JP5354952B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5354952B2 JP5354952B2 JP2008127551A JP2008127551A JP5354952B2 JP 5354952 B2 JP5354952 B2 JP 5354952B2 JP 2008127551 A JP2008127551 A JP 2008127551A JP 2008127551 A JP2008127551 A JP 2008127551A JP 5354952 B2 JP5354952 B2 JP 5354952B2
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- Prior art keywords
- single crystal
- insulating layer
- layer
- semiconductor layer
- crystal semiconductor
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Description
本実施の形態は、n型MISFETとp型MISFETを構成する半導体層を、結晶方位が異なる単結晶半導体基板(以下「ボンドウエハー」ともいう)から、異種基板(以下、「ベース基板」ともいう)に転移する態様について説明する。また、該基板を用いた半導体装置の一例としてCMOS回路の構成例を説明する。以下の説明では、n型MISFET及びp型MISFETのそれぞれについて、チャネル長方向に走行するキャリアの移動度が高くなる結晶方位を選択したものについて示す。すなわち、n型MISFETに対して{100}面の半導体層を適用し、p型MISFETに対して{110}面の半導体層を適用する場合について示す。
本実施の形態では、ゲート絶縁層の膜厚が異なるn型MISFETとp型MISFET及びその作製工程について説明する。
上記実施の形態で示すように、結晶方位の異なる半導体層をベース基板に接合する場合に、より好ましい態様として、チャネル長方向の結晶軸を特定の方向に選択すると良い。MISFETにとってチャネル形成領域を流れる電子又はホールのキャリア移動度の異方性は、SOI層の結晶面方向での異方性と、キャリアの流れる方向での異方性を考慮することがより好ましい態様となる。これは、結晶中でキャリアの有効質量が異方性を有するからである。
本実施の形態は、同一の結晶方位を有するボンドウエハーから、n型MISFETとp型MISFETに適したSOI層を取り出す構成について示す。図17は{110}面のボンドウエハーを用いる場合について示す。この場合、n型MISFET用のSOI層を取り出す場合には、図17(A)に示すようにチャネル長方向が<100>軸と平行な方向になるようにする。一方、p型MISFET用のSOI層を形成するには、図17(B)に示すようにチャネル長方向が<110>軸と平行な方向になるようにする。
本実施の形態では、半導体装置の一例としてマイクロプロセッサの態様について図18を参照して説明する。
本実施の形態は、上記実施形態で示したn型MISFET及びp型MISFETを用いた半導体装置の一例として通信回路を有し非接触でデータの入出力が可能なマイクロコンピュータの態様について図19を参照して説明する。
101 酸化窒化珪素膜
102 窒化酸化珪素膜
103 水素イオン
104 脆化層
105 酸化珪素膜
106 ベース基板
107 酸化珪素膜
108 単結晶半導体層
109 単結晶半導体層
110 単結晶半導体層
110 第1のSOI層
111 絶縁層
112 脆化層
113 第2のボンドウエハー
114 SOI層
115 絶縁層
116 レジスト
204 導電層
204 ゲート電極
205 第1ゲート電極層
206 第2ゲート電極層
207 第1の絶縁層
208 第1の極浅接合部
209 第2の極浅接合部
210 第1のサイドウオール
211 第2のサイドウオール
212 第1の不純物領域
213 第2の不純物領域
214 パッシベーション層
215 第1の層間絶縁層
216 コンタクトプラグ
217 第2の層間絶縁層
218 第1の配線
219 第2の配線
220 第3の配線
Claims (8)
- 基板上の第1の絶縁層と、
前記第1の絶縁層上に設けられた、第1導電型のMIS型電界効果トランジスタに用いる第1の単結晶半導体層と、
前記第1の単結晶半導体層及び前記第1の絶縁層上に設けられた第2の絶縁層と、
前記第2の絶縁層上に設けられた、第2導電型のMIS型電界効果トランジスタに用いる第2の単結晶半導体層と、
前記第2の絶縁層及び前記第2の単結晶半導体層上に接して設けられた第3の絶縁層と、
前記第2の絶縁層及び前記第3の絶縁層を介して前記第1の単結晶半導体層上に設けられた第1のゲート電極と、
前記第3の絶縁層を介して前記第2の単結晶半導体層上に設けられた第2のゲート電極と、を有し、
前記第1の絶縁層の表面に平行な面における前記第1の単結晶半導体層の結晶面方位と、前記第2の絶縁層の表面に平行な面における前記第2の単結晶半導体層の結晶面方位が互いに異なる半導体装置。 - 請求項1において、
前記第1導電型がn型であり、前記第2導電型がp型であり、
前記第1の絶縁層の表面に平行な面における前記第1の単結晶半導体層の結晶面方位は{100}であり、
前記第2の絶縁層の表面に平行な面における前記第2の単結晶半導体層の結晶面方位は{110}であり、
前記第1の単結晶半導体層のチャネル長方向の結晶軸が<100>であり、
前記第2の単結晶半導体層のチャネル長方向の結晶軸が<110>である半導体装置。 - 請求項1において、
前記第1導電型がp型であり、前記第2導電型がn型であり、
前記第1の絶縁層の表面に平行な面における前記第1の単結晶半導体層の結晶方位は{110}であり、
前記第2の絶縁層の表面に平行な面における前記第2の単結晶半導体層の結晶方位は{100}であり、
前記第1の単結晶半導体層のチャネル長方向の結晶軸が<110>であり、
前記第2の単結晶半導体層のチャネル長方向の結晶軸が<100>である半導体装置。 - 請求項2または請求項3において、
前記第1の単結晶半導体層のチャネル長方向と前記第2の単結晶半導体層のチャネル長方向は平行である半導体装置。 - 基板上の第1の絶縁層と、
前記第1の絶縁層上に設けられた、第1導電型のMIS型電界効果トランジスタに用いる第1の単結晶半導体層と、
前記第1の単結晶半導体層及び前記第1の絶縁層上に設けられた第2の絶縁層と、
前記第2の絶縁層上に設けられた、第2導電型のMIS型電界効果トランジスタに用いる第2の単結晶半導体層と、
