JP5438799B2 - Ledアセンブリ及びモジュール - Google Patents
Ledアセンブリ及びモジュール Download PDFInfo
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- JP5438799B2 JP5438799B2 JP2012117079A JP2012117079A JP5438799B2 JP 5438799 B2 JP5438799 B2 JP 5438799B2 JP 2012117079 A JP2012117079 A JP 2012117079A JP 2012117079 A JP2012117079 A JP 2012117079A JP 5438799 B2 JP5438799 B2 JP 5438799B2
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- 239000003990 capacitor Substances 0.000 claims description 29
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- 239000012528 membrane Substances 0.000 claims description 3
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- 230000005611 electricity Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 239000003086 colorant Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
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- 238000009966 trimming Methods 0.000 description 1
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
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- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
- H05B45/28—Controlling the colour of the light using temperature feedback
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/42—Antiparallel configurations
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48237—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
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- H01L2924/30—Technical effects
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- H01L2924/3011—Impedance
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims (23)
- 第1の面及びそれと反対側の第2の面を有する基板;
前記基板の前記第1の面に隣接するように配置された第1の導電板、及び前記第2の面に隣接するように配置された第2の導電板、を有するキャパシタ;及び
前記第1の導電板に電気的に接続され且つ前記基板に熱的に結合された逆並列LED構造;
を有し、
前記キャパシタは第1のキャパシタであり;
前記第1の導電板は、前記基板の前記第1の面に隣接して配置された第1の導電板であり;
前記第2の導電板は、前記第1の導電板に対向する第2の導電性アイランドであり;且つ
前記逆並列LED構造は、前記第1の導電板に電気的に接続された第1の逆並列LED構造であり;
当該アセンブリは更に:
前記第2の導電性アイランドに電気的に接続された第1のスイッチ;
前記基板の前記第1の面に隣接して配置された前記第1の導電板と、前記基板の前記第2の面に隣接して、前記第1の導電板に対向して配置された第3の導電性アイランドとを有する第2のキャパシタ;
前記第1の導電板に電気的に接続された第2の逆並列LED構造;及び
前記第3の導電性アイランドに電気的に接続された第2のスイッチ;
を有する、
LEDアセンブリ。 - 前記逆並列LED構造は第1の蓄電板上に配置されている、請求項1に記載のアセンブリ。
- 前記基板は、温度に依存する誘電率を有する、請求項1に記載のアセンブリ。
- 前記基板は、所定の温度で最大値をとる誘電率を有する、請求項1に記載のアセンブリ。
- 前記逆並列LED構造及び前記キャパシタは、前記逆並列LED構造の動作特性を補償するようにマッチングされている、請求項1に記載のアセンブリ。
- 前記第1の導電板は複数の第1の蓄電板を有し;
前記第2の導電板は複数の第2の蓄電板を有し;
前記第1の蓄電板は、前記第2の蓄電板と交互に配置され、且つ前記第2の蓄電板と実質的に平行に配置されており;
前記第1の蓄電板と前記第2の蓄電板との間に前記基板が配置されている;
請求項1に記載のアセンブリ。 - 前記第1の導電板の反対側で前記第1及び第2の逆並列LED構造に電気的に接続された共有コネクタ、を更に有する請求項1に記載のアセンブリ。
