するレンズ部と、前記
レンズ部の周縁から外側へ延設され前記窓部の周縁に固着される鍔部とを有し、前記キャ
ップは、前記底部近傍の側壁部に、全周に亘って内側方向へ突設された段部を具備し、前
記カバーと前記窓部との隙間は、封止剤によって封止されることを特徴とする。 In order to achieve the above-mentioned object, the invention according to claim 1 is formed in a plate shape and a circuit block provided with an infrared detection element and a signal processing circuit for processing a signal output from the infrared detection element. A stem on which the circuit block is placed on one surface side, a cap formed in a bottomed cylindrical shape with one end opened, the circuit block being housed therein and attached to the stem, and the infrared detection of the cap A translucent cover that closes a window that opens at the bottom facing the element, the cover condensing infrared rays on the light receiving surface of the infrared detection element, and from the periphery of the lens part to the outside A cap that extends and is fixed to the periphery of the window, and the cap includes a stepped portion projecting inward over the entire circumference on the side wall near the bottom. The gap between the cover and the window is Characterized in that it is sealed by a sealant.

この発明によれば、前記キャップは、前記底部近傍の側壁部に、全周に亘って内側方向
へ突設された段部を具備しているので、前記段部より前記キャップの開口側へ、封止剤が
表面張力によって這い上がることはない。因って、前記キャップ内の前記カバーと前記窓
部との隙間を封止剤で気密に封止しつつ、前記回路ブロックと封止剤との接触を防ぎ、前
記赤外線検出素子の受光面の位置ズレによる赤外線の検出感度の低下、及び前記回路ブロ
ックの破損を防ぐことができる。 According to this invention, since the cap includes a stepped portion projecting inwardly over the entire circumference on the side wall portion near the bottom portion, from the stepped portion to the opening side of the cap, The sealant does not scoop up due to surface tension. Therefore, the gap between the cover and the window in the cap is hermetically sealed with a sealant, while preventing contact between the circuit block and the sealant, and the light receiving surface of the infrared detection element It is possible to prevent a decrease in infrared detection sensitivity due to a positional shift and damage to the circuit block.

請求項２の発明は、請求項１の発明において、前記回路ブロックは、前記段部に対して
前記レンズ部の光軸方向に当接することを特徴とする。 According to a second aspect of the present invention, in the first aspect of the invention, the circuit block is in contact with the stepped portion in the optical axis direction of the lens portion.

この発明によれば、前記回路ブロックは、前記段部に対して前記レンズ部の光軸方向に
に当接するので、前記赤外線検出素子の受光面と前記レンズ部との距離を一定に保つこと
ができる。因って、前記回路ブロックを、前記レンズ部からの赤外線が効率良く前記受光
面へ集光する場所に安定して配設することができる。 According to this invention, since the circuit block contacts the stepped portion in the optical axis direction of the lens portion, the distance between the light receiving surface of the infrared detecting element and the lens portion can be kept constant. it can. Therefore, the circuit block can be stably disposed at a place where the infrared rays from the lens unit are efficiently condensed on the light receiving surface.

請求項３の発明は、請求項１または２の発明において、前記回路ブロックは、前記キャ
ップの前記段部より開口側の前記側壁部によって、前記レンズ部の光軸と直交する方向に
狭持されることを特徴とする。 According to a third aspect of the present invention, in the first or second aspect of the invention, the circuit block is held in a direction perpendicular to the optical axis of the lens portion by the side wall portion on the opening side from the stepped portion of the cap. It is characterized by that.

この発明によれば、前記回路ブロックは、前記キャップの前記段部より開口側の前記側
壁部によって、前記レンズ部の光軸と直交する方向に狭持されるので、前記受光面の中心
部と前記レンズ部の光軸とが交わる位置で、前記回路ブロックを保つことができ、効率良
く赤外線を受光面へ集光することができる。 According to this invention, the circuit block is held in the direction perpendicular to the optical axis of the lens portion by the side wall portion on the opening side of the step portion of the cap. The circuit block can be maintained at a position where the optical axis of the lens unit intersects, and infrared rays can be efficiently condensed on the light receiving surface.

