JP5369174B2 - 回路基板、ならびに、高周波モジュールおよびレーダ装置 - Google Patents
回路基板、ならびに、高周波モジュールおよびレーダ装置 Download PDFInfo
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- JP5369174B2 JP5369174B2 JP2011507282A JP2011507282A JP5369174B2 JP 5369174 B2 JP5369174 B2 JP 5369174B2 JP 2011507282 A JP2011507282 A JP 2011507282A JP 2011507282 A JP2011507282 A JP 2011507282A JP 5369174 B2 JP5369174 B2 JP 5369174B2
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- circuit board
- waveguide
- frequency signal
- laminated
- substrate
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Images
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
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Description
図1,2に示した回路基板10は、複数の面を有する基体1と、複数の導波線路2と、基体1の内部に形成される複数の積層型導波路3とを含む。この回路基板10は、複数の導波線路2と、複数の積層型導波路3とが電磁的に結合するように構成されてなる高周波回路を有する。この基体1は、回路基板10における基材となる部分である。回路基板10では、導波線路2と積層型導波路3とで高周波回路をなしているので、導波線路2と共振器とが接続されている場合に比べて位置ずれに対する許容範囲を広くすることができる。この位置ずれとしては、例えば回路基板10内の層間のずれ、および、回路基板10と後述の第2の回路基板51との間の基板間のずれなどが挙げられる。
2 導波線路
3 積層型導波路
3a 導出部
4 変換部
5 半導体素子
10,101 回路基板
31 誘電体層
32 主導体層
33 貫通導体
34 貫通導体群
50,100 高周波モジュール
51,103 第2の回路基板
52 第2導出部
53 窪み部
60 送信器
61 発振器
70 受信器
71 検波器
80 送受信器
81 分岐器
82 分波器
83 ミキサ
90 レーダ装置
91 検出器
Claims (10)
- 複数の面を有する基体と、
前記基体の第1の面に少なくとも一部が位置し、高周波信号を伝送する、導波線路と、
前記基体の内部に形成され、前記導波線路に電磁的に結合し、かつ、前記基体の内部から前記第1の面と異なる複数の面に導出される導出部を有する積層型導波路と、を含み、
前記積層型導波路は、
誘電体と、
前記誘電体を挟む一対の主導体層と、
前記一対の主導体層を相互に電気的に接続する複数の貫通導体を、伝送信号の伝送方向に沿って配列した貫通導体群と、を含む、回路基板。 - 前記導出部は、前記基体の複数の側面に形成されている、請求項1に記載の回路基板。
- 前記導波線路と前記積層型導波路とを電磁的に結合する結合部をさらに含む、請求項1に記載の回路基板。
- 複数の面を有する第1の基体と、前記基体の第1の面に少なくとも一部が位置し、高周波信号を伝送する、導波線路と、前記第1の基体の内部に形成され、前記導波線路に電磁的に結合し、かつ、前記第1の基体の内部から前記第1の面と異なる複数の面に導出される導出部を有する積層型導波路と、を含む第1の回路基板であって、前記積層型導波路は、第1誘電体と、前記第1誘電体を挟む一対の第1主導体層と、前記一対の第1主導体層を相互に電気的に接続する複数の第1貫通導体を、伝送信号の伝送方向に沿って配列した第1貫通導体群と、を含む、第1の回路基板と、
第2の基体、および、前記第2の基体の内部に形成され、前記第1の回路基板の前記積層型導波路と電磁的に結合する導波路を含む第2の回路基板と、を含む、導波構造体。 - 前記第2の基体は、その一表面側に、前記第1の回路基板の少なくとも一部を内部に収容する窪み部を有し、
前記導波路は、前記第2の基体の内部から前記窪み部の内側面に導出され、前記第1の回路基板の前記導出部と電磁的に結合する第2の導出部を有する、請求項4に記載の導波構造体。 - 前記第1の回路基板を複数含む、請求項4に記載の導波構造体。
- 前記導波路は、
第2誘電体と、
前記第2誘電体を挟む一対の第2主導体層と、
前記一対の第2主導体層を相互に電気的に接続する複数の第2貫通導体を、伝送信号の伝送方向に沿って配列した第2貫通導体群と、を含む、請求項4に記載の導波構造体。 - 請求項4に記載の導波構造体と、
前記積層型導波路と電磁的に結合する、高周波素子と、を含む、高周波モジュール。 - 前記第2の回路基板は、前記導波路と電磁的に結合され、前記高周波信号の送信および受信の少なくとも一方を実行する、アンテナをさらに含む、請求項8に記載の高周波モジュール。
- 前記アンテナは、送信アンテナ、および受信アンテナを含み、
前記積層型導波路は、前記高周波信号を複数の分岐信号に分岐し、前記複数の分岐信号の1つを前記送信アンテナに出力する分岐器を含み、
前記高周波素子は、
前記高周波信号を前記分岐器に出力する出力素子、および前記複数の分岐信号の前記1つと前記受信アンテナが受信する受信信号とを混合して中間周波信号を生成し、該中間周波信号を出力するミキサを含む、請求項9に記載の高周波モジュールと、
前記ミキサからの前記中間周波信号に基づいて、探知対象物との距離および相対速度の少なくとも一方を検出する検出器と、を含む、レーダ装置。
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