JP5443863B2 - 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 - Google Patents

銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 Download PDF

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Publication number
JP5443863B2
JP5443863B2 JP2009162717A JP2009162717A JP5443863B2 JP 5443863 B2 JP5443863 B2 JP 5443863B2 JP 2009162717 A JP2009162717 A JP 2009162717A JP 2009162717 A JP2009162717 A JP 2009162717A JP 5443863 B2 JP5443863 B2 JP 5443863B2
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JP
Japan
Prior art keywords
etching
copper
acid
containing material
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009162717A
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English (en)
Japanese (ja)
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JP2011017053A (ja
Inventor
祐次 正元
正和 下沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeka Corp
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Priority to JP2009162717A priority Critical patent/JP5443863B2/ja
Priority to TW099119136A priority patent/TWI518205B/zh
Priority to KR1020100058478A priority patent/KR20110005207A/ko
Priority to CN201010218563XA priority patent/CN101949013A/zh
Priority to CN201510670357.5A priority patent/CN105386055B/zh
Publication of JP2011017053A publication Critical patent/JP2011017053A/ja
Application granted granted Critical
Publication of JP5443863B2 publication Critical patent/JP5443863B2/ja
Priority to KR1020160070469A priority patent/KR101697460B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2009162717A 2009-07-09 2009-07-09 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法 Active JP5443863B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009162717A JP5443863B2 (ja) 2009-07-09 2009-07-09 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法
TW099119136A TWI518205B (zh) 2009-07-09 2010-06-11 含銅材料用蝕刻劑組成物及含銅材料之蝕刻方法（一）
KR1020100058478A KR20110005207A (ko) 2009-07-09 2010-06-21 동함유 재료용 에칭제 조성물 및 동함유 재료의 에칭 방법
CN201010218563XA CN101949013A (zh) 2009-07-09 2010-07-06 含铜材料用蚀刻剂组合物及含铜材料的蚀刻方法
CN201510670357.5A CN105386055B (zh) 2009-07-09 2010-07-06 含铜材料用蚀刻剂组合物及含铜材料的蚀刻方法
KR1020160070469A KR101697460B1 (ko) 2009-07-09 2016-06-07 동함유 재료용 에칭제 조성물 및 동함유 재료의 에칭 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009162717A JP5443863B2 (ja) 2009-07-09 2009-07-09 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法

Publications (2)

Publication Number Publication Date
JP2011017053A JP2011017053A (ja) 2011-01-27
JP5443863B2 true JP5443863B2 (ja) 2014-03-19

Family

ID=43452635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009162717A Active JP5443863B2 (ja) 2009-07-09 2009-07-09 銅含有材料用エッチング剤組成物及び銅含有材料のエッチング方法

Country Status (4)

Country Link
JP (1) JP5443863B2 (zh)
KR (2) KR20110005207A (zh)
CN (2) CN105386055B (zh)
TW (1) TWI518205B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201250059A (en) * 2011-03-08 2012-12-16 Nagase Chemtex Corp Etching liquid
WO2013005631A1 (ja) * 2011-07-04 2013-01-10 三菱瓦斯化学株式会社 銅または銅を主成分とする化合物のエッチング液
CN102291952B (zh) * 2011-08-05 2013-04-24 奥士康精密电路（惠州）有限公司 多层pcb板的制备方法
US9068267B2 (en) * 2012-03-13 2015-06-30 Adeka Corporation Etching liquid composition and etching method
SG11201408660QA (en) 2012-09-28 2015-01-29 Mec Co Ltd Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board
KR102079658B1 (ko) * 2013-04-05 2020-02-20 해성디에스 주식회사 구리 함유 금속막 식각액 조성물 및 이를 이용한 식각 방법
JP6354084B2 (ja) * 2013-04-16 2018-07-11 メック株式会社 エッチング液、補給液、及び配線形成方法
CN103215592B (zh) * 2013-04-27 2015-07-08 苏州诺菲纳米科技有限公司 蚀刻膏、蚀刻膏的应用以及利用蚀刻膏蚀刻纳米银导电材料的方法
CN104278273A (zh) * 2014-06-13 2015-01-14 叶涛 线路板低酸高效型酸性氯化铜蚀刻液
KR102204210B1 (ko) * 2014-06-27 2021-01-18 동우 화인켐 주식회사 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법
JP6333455B1 (ja) * 2017-08-23 2018-05-30 メック株式会社 銅のマイクロエッチング剤および配線基板の製造方法
CN107460464B (zh) * 2017-08-28 2019-11-01 厦门大学 一种含铜材料的表面处理方法
CN109862706B (zh) * 2019-01-24 2020-08-14 绍兴市微益电器有限公司 一种电路板印刷工艺
WO2020261995A1 (ja) * 2019-06-28 2020-12-30 株式会社Adeka 組成物及びエッチング方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001181868A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk 銅及び銅合金用のマイクロエッチング剤
JP2001181867A (ja) * 1999-12-20 2001-07-03 Asahi Denka Kogyo Kk マイクロエッチング剤
JP4350364B2 (ja) * 2002-12-12 2009-10-21 昭和電工株式会社 洗浄剤組成物、半導体ウェーハの洗浄方法および製造方法
JP4055595B2 (ja) * 2003-02-05 2008-03-05 凸版印刷株式会社 金属材料のエッチング液およびエッチング方法
JP4018559B2 (ja) * 2003-02-27 2007-12-05 メック株式会社 電子基板の製造方法
TWI282377B (en) * 2003-07-25 2007-06-11 Mec Co Ltd Etchant, replenishment solution and method for producing copper wiring using the same
JP2007180172A (ja) * 2005-12-27 2007-07-12 Mec Kk 基板の製造方法
DE602006009614D1 (de) * 2006-02-17 2009-11-19 Atotech Deutschland Gmbh Zusammensetzung und Verfahren zur Behandlung der Oberflächen von Kupferlegierungen, um die Haftfähigkeit zwischen der Metalloberfläche und dem gebundenen polymerischen Material zu verbessern

Also Published As

Publication number Publication date
KR101697460B1 (ko) 2017-01-17
CN105386055B (zh) 2018-07-10
JP2011017053A (ja) 2011-01-27
CN101949013A (zh) 2011-01-19
KR20110005207A (ko) 2011-01-17
TWI518205B (zh) 2016-01-21
CN105386055A (zh) 2016-03-09
TW201120247A (en) 2011-06-16
KR20160076496A (ko) 2016-06-30

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