本発明では、キャップ内の隙間を封止剤で気密に封止しつつ、回路ブロックと封止剤と
の接触を防ぎ、赤外線の検出感度の低下、及び回路ブロックの破損を防ぐことができると
いう効果がある。 In the present invention, while the gap in the cap is hermetically sealed with a sealant, the contact between the circuit block and the sealant can be prevented, the infrared detection sensitivity can be reduced, and the circuit block can be prevented from being damaged. effective.

（実施形態１）
以下、本発明の実施形態１について、図１〜図３を参照して説明する。 (Embodiment 1)
Hereinafter, Embodiment 1 of the present invention will be described with reference to FIGS.

本実施形態１の赤外線検出器は、図１及び図２に示すように、焦電素子からなる赤外線
検出素子１及び信号処理回路が設けられた回路ブロック２と、ステム３と、キャップ４と
、カバー５とを備える。 As shown in FIGS. 1 and 2, the infrared detector according to the first embodiment includes an infrared detection element 1 including a pyroelectric element, a circuit block 2 provided with a signal processing circuit, a stem 3, a cap 4, And a cover 5.

回路ブロック２は、図２に示すように、各々同形の略八角形板状に形成される第１のプ
リント配線板６、樹脂層７、シールド板８及び第２のプリント配線板９が順に積層するこ
とで形成される。第１のプリント配線板６の一面側には、上述の信号処理回路の構成要素
であるＩＣ１０がフリップチップ実装され、他面側には、複数のチップ状の電子部品１１
が半田リフローにより実装されている（図２のＩＣ１０実装面は下面）。尚、ＩＣ１０に
は、赤外線検出素子１の出力を増幅する増幅回路などが集積化されている。樹脂層７は、
合成樹脂材によって形成されてなる。シールド板８は、ガラスエポキシ等の絶縁性基板の
表面を、金属材（例えば、銅）によって形成される金属層で被覆してなる。尚、このシー
ルド板８は、赤外線検出素子１と前記増幅回路との容量結合による発振現象を防ぐための
ものであり、前記増幅回路の増幅度が比較的少なく、発振現象が起こりにくい場合は、シ
ールド板８を省略してもよい。第２のプリント配線板９には、赤外線検出素子１が実装さ
れるとともに、赤外線検出素子１と第２のプリント配線板９とを熱絶縁するための熱絶縁
用孔９ａが厚み方向に貫設されている。この熱絶縁用孔９ａにより、赤外線検出素子１と
シールド板８との間に空気層が形成されて、赤外線検出素子１の感度が高くなる。そして
、これら第１のプリント配線板６、樹脂層７、シールド板８及び第２のプリント配線板９
には、各々スルーホール６ｂ、７ｂ、８ｂ、９ｂが厚み方向に貫設されている。 As shown in FIG. 2, the circuit block 2 has a first printed wiring board 6, a resin layer 7, a shield plate 8, and a second printed wiring board 9, which are formed in the substantially same octagonal plate shape. It is formed by doing. On one surface side of the first printed wiring board 6, an IC 10 that is a component of the signal processing circuit described above is flip-chip mounted, and on the other surface side, a plurality of chip-shaped electronic components 11 are mounted.
Is mounted by solder reflow (the IC10 mounting surface in FIG. 2 is the lower surface). The IC 10 is integrated with an amplifier circuit that amplifies the output of the infrared detection element 1. The resin layer 7
It is formed of a synthetic resin material. The shield plate 8 is formed by coating the surface of an insulating substrate such as glass epoxy with a metal layer formed of a metal material (for example, copper). The shield plate 8 is for preventing an oscillation phenomenon due to capacitive coupling between the infrared detection element 1 and the amplifier circuit. When the amplification degree of the amplifier circuit is relatively small and the oscillation phenomenon hardly occurs, The shield plate 8 may be omitted. The infrared detection element 1 is mounted on the second printed wiring board 9, and a thermal insulation hole 9 a for thermally insulating the infrared detection element 1 and the second printed wiring board 9 is provided in the thickness direction. Has been. The heat insulating hole 9a forms an air layer between the infrared detecting element 1 and the shield plate 8, and the sensitivity of the infrared detecting element 1 is increased. And these 1st printed wiring boards 6, resin layer 7, shield board 8, and 2nd printed wiring board 9
The through holes 6b, 7b, 8b, and 9b are respectively provided in the thickness direction.

