JP5384270B2 - ローダ - Google Patents
ローダ Download PDFInfo
- Publication number
- JP5384270B2 JP5384270B2 JP2009218244A JP2009218244A JP5384270B2 JP 5384270 B2 JP5384270 B2 JP 5384270B2 JP 2009218244 A JP2009218244 A JP 2009218244A JP 2009218244 A JP2009218244 A JP 2009218244A JP 5384270 B2 JP5384270 B2 JP 5384270B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- cassette
- loader
- dicing frame
- moving body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
12 ロードポート
12B 移動体
12C 移動体駆動機構(駆動機構)
14 ウエハ搬送機構(搬送機構)
15 マッピングセンサ
W ウエハ
DFW ダイシングフレーム付きウエハ
Claims (3)
- 複数のウエハが収納された第1のカセットと複数のダイシングフレーム付きウエハが収納された第2のカセットの双方を載置し得るロードポートと、上記第1のカセット内のウエハと上記第2のカセット内のダイシングフレーム付きウエハの双方を搬送し得る搬送機構と、を備え、上記各ウエハの電気的特性検査を行う検査装置に用いられるローダであって、上記ロードポートは、上記第1、第2のカセットの双方を載置し得る移動体と、上記第1のカセットが載置された時に上記移動体を初期位置から上記搬送機構の上記ウエハの受け渡し位置へ移動させる駆動機構と、を有し、上記第2のカセットが上記移動体に載置された時には、上記移動体の初期位置が上記第2のカセット内のダイシングフレーム付きウエハの受け渡し位置になり、上記ダイシングフレーム付きウエハの受け渡し位置が上記ウエハの受け渡し位置と一致することを特徴とするローダ。
- 上記駆動機構は、シリンダ機構からなることを特徴とする請求項1に記載のローダ。
- 上記受け渡し位置で上記第1のカセット内のウエハまたは上記第2のカセット内のダイシングフレーム付きウエハをマッピングするマッピングセンサを設けたことを特徴とする請求項1または請求項2に記載のローダ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009218244A JP5384270B2 (ja) | 2009-09-21 | 2009-09-21 | ローダ |
KR1020100089380A KR101250135B1 (ko) | 2009-09-21 | 2010-09-13 | 로더 |
CN2010102875090A CN102024727B (zh) | 2009-09-21 | 2010-09-17 | 加载器 |
TW099131854A TWI487054B (zh) | 2009-09-21 | 2010-09-20 | Loader |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009218244A JP5384270B2 (ja) | 2009-09-21 | 2009-09-21 | ローダ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011066368A JP2011066368A (ja) | 2011-03-31 |
JP2011066368A5 JP2011066368A5 (ja) | 2012-09-13 |
JP5384270B2 true JP5384270B2 (ja) | 2014-01-08 |
Family
ID=43865868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009218244A Active JP5384270B2 (ja) | 2009-09-21 | 2009-09-21 | ローダ |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5384270B2 (ja) |
KR (1) | KR101250135B1 (ja) |
CN (1) | CN102024727B (ja) |
TW (1) | TWI487054B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101923531B1 (ko) | 2011-12-23 | 2018-11-30 | 삼성전자주식회사 | 반도체 칩 본딩 장치 |
JP6689539B2 (ja) * | 2016-08-12 | 2020-04-28 | 株式会社ディスコ | 判定装置 |
JP7082274B2 (ja) * | 2017-11-06 | 2022-06-08 | シンフォニアテクノロジー株式会社 | ロードポート、及びロードポートにおけるマッピング処理方法 |
JP7184620B2 (ja) * | 2018-12-11 | 2022-12-06 | 株式会社ディスコ | 切削装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1064972A (ja) * | 1996-08-14 | 1998-03-06 | Miyazaki Oki Electric Co Ltd | ウエハ搬送装置 |
JP4134289B2 (ja) * | 2002-05-29 | 2008-08-20 | 東京エレクトロン株式会社 | プローブカード搬送装置及びアダプタ |
JP4300003B2 (ja) * | 2002-08-07 | 2009-07-22 | 東京エレクトロン株式会社 | 載置台の駆動装置及びプローブ方法 |
JP4091380B2 (ja) * | 2002-08-29 | 2008-05-28 | 東京エレクトロン株式会社 | 被処理体基板を収容した複数種類のカセットに対応可能なロードポート |
JP2006120766A (ja) * | 2004-10-20 | 2006-05-11 | Olympus Corp | ウェハ搬送装置及びカセット設置用アダプタ |
JP4767896B2 (ja) * | 2007-03-29 | 2011-09-07 | 東京エレクトロン株式会社 | 被検査体の搬送装置及び検査装置 |
JP2009170726A (ja) * | 2008-01-17 | 2009-07-30 | Rorze Corp | ロードポートおよびカセット位置調整方法 |
JP5381118B2 (ja) * | 2009-01-21 | 2014-01-08 | 東京エレクトロン株式会社 | プローブ装置 |
-
2009
- 2009-09-21 JP JP2009218244A patent/JP5384270B2/ja active Active
-
2010
- 2010-09-13 KR KR1020100089380A patent/KR101250135B1/ko active IP Right Grant
- 2010-09-17 CN CN2010102875090A patent/CN102024727B/zh active Active
- 2010-09-20 TW TW099131854A patent/TWI487054B/zh active
Also Published As
Publication number | Publication date |
---|---|
JP2011066368A (ja) | 2011-03-31 |
KR101250135B1 (ko) | 2013-04-04 |
CN102024727B (zh) | 2013-04-17 |
KR20110031884A (ko) | 2011-03-29 |
TWI487054B (zh) | 2015-06-01 |
CN102024727A (zh) | 2011-04-20 |
TW201135862A (en) | 2011-10-16 |
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