JP5155517B2 - ウエハ受渡装置及びポリッシング装置 - Google Patents
ウエハ受渡装置及びポリッシング装置 Download PDFInfo
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- JP5155517B2 JP5155517B2 JP2005124093A JP2005124093A JP5155517B2 JP 5155517 B2 JP5155517 B2 JP 5155517B2 JP 2005124093 A JP2005124093 A JP 2005124093A JP 2005124093 A JP2005124093 A JP 2005124093A JP 5155517 B2 JP5155517 B2 JP 5155517B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
〔第1実施形態〕
図2は、本発明の一実施形態(第1実施形態)にかかるウエハ受渡装置を示す側断面図である。また図3は、ウエハ受渡装置のプッシャー機構10の上部の構成を示す斜視図であり、図4は、図3のA−A部分に対応するプッシャー機構10とトップリング60の概略断面図である。トップリング60は、下端面にウエハを保持するウエハ保持機構であり、プッシャー機構10は、トップリング60との間でウエハWの受け渡しを行なうウエハ受渡機構である。このプッシャー機構10は、トップリング60の下面外周に係合するガイド部材であるトップリングガイド20を支持するガイドステージ15と、上面がウエハWを載置するウエハ載置部であるウエハトレイ40を押し上げるプッシュステージ30とが、鉛直に設置されたシャフト11の上端部に取り付けられている。
図8は、本発明の他の実施形態(第2実施形態)にかかるウエハ受渡装置の一部を示す概略側面図である。本実施形態のウエハ受渡装置においては、図示する以外の部分の構成及びその動作は、第1実施形態のウエハ受渡装置と共通である。また、図示する部分においても第1実施形態と共通する部分には、同一の符号を付しその詳細な説明は省略する。本実施形態にかかるウエハ受渡装置は、第1実施形態のプッシャー機構10にかえてプッシャー機構10−2を備えている。このプッシャー機構10−2は、センサ機構50にかえてセンサ機構50−2を設置している点においてのみプッシャー機構10とその構成が異なる。センサ機構50−2は、投光部50−2a及び受光部50−2bを同一面に備えてなる反射型のセンサであり、トップリングガイド20内に取り付けられている。センサ機構