JP5437519B1 - Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法 - Google Patents

Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法 Download PDF

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Publication number: JP5437519B1
Authority: JP; Japan
Prior art keywords: copper alloy; alloy strip; annealing; mass; based copper
Prior art date: 2013-07-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

JP2013158462A

Other languages

English (en)

Japanese (ja)

Other versions

JP2015028201A (ja

Inventor

康弘岡藤

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JX Nippon Mining and Metals Corp

Original Assignee

JX Nippon Mining and Metals Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-07-31

Filing date

2013-07-31

Publication date

2014-03-12

2013-07-31 Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp

2013-07-31 Priority to JP2013158462A priority Critical patent/JP5437519B1/ja

2014-03-12 Application granted granted Critical

2014-03-12 Publication of JP5437519B1 publication Critical patent/JP5437519B1/ja

2014-06-17 Priority to TW103120813A priority patent/TWI550107B/zh

2014-07-14 Priority to KR1020140088298A priority patent/KR101612185B1/ko

2014-07-28 Priority to CN201410362021.8A priority patent/CN104342581B/zh

2015-02-12 Publication of JP2015028201A publication Critical patent/JP2015028201A/ja

Status Active legal-status Critical Current

2033-07-31 Anticipated expiration legal-status Critical

Links

229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 47
229910020711 Co—Si Inorganic materials 0.000 title claims abstract description 33
238000004519 manufacturing process Methods 0.000 title claims abstract description 11
238000005096 rolling process Methods 0.000 claims abstract description 15
238000009864 tensile test Methods 0.000 claims abstract description 6
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
229910052802 copper Inorganic materials 0.000 claims abstract description 4
239000010949 copper Substances 0.000 claims abstract description 4
239000012535 impurity Substances 0.000 claims abstract 2
238000000137 annealing Methods 0.000 claims description 29
238000005097 cold rolling Methods 0.000 claims description 23
230000032683 aging Effects 0.000 claims description 7
238000005098 hot rolling Methods 0.000 claims description 5
229910052782 aluminium Inorganic materials 0.000 claims description 3
229910052787 antimony Inorganic materials 0.000 claims description 3
229910052785 arsenic Inorganic materials 0.000 claims description 3
229910052790 beryllium Inorganic materials 0.000 claims description 3
229910052796 boron Inorganic materials 0.000 claims description 3
229910052804 chromium Inorganic materials 0.000 claims description 3
229910052742 iron Inorganic materials 0.000 claims description 3
229910052749 magnesium Inorganic materials 0.000 claims description 3
229910052748 manganese Inorganic materials 0.000 claims description 3
229910052759 nickel Inorganic materials 0.000 claims description 3
229910052718 tin Inorganic materials 0.000 claims description 3
229910052719 titanium Inorganic materials 0.000 claims description 3
229910052725 zinc Inorganic materials 0.000 claims description 3
229910052726 zirconium Inorganic materials 0.000 claims description 3
230000017525 heat dissipation Effects 0.000 description 6
239000000463 material Substances 0.000 description 6
230000000052 comparative effect Effects 0.000 description 4
230000007423 decrease Effects 0.000 description 4
230000000694 effects Effects 0.000 description 4
239000002244 precipitate Substances 0.000 description 4
239000000243 solution Substances 0.000 description 4
229910045601 alloy Inorganic materials 0.000 description 3
239000000956 alloy Substances 0.000 description 3
239000013078 crystal Substances 0.000 description 3
239000004973 liquid crystal related substance Substances 0.000 description 3
238000007747 plating Methods 0.000 description 3
229910018098 Ni-Si Inorganic materials 0.000 description 2
229910018529 Ni—Si Inorganic materials 0.000 description 2
238000000034 method Methods 0.000 description 2
239000000203 mixture Substances 0.000 description 2
238000001556 precipitation Methods 0.000 description 2
238000005728 strengthening Methods 0.000 description 2
230000035882 stress Effects 0.000 description 2
238000012360 testing method Methods 0.000 description 2
229910021244 Co2Si Inorganic materials 0.000 description 1
238000005452 bending Methods 0.000 description 1
238000005336 cracking Methods 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
230000007547 defect Effects 0.000 description 1
230000005611 electricity Effects 0.000 description 1
239000012776 electronic material Substances 0.000 description 1
238000005530 etching Methods 0.000 description 1
229910000765 intermetallic Inorganic materials 0.000 description 1
239000011159 matrix material Substances 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
238000000465 moulding Methods 0.000 description 1
239000002245 particle Substances 0.000 description 1
230000035515 penetration Effects 0.000 description 1
238000004881 precipitation hardening Methods 0.000 description 1
239000000047 product Substances 0.000 description 1
230000002250 progressing effect Effects 0.000 description 1
239000002994 raw material Substances 0.000 description 1
239000011856 silicon-based particle Substances 0.000 description 1
229910000679 solder Inorganic materials 0.000 description 1
239000006104 solid solution Substances 0.000 description 1
238000010998 test method Methods 0.000 description 1