前記第2の絶縁層及び前記第2の単結晶半導体層上に接して設けられた第3の絶縁層と、
前記第2の絶縁層及び前記第3の絶縁層を介して前記第1の単結晶半導体層上に設けられた第1のゲート電極と、
前記第3の絶縁層を介して前記第2の単結晶半導体層上に設けられた第2のゲート電極と、を有し、
前記第1の絶縁層の表面に平行な面における前記第1の単結晶半導体層の結晶面方位と、前記第2の絶縁層の表面に平行な面における前記第2の単結晶半導体層の結晶面方位は同じであり、前記第1の単結晶半導体層と前記第2の単結晶半導体層のチャネル長方向は平行であり、且つ前記チャネル長方向の結晶軸は互いに異なる半導体装置。 - 請求項5において、
前記第1導電型がn型であり、前記第2導電型がp型であり、
前記第1の絶縁層の表面に平行な面における前記第1の単結晶半導体層の結晶面方位と、前記第2の絶縁層の表面に平行な面における前記第2の単結晶半導体層の結晶面方位は{110}であり、
前記第1の単結晶半導体層のチャネル長方向の結晶軸が<100>であり、
前記第2の単結晶半導体層のチャネル長方向の結晶軸が<110>である半導体装置。 - 請求項5において、
前記第1導電型がp型であり、前記第2導電型がn型であり、
前記第1の絶縁層の表面に平行な面における前記第1の単結晶半導体層の結晶面方位と、前記第2の絶縁層の表面に平行な面における前記第2の単結晶半導体層の結晶面方位は{110}であり、
前記第1の単結晶半導体層のチャネル長方向の結晶軸が<110>であり、
前記第2の単結晶半導体層のチャネル長方向の結晶軸が<100>である半導体装置。 - 請求項1乃至7のいずれか一項において、
前記基板は、ガラス基板である半導体装置。
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FR2915318B1 (fr) * | 2007-04-20 | 2009-07-17 | St Microelectronics Crolles 2 | Procede de realisation d'un circuit electronique integre a deux portions de couches actives ayant des orientations cristallines differentes |
JP5460984B2 (ja) | 2007-08-17 | 2014-04-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
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JP2009076879A (ja) | 2007-08-24 | 2009-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US8232598B2 (en) * | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US8044464B2 (en) * | 2007-09-21 | 2011-10-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5394043B2 (ja) * | 2007-11-19 | 2014-01-22 | 株式会社半導体エネルギー研究所 | 半導体基板及びそれを用いた半導体装置、並びにそれらの作製方法 |
JP2010056156A (ja) * | 2008-08-26 | 2010-03-11 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP2010067930A (ja) * | 2008-09-12 | 2010-03-25 | Toshiba Corp | 半導体装置およびその製造方法 |
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WO2011052385A1 (en) | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8912055B2 (en) | 2011-05-03 | 2014-12-16 | Imec | Method for manufacturing a hybrid MOSFET device and hybrid MOSFET obtainable thereby |
US8877603B2 (en) | 2012-03-30 | 2014-11-04 | International Business Machines Corporation | Semiconductor-on-oxide structure and method of forming |
US9041116B2 (en) * | 2012-05-23 | 2015-05-26 | International Business Machines Corporation | Structure and method to modulate threshold voltage for high-K metal gate field effect transistors (FETs) |
US9275911B2 (en) * | 2012-10-12 | 2016-03-01 | Globalfoundries Inc. | Hybrid orientation fin field effect transistor and planar field effect transistor |
US9941271B2 (en) * | 2013-10-04 | 2018-04-10 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fin-shaped field effect transistor and capacitor structures |
US9443869B2 (en) * | 2013-11-05 | 2016-09-13 | Taiwan Semiconductor Manufacturing Company Limited | Systems and methods for a semiconductor structure having multiple semiconductor-device layers |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01162376A (ja) | 1987-12-18 | 1989-06-26 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH0590117A (ja) | 1991-09-27 | 1993-04-09 | Toshiba Corp | 単結晶薄膜半導体装置 |