- 前記第2の導電性アイランドの反対側で前記第1のスイッチに電気的に接続され、且つ前記第3の導電性アイランドの反対側で前記第2のスイッチに電気的に接続された共有コネクタ、を更に有する請求項1に記載のアセンブリ。
- 前記第1のスイッチはDIPスイッチ、駆動多重スイッチ及び膜抵抗スイッチから成るグループから選択されている、請求項1に記載のアセンブリ。
- 前記第1のスイッチはスイッチ制御信号に応答する、請求項1に記載のアセンブリ。
- LEDドライバ;及び
前記LEDドライバに並列接続された少なくとも1つのLEDアセンブリであり、LEDアレイ及び切替え可能なインピーダンスアレイを有する少なくとも1つのLEDアセンブリ;
を有する出力調整可能なLEDモジュールであって:
前記LEDアレイは少なくとも1つの逆並列LED構造を有し、前記切替え可能なインピーダンスアレイは並列接続された複数のインピーダンス回路を有し、該複数のインピーダンス回路の各々は、スイッチに直列接続されたキャパシタを有し、
前記LEDアセンブリは更に:
第1の面及びそれと反対側の第2の面を有する基板;
前記基板の前記第1の面に隣接するように配置された第1の導電性アイランドと、前記基板の前記第2の面に隣接するように配置された第2の導電板とを有する第1のキャパシタ;
前記第1の導電性アイランドに電気的に接続された第1の逆並列LED構造;
前記基板の前記第1の面に隣接して配置された第2の導電性アイランドと、前記基板の前記第2の面に隣接して配置された前記第2の導電板とを有する第2のキャパシタ;
前記第2の導電性アイランドに電気的に接続された第2の逆並列LED構造;及び
前記第1の導電性アイランドの反対側で前記第1の逆並列LED構造に電気的に接続され、且つ前記第2の導電性アイランドの反対側で前記第2の逆並列LED構造に電気的に接続された共有コネクタ;
を有する、
モジュール。 - 前記複数のインピーダンス回路内の前記スイッチを作動させるように前記切替え可能なインピーダンスアレイに動作的に接続されたコントローラ、を更に有する請求項11に記載のモジュール。
- 温度信号を生成するように前記LEDアレイに熱的に接続された温度センサを更に有し、前記コントローラは該温度信号に応答する、請求項12に記載のモジュール。
- 前記コントローラは、前記温度信号が温度限界を超えているときに前記LEDアレイを流れる電流を減少させるように、前記温度信号に応答する、請求項13に記載のモジュール。
- 前記コントローラは、前記LEDアレイからの一定の光出力を維持するように、前記温度信号に応答する、請求項13に記載のモジュール。
- 前記切替え可能なインピーダンスアレイの1つ内の前記キャパシタの各々は、前記切替え可能なインピーダンスアレイの該1つ内のその他のキャパシタの静電容量とは異なる静電容量を有する、請求項11に記載のモジュール。
- 前記切替え可能なインピーダンスアレイの1つ内の前記キャパシタの静電容量のパターンは、前記切替え可能なインピーダンスアレイの該1つ内の前記キャパシタの数をnとして、1:2:4:8:・・・:2(n−1)にされている、請求項11に記載のモジュール。
- 前記少なくとも1つのLEDアセンブリは複数のLEDアセンブリから成り、該複数のLEDアセンブリの各々は、該複数のLEDアセンブリの内のその他とは異なる色の光を生成する、請求項11に記載のモジュール。
- LEDドライバ;
前記LEDドライバに並列接続された少なくとも1つのLEDアセンブリであり、該LEDアセンブリはLEDアレイ及び切替え可能なインピーダンスアレイを有し、該LEDアレイは少なくとも1つのLED構造を有し、該切替え可能なインピーダンスアレイは並列接続された複数のインピーダンス回路を有し、該複数のインピーダンス回路の各々はスイッチに直列接続された抵抗を有する、少なくとも1つのLEDアセンブリ;
前記複数のインピーダンス回路内の前記スイッチを作動させるように前記切替え可能なインピーダンスアレイに動作的に接続されたコントローラであり、温度信号に応答するコントローラ;及び
前記温度信号を生成するように前記LEDアレイに熱的に接続された温度センサ;
を有し、
前記LEDアセンブリは更に:
第1の面及びそれと反対側の第2の面を有する基板;
前記基板の前記第1の面に隣接するように配置された第1の導電板と、前記基板の前記第2の面に隣接するように配置された第2の導電性アイランドとを有する第1のキャパシタ;
前記第1の導電板に電気的に接続された第1の逆並列LED構造;
前記第2の導電性アイランドに電気的に接続された第1のスイッチ;
前記基板の前記第1の面に隣接して配置された前記第1の導電板と、前記基板の前記第2の面に隣接して、前記第1の導電板に対向して配置された第3の導電性アイランドとを有する第2のキャパシタ;
前記第1の導電板に電気的に接続された第2の逆並列LED構造;及び
前記第3の導電性アイランドに電気的に接続された第2のスイッチ;
を有する、
出力調整可能なLEDモジュール。 - 前記コントローラは、前記温度信号が温度限界を超えているときに前記LEDアレイを流れる電流を減少させるように、前記温度信号に応答する、請求項19に記載のモジュール。
- 前記コントローラは、前記LEDアレイからの一定の光出力を維持するように、前記温度信号に応答する、請求項19に記載のモジュール。
- 前記切替え可能なインピーダンスアレイの1つ内の前記抵抗の抵抗値のパターンは、前記切替え可能なインピーダンスアレイの該1つ内の前記抵抗の数をnとして、1:2:4:8:・・・:2(n−1)にされている、請求項19に記載のモジュール。
- 前記少なくとも1つのLEDアセンブリは複数のLEDアセンブリから成り、該複数のLEDアセンブリの各々は、該複数のLEDアセンブリの内のその他とは異なる色の光を生成する、請求項19に記載のモジュール。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68681205P | 2005-06-02 | 2005-06-02 | |