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Chemical & Material Sciences (AREA)
Conductive Materials (AREA)
Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Microelectronics & Electronic Packaging (AREA)
Crystallography & Structural Chemistry (AREA)
Non-Insulated Conductors (AREA)

JP2013158462A 2013-07-31 2013-07-31 Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法 Active JP5437519B1 (ja)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
JP2013158462A JP5437519B1 (ja)	2013-07-31	2013-07-31	Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法
TW103120813A TWI550107B (zh)	2013-07-31	2014-06-17	Cu-Co-Si copper alloy strip and method for producing the same
KR1020140088298A KR101612185B1 (ko)	2013-07-31	2014-07-14	Cu－Co－Si 계 구리 합금조 및 그 제조 방법
CN201410362021.8A CN104342581B (zh)	2013-07-31	2014-07-28	Cu‑Co‑Si系铜合金条及其制造方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2013158462A JP5437519B1 (ja)	2013-07-31	2013-07-31	Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法

Publications (2)

Publication Number	Publication Date
JP5437519B1 true JP5437519B1 (ja)	2014-03-12
JP2015028201A JP2015028201A (ja)	2015-02-12

Family

ID=50396682

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2013158462A Active JP5437519B1 (ja)	2013-07-31	2013-07-31	Ｃｕ−Ｃｏ−Ｓｉ系銅合金条及びその製造方法

Country Status (4)

Country	Link
JP (1)	JP5437519B1 (zh)
KR (1)	KR101612185B1 (zh)
CN (1)	CN104342581B (zh)
TW (1)	TWI550107B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104912626B (zh) *	2015-05-20	2017-09-29	黄钦生	一种汽车超低排放器
JP2017089003A (ja) *	2015-11-03	2017-05-25	株式会社神戸製鋼所	放熱部品用銅合金板
JP7222899B2 (ja) *	2017-02-04	2023-02-15	マテリオンコーポレイション	銅－ニッケル－スズ合金の作製方法
CN108118186A (zh) *	2018-02-06	2018-06-05	重庆熵臻科技有限公司	一种变压器用环保型高熔点耐久铜合金型材及其制造工艺
JP6879971B2 (ja) *	2018-03-30	2021-06-02	Ｊｘ金属株式会社	銅合金材料、電子部品、電子機器及び銅合金材料の製造方法
JP6816056B2 (ja) *	2018-03-30	2021-01-20	Ｊｘ金属株式会社	銅合金材料、電子部品、電子機器及び銅合金材料の製造方法
JP6928597B2 (ja) *	2018-12-13	2021-09-01	古河電気工業株式会社	銅合金板材およびその製造方法ならびに絞り加工品、電気・電子部品用部材、電磁波シールド材および放熱部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4830035B2 (ja) *	2010-04-14	2011-12-07	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｓｉ−Ｃｏ系合金及びその製造方法
JP4708497B1 (ja)	2010-06-03	2011-06-22	Ｊｘ日鉱日石金属株式会社	Ｃｕ−Ｃｏ−Ｓｉ系合金板及びその製造方法
JP4834781B1 (ja) *	2010-08-24	2011-12-14	Ｊｘ日鉱日石金属株式会社	電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP2013104082A (ja) *	2011-11-11	2013-05-30	Jx Nippon Mining & Metals Corp	Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法

2013
- 2013-07-31 JP JP2013158462A patent/JP5437519B1/ja active Active
2014
- 2014-06-17 TW TW103120813A patent/TWI550107B/zh active
- 2014-07-14 KR KR1020140088298A patent/KR101612185B1/ko active IP Right Grant
- 2014-07-28 CN CN201410362021.8A patent/CN104342581B/zh active Active

Also Published As

Publication number	Publication date
JP2015028201A (ja)	2015-02-12
TWI550107B (zh)	2016-09-21
CN104342581B (zh)	2017-08-04
TW201518520A (zh)	2015-05-16
CN104342581A (zh)	2015-02-11
KR20150015367A (ko)	2015-02-10
KR101612185B1 (ko)	2016-04-12

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