ステム３は、鋼材によって略円板状に形成され、その周縁には外側へ延びるフランジ部
３ａが設けられている。また、ステム３には、３本（給電用、信号出力用、グランド用）
の端子ピン３ｂが厚み方向に貫通して配設されている。この３本の端子ピン３ｂを、上述
の回路ブロック２のスルーホール６ｂ、７ｂ、８ｂ、９ｂへ順に挿通させて接着剤で固着
させることで、回路ブロック２が、ステム３の一面側（図１及び図２では上面側）に載置
される。そして、赤外線検出素子１と第１のプリント配線板６の信号処理回路とが、端子
ピン３ｂを介して電気的に接続される。尚、ステム３と回路ブロック２の間には、絶縁材
によって略正方形状に形成されるスペーサ１２が介装されている。 The stem 3 is formed in a substantially disc shape by a steel material, and a flange portion 3a extending outward is provided on the periphery thereof. Three stems 3 (for power supply, signal output, and ground)
The terminal pin 3b is provided penetrating in the thickness direction. The three terminal pins 3b are sequentially inserted into the through holes 6b, 7b, 8b, 9b of the circuit block 2 and fixed with an adhesive so that the circuit block 2 is attached to one surface side of the stem 3 (FIG. 1). And on the upper surface side in FIG. And the infrared detection element 1 and the signal processing circuit of the 1st printed wiring board 6 are electrically connected through the terminal pin 3b. Note that a spacer 12 formed in an approximately square shape with an insulating material is interposed between the stem 3 and the circuit block 2.

キャップ４は、鋼材によって一端が開口する（図１及び図２では下面）有底円筒状に形
成されてなり、開口の周縁から外側に向かって外鍔部４ｅが延設されている。そして、キ
ャップ４は、ステム３に載置される回路ブロック２を内部に収納し、且つ外鍔部４ｅをス
テム３のフランジ部３ａに対して溶接することで、ステム３に被着される。また、キャッ
プ４の赤外線検出素子１に対向する底部４ａの中心部には、矩形状（本実施形態では、正
方形状）に開口してなる窓部４ｂが設けられている。そして、本実施形態１のキャップ４
は、図１及び図３に示すように、底部４ａ付近の側壁部４ｃに、全周に亘って内側方向へ
突設された段部４ｄを具備している。 The cap 4 is formed in a bottomed cylindrical shape whose one end is opened by a steel material (the lower surface in FIGS. 1 and 2), and an outer flange portion 4e is extended outward from the periphery of the opening. The cap 4 is attached to the stem 3 by housing the circuit block 2 placed on the stem 3 and welding the outer flange portion 4 e to the flange portion 3 a of the stem 3. In addition, a window portion 4b having a rectangular shape (in the present embodiment, a square shape) is provided at the center portion of the bottom portion 4a of the cap 4 facing the infrared detection element 1. And the cap 4 of this Embodiment 1
As shown in FIGS. 1 and 3, the side wall 4c in the vicinity of the bottom 4a is provided with a step 4d projecting inward along the entire circumference.