US60/686,812 | 2005-06-02 |
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JP2008514290A Division JP2008543075A (ja) | 2005-06-02 | 2006-06-01 | Ledアセンブリ及びモジュール |
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Publication Number | Publication Date |
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JP2012182486A JP2012182486A (ja) | 2012-09-20 |
JP5438799B2 true JP5438799B2 (ja) | 2014-03-12 |
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Application Number | Title | Priority Date | Filing Date |
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JP2008514290A Pending JP2008543075A (ja) | 2005-06-02 | 2006-06-01 | Ledアセンブリ及びモジュール |
JP2012117079A Expired - Fee Related JP5438799B2 (ja) | 2005-06-02 | 2012-05-23 | Ledアセンブリ及びモジュール |
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JP2008514290A Pending JP2008543075A (ja) | 2005-06-02 | 2006-06-01 | Ledアセンブリ及びモジュール |
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---|---|
US (1) | US7830095B2 (ja) |
EP (1) | EP1891685B1 (ja) |
JP (2) | JP2008543075A (ja) |
KR (1) | KR101256392B1 (ja) |
CN (1) | CN101189736B (ja) |
BR (1) | BRPI0611190A2 (ja) |
MY (1) | MY147397A (ja) |
TW (1) | TW200702824A (ja) |
WO (1) | WO2006129291A2 (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8896228B2 (en) | 2007-04-27 | 2014-11-25 | Rtc Inc. | Light emitting diode circuits for general lighting |
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-
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- 2006-05-30 TW TW095119284A patent/TW200702824A/zh unknown
- 2006-05-31 MY MYPI20062520A patent/MY147397A/en unknown
- 2006-06-01 JP JP2008514290A patent/JP2008543075A/ja active Pending
- 2006-06-01 KR KR1020087000031A patent/KR101256392B1/ko not_active IP Right Cessation
- 2006-06-01 CN CN2006800192927A patent/CN101189736B/zh not_active Expired - Fee Related
- 2006-06-01 BR BRPI0611190-4A patent/BRPI0611190A2/pt not_active Application Discontinuation
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US20080218095A1 (en) | 2008-09-11 |
JP2008543075A (ja) | 2008-11-27 |
US7830095B2 (en) | 2010-11-09 |
WO2006129291A3 (en) | 2007-04-26 |
CN101189736A (zh) | 2008-05-28 |
CN101189736B (zh) | 2010-05-19 |
MY147397A (en) | 2012-11-30 |
KR20080027322A (ko) | 2008-03-26 |
BRPI0611190A2 (pt) | 2011-02-22 |
JP2012182486A (ja) | 2012-09-20 |
EP1891685A2 (en) | 2008-02-27 |
EP1891685B1 (en) | 2016-11-30 |
WO2006129291A2 (en) | 2006-12-07 |
TW200702824A (en) | 2007-01-16 |
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