JP3017860B2 (ja) * | 1991-10-01 | 2000-03-13 | 株式会社東芝 | 半導体基体およびその製造方法とその半導体基体を用いた半導体装置 |
JPH07297377A (ja) | 1994-04-21 | 1995-11-10 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JPH11145438A (ja) * | 1997-11-13 | 1999-05-28 | Shin Etsu Handotai Co Ltd | Soiウエーハの製造方法ならびにこの方法で製造されるsoiウエーハ |
JP2000012864A (ja) | 1998-06-22 | 2000-01-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
JP3432187B2 (ja) * | 1999-09-22 | 2003-08-04 | シャープ株式会社 | 半導体装置の製造方法 |
US20020031909A1 (en) * | 2000-05-11 | 2002-03-14 | Cyril Cabral | Self-aligned silicone process for low resistivity contacts to thin film silicon-on-insulator mosfets |
US6583440B2 (en) * | 2000-11-30 | 2003-06-24 | Seiko Epson Corporation | Soi substrate, element substrate, semiconductor device, electro-optical apparatus, electronic equipment, method of manufacturing the soi substrate, method of manufacturing the element substrate, and method of manufacturing the electro-optical apparatus |
JPWO2003049189A1 (ja) | 2001-12-04 | 2005-04-21 | 信越半導体株式会社 | 貼り合わせウェーハおよび貼り合わせウェーハの製造方法 |
US6908797B2 (en) | 2002-07-09 | 2005-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JP3927165B2 (ja) | 2003-07-03 | 2007-06-06 | 株式会社東芝 | 半導体装置 |
US6821826B1 (en) * | 2003-09-30 | 2004-11-23 | International Business Machines Corporation | Three dimensional CMOS integrated circuits having device layers built on different crystal oriented wafers |
US20050275018A1 (en) * | 2004-06-10 | 2005-12-15 | Suresh Venkatesan | Semiconductor device with multiple semiconductor layers |
DE102004031708B4 (de) * | 2004-06-30 | 2008-02-07 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zum Herstellen eines Substrats mit kristallinen Halbleitergebieten unterschiedlicher Eigenschaften |
JP2006040911A (ja) * | 2004-07-22 | 2006-02-09 | Renesas Technology Corp | 半導体装置及びその製造方法 |
US7312487B2 (en) | 2004-08-16 | 2007-12-25 | International Business Machines Corporation | Three dimensional integrated circuit |
US7235433B2 (en) * | 2004-11-01 | 2007-06-26 | Advanced Micro Devices, Inc. | Silicon-on-insulator semiconductor device with silicon layers having different crystal orientations and method of forming the silicon-on-insulator semiconductor device |
US7298009B2 (en) * | 2005-02-01 | 2007-11-20 | Infineon Technologies Ag | Semiconductor method and device with mixed orientation substrate |
US7432149B2 (en) * | 2005-06-23 | 2008-10-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMOS on SOI substrates with hybrid crystal orientations |
JP4618105B2 (ja) | 2005-11-11 | 2011-01-26 | 三菱自動車工業株式会社 | 車両の旋回挙動制御装置 |
JP2009076879A (ja) | 2007-08-24 | 2009-04-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
US8232598B2 (en) | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
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