カバー５は、透光性材料によって全体として窓部４ｂと略同形状に形成され、レンズ部
５ａと鍔部５ｂとを有し、窓部４ｂを覆うようにキャップ４の内側から配設されている。
レンズ部５ａは、シリコンレンズからなる半導体レンズであり、外部からの赤外線を屈折
させて、赤外線検出素子１の受光面（図１の上面）へ集光させる。鍔部５ｂは、レンズ部
５ａの周縁から外側へ延設されており、窓部４ｂ周縁の導電性接着剤が塗布された接着部
１３に固着される。この接着部１３を介してカバー５とキャップ４とが電気的に接続され
るので、外部からのノイズに対する電磁シールド効果を高め、赤外線検出素子１を電磁ノ
イズから守ることができる。 The cover 5 is formed of a translucent material as a whole in substantially the same shape as the window portion 4b, has a lens portion 5a and a flange portion 5b, and is disposed from the inside of the cap 4 so as to cover the window portion 4b. Yes.
The lens unit 5a is a semiconductor lens made of a silicon lens, and refracts infrared light from the outside to collect it on the light receiving surface (upper surface in FIG. 1) of the infrared detecting element 1. The flange portion 5b extends outward from the periphery of the lens portion 5a, and is fixed to the adhesive portion 13 to which the conductive adhesive on the periphery of the window portion 4b is applied. Since the cover 5 and the cap 4 are electrically connected via the adhesive portion 13, the electromagnetic shielding effect against external noise can be enhanced and the infrared detecting element 1 can be protected from electromagnetic noise.

本実施形態１の赤外線検出器の要旨について説明する。   The gist of the infrared detector according to the first embodiment will be described.

従来技術で述べた様に、導電性接着剤による固着だけでは、カバー５と窓部４ｂとの隙
間を完全に封止できず、封止剤を流し込む必要がある。従来の赤外線検出器では、封止剤
が、表面張力によって側壁部４ｃに沿ってキャップ４の開口側へ這い上がりを引き起こし
、回路ブロック２と、這い上がり状態で固化した封止部１４とが接触する場合があった。 As described in the prior art, the gap between the cover 5 and the window 4b cannot be completely sealed only by fixing with the conductive adhesive, and it is necessary to pour the sealant. In the conventional infrared detector, the sealant causes the surface tension to crawl up toward the opening side of the cap 4 along the side wall portion 4c, and the circuit block 2 and the sealing portion 14 solidified in the crawl-up state contact each other. There was a case.

しかし、本実施形態１の底部４ａ付近の側壁部４ｃには、段部４ｄが具備されており、
図３に示すように、封止剤を底部４ａと段部４ｄとカバー５の鍔部５ｂとによって形成さ
れる凹部に流し込めばよい。つまり、封止剤を、この段部４ｄよりキャップ４の開口側へ
溢れ出ないように流し込めば、封止剤が、段部４ｄよりキャップ４開口側の側壁部４ｃへ
表面張力によって這い上がることはない。因って、キャップ４内のカバー５と窓部４ｂと
の隙間を封止剤で気密に封止しつつ、回路ブロック２と封止剤との接触を防ぎ、赤外線の
検出感度の低下、及び回路ブロック２の破損を防ぐことができる。尚、封止部１４は、封
止剤が固化した状態の部材である。 However, the side wall 4c in the vicinity of the bottom 4a of Embodiment 1 is provided with a step 4d.
As shown in FIG. 3, the sealing agent may be poured into a recess formed by the bottom 4 a, the step 4 d, and the flange 5 b of the cover 5. That is, if the sealant is poured so as not to overflow from the step 4d to the opening side of the cap 4, the sealant crawls up to the side wall 4c on the cap 4 opening side by the surface tension from the step 4d. There is nothing. Therefore, the gap between the cover 5 and the window 4b in the cap 4 is hermetically sealed with a sealant, while preventing contact between the circuit block 2 and the sealant, reducing the infrared detection sensitivity, and Damage to the circuit block 2 can be prevented. The sealing part 14 is a member in a state where the sealing agent is solidified.

（実施形態２）
以下、本発明の実施形態２について、図４〜図６を参照して説明する。尚、本実施形態
２は、基本的な構成が実施形態１と共通であるので、共通の構成要素には、同一の符号を
付して説明を省略する。 (Embodiment 2)
Hereinafter, Embodiment 2 of the present invention will be described with reference to FIGS. Since the basic configuration of the second embodiment is the same as that of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

本実施形態２は、図４に示すように、回路ブロック２を、段部４ｄに対してレンズ部５
ａの光軸方向（図中の上下方向）に当接させる点に特徴がある。この当接により、前記光
軸方向に対するレンズ部５ａから赤外線検出素子１の受光面までの距離を一定に保つこと
ができる。即ち、レンズ部５ａの焦点距離と、レンズ部５ａから前記受光面までの距離と
が一致する位置に、回路ブロック２を安定して配設することができる。因って、レンズ部
５ａからの赤外線を効率良く前記受光面へ集光することができる。 In the second embodiment, as shown in FIG. 4, the circuit block 2 is connected to the lens unit 5 with respect to the stepped portion 4d.
It is characterized in that it abuts in the optical axis direction a (vertical direction in the figure). By this contact, the distance from the lens portion 5a to the light receiving surface of the infrared detecting element 1 in the optical axis direction can be kept constant. That is, the circuit block 2 can be stably disposed at a position where the focal length of the lens portion 5a matches the distance from the lens portion 5a to the light receiving surface. Therefore, the infrared rays from the lens unit 5a can be efficiently collected on the light receiving surface.

ところで、上述では回路ブロック２が当接するのは、実施形態１で示した段部４ｄであ
った。しかし、図５に示すように、段部４ｄ以外にもう１つ段部４ｆを同様に形成し、こ
の段部４ｆに当接させれば、回路ブロック２と封止剤との接触防止の効果を高めることが
できる。また、上述の段部４ｄ（又は４ｆ）は何れも、直角の階段状に内側へ突出したも
のであった。しかし、図６に示すように、底部４ａ近傍の側壁部ｃを、全周に亘って内側
へ曲折させて、更にレンズ部５ａの光軸方向に縮ませることで段部４ｄ（又は４ｆ）を形
成し、この段部４ｄ（又は４ｆ）に当接させれば、回路ブロック２と封止剤との接触防止
の効果を高めることができる。 By the way, in the above description, the circuit block 2 is in contact with the step portion 4d shown in the first embodiment. However, as shown in FIG. 5, if another step portion 4f is formed in the same manner in addition to the step portion 4d and brought into contact with the step portion 4f, the effect of preventing contact between the circuit block 2 and the sealant is achieved. Can be increased. Moreover, all the above-mentioned step part 4d (or 4f) protruded inward in the shape of a right-angled step. However, as shown in FIG. 6, the side wall portion c in the vicinity of the bottom portion 4a is bent inward over the entire circumference and further contracted in the optical axis direction of the lens portion 5a, whereby the step portion 4d (or 4f) is formed. If formed and brought into contact with the step 4d (or 4f), the effect of preventing contact between the circuit block 2 and the sealant can be enhanced.

（実施形態３）
以下、本発明の実施形態３について、図７及び図８を参照して説明する。尚、本実施形
態３は、基本的な構成が実施形態１と共通であるので、共通の構成要素には、同一の符号
を付して説明を省略する。 (Embodiment 3)
Hereinafter, Embodiment 3 of the present invention will be described with reference to FIGS. Since the basic configuration of the third embodiment is the same as that of the first embodiment, common components are denoted by the same reference numerals and description thereof is omitted.

本実施形態３の回路ブロック２は、図７に示すように、キャップ４の段部４ｄより開口
側の側壁部４ｃによって、レンズ部５ａの光軸と直交する方向（図中の左右方向）に狭持
される点に特徴がある。即ち、側壁部４ｃには、段部４ｄ以外にもう１つ段部４ｇが同様
に設けられ、この段部４ｇの内壁が回路ブロック２を狭持している。この狭持により、回
路ブロック２を赤外線検出素子１の受光面の中心部と、レンズ部５ａの光軸とが交わる位
置で保つことができる。そして、赤外線検出器の赤外線検知範囲は、図８に示すように、
レンズ部５ａを中心とした扇状に外側へ拡開する検知ゾーン１５内であるので、前記位置
で保つことにより、レンズ部５ａを介して効率良く赤外線を受光面へ集光することができ
る。 As shown in FIG. 7, the circuit block 2 according to the third embodiment is arranged in a direction (left and right direction in the drawing) orthogonal to the optical axis of the lens portion 5a by the side wall portion 4c on the opening side from the step portion 4d of the cap 4. It is characterized by being pinched. That is, the side wall portion 4c is similarly provided with another step portion 4g other than the step portion 4d, and the inner wall of the step portion 4g holds the circuit block 2. By this clamping, the circuit block 2 can be maintained at a position where the center of the light receiving surface of the infrared detecting element 1 and the optical axis of the lens portion 5a intersect. And the infrared detection range of the infrared detector is as shown in FIG.
Since it is in the detection zone 15 that expands outward in a fan shape with the lens portion 5a as the center, the infrared rays can be efficiently condensed on the light receiving surface via the lens portion 5a by maintaining the position in the above position.

尚、側壁部４ｃに新たに段部４ｇを設けなくても、例えば、キャップ４の開口側に向か
って拡開するように形成された側壁部４ｃが、回路ブロック２を狭持してもよい。また、
回路ブロック２は、実施形態２で述べた様に段部４ｄ、又は段部４ｆに当接しつつ、側壁
部４ｃに狭持されてもよい。 For example, the side wall portion 4c formed so as to expand toward the opening side of the cap 4 may sandwich the circuit block 2 without providing the step portion 4g on the side wall portion 4c. . Also,
As described in the second embodiment, the circuit block 2 may be held by the side wall portion 4c while being in contact with the step portion 4d or the step portion 4f.

本発明の実施形態１の赤外線検出器を示し、（ａ）は上面図、（ｂ）は断面図である。The infrared detector of Embodiment 1 of this invention is shown, (a) is a top view, (b) is sectional drawing. 同上における分解斜視図である。It is a disassembled perspective view in the same as the above. 同上における要部断面図である。It is principal part sectional drawing in the same as the above. 本発明の実施形態２の赤外線検出器を示し、（ａ）は上面図、（ｂ）は断面図である。The infrared detector of Embodiment 2 of this invention is shown, (a) is a top view, (b) is sectional drawing. 同上における２つの段部を有する赤外線検出器を示し、（ａ）は上面図、（ｂ）は断面図である。The infrared detector which has two step parts in the same as above is shown, (a) is a top view, (b) is sectional drawing. 同上における鋭角に突出する段部を有する赤外線検出器を示し、（ａ）は上面図、（ｂ）は断面図である。The infrared detector which has the step part which protrudes in the acute angle same as the above is shown, (a) is a top view, (b) is sectional drawing. 本発明の実施形態３の赤外線検出器を示し、（ａ）は上面図、（ｂ）は断面図である。The infrared detector of Embodiment 3 of this invention is shown, (a) is a top view, (b) is sectional drawing. 同上における赤外線を検知する範囲を示す側面図である。It is a side view which shows the range which detects the infrared rays in the same as the above. 従来の赤外線検出器の一例を示し、（ａ）は上面図、（ｂ）は断面図である。An example of the conventional infrared detector is shown, (a) is a top view, (b) is a sectional view. 従来の赤外線検出器の一例の窓部にカバーを固着する作業工程を示し、（ａ）は導電接着剤を塗布した一部断面斜視図、（ｂ）はカバーを窓部に被覆した一部断面斜視図、（ｃ）は封止剤を流し込んだ一部断面斜視図である。The operation | work process which adheres a cover to the window part of an example of the conventional infrared detector is shown, (a) is the partial cross section perspective view which apply | coated the electrically conductive adhesive, (b) is the partial cross section which coat | covered the cover on the window part. A perspective view and (c) are partial cross-sectional perspective views into which sealing agent was poured. 従来の赤外線検出器の一例の要部断面図である。It is principal part sectional drawing of an example of the conventional infrared detector.

符号の説明Explanation of symbols

１ 赤外線検出素子
２ 回路ブロック
３ ステム
４ キャップ
４ａ 底部
４ｂ 窓部
４ｃ 側壁部
４ｄ 段部
５ カバー

DESCRIPTION OF SYMBOLS 1 Infrared detector 2 Circuit block 3 Stem 4 Cap 4a Bottom part 4b Window part 4c Side wall part 4d Step part 5 Cover

Claims (3)

赤外線検出素子、及び前記赤外線検出素子から出力される信号を処理する信号処理回路
が設けられた回路ブロックと、板状に形成されて前記回路ブロックが一面側に載置される
ステムと、一端が開口する有底筒状に形成されて内部に前記回路ブロックを収納し且つ前
記ステムに被着されるキャップと、前記キャップの前記赤外線検出素子に対向する底部に
開口した窓部を塞ぐ透光性のカバーとを備え、前記カバーは、前記赤外線検出素子の受光
面へ赤外線を集光するレンズ部と、前記レンズ部の周縁から外側へ延設され前記窓部の周
縁に固着される鍔部とを有し、前記キャップは、前記底部近傍の側壁部に、全周に亘って
内側方向へ突設された段部を具備し、前記カバーと前記窓部との隙間は、封止剤によって
封止されることを特徴とする赤外線検出器。 An infrared detection element, a circuit block provided with a signal processing circuit for processing a signal output from the infrared detection element, a stem formed in a plate shape on which the circuit block is placed on one side, and one end A translucent cap that is formed in an open bottomed cylindrical shape, houses the circuit block therein and is attached to the stem, and closes a window opening at the bottom of the cap that faces the infrared detection element. The cover includes a lens part that collects infrared rays on a light receiving surface of the infrared detection element, and a flange part that extends outward from the periphery of the lens part and is fixed to the periphery of the window part. The cap includes a stepped portion projecting inward along the entire circumference on the side wall near the bottom, and the gap between the cover and the window is sealed with a sealant. Red characterized by being stopped Line detector. 前記回路ブロックは、前記段部に対して前記レンズ部の光軸方向に当接することを特徴
とする請求項１記載の赤外線検出器。 The infrared detector according to claim 1, wherein the circuit block is in contact with the step portion in an optical axis direction of the lens unit. 前記回路ブロックは、前記キャップの前記段部より開口側の前記側壁部によって、前記
レンズ部の光軸と直交する方向に狭持されることを特徴とする請求項１または２記載の赤
外線検出器。








3. The infrared detector according to claim 1, wherein the circuit block is held in a direction perpendicular to the optical axis of the lens unit by the side wall portion on the opening side of the stepped portion of the cap. .








JP2008217422A 2008-08-26 2008-08-26 Infrared detector Pending JP2010054250A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016121966A (en) * 2014-12-25 2016-07-07 パナソニックＩｐマネジメント株式会社 Infrared application device
US9587978B2 (en) 2011-12-14 2017-03-07 Panasonic Intellectual Property Management Co., Ltd. Infrared sensor
US10078007B2 (en) 2011-12-14 2018-09-18 Panasonic Intellectual Property Management Co., Ltd. Infrared sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07190856A (en) * 1993-12-27 1995-07-28 Matsushita Electric Ind Co Ltd Pyroelectric infrared sensor
JPH08128890A (en) * 1994-11-02 1996-05-21 Matsushita Electric Ind Co Ltd Infrared sensor
JP2008128912A (en) * 2006-11-22 2008-06-05 Matsushita Electric Works Ltd Infrared detector and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07190856A (en) * 1993-12-27 1995-07-28 Matsushita Electric Ind Co Ltd Pyroelectric infrared sensor
JPH08128890A (en) * 1994-11-02 1996-05-21 Matsushita Electric Ind Co Ltd Infrared sensor
JP2008128912A (en) * 2006-11-22 2008-06-05 Matsushita Electric Works Ltd Infrared detector and method of making the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9587978B2 (en) 2011-12-14 2017-03-07 Panasonic Intellectual Property Management Co., Ltd. Infrared sensor
US10078007B2 (en) 2011-12-14 2018-09-18 Panasonic Intellectual Property Management Co., Ltd. Infrared sensor
JP2016121966A (en) * 2014-12-25 2016-07-07 パナソニックＩｐマネジメント株式会社 Infrared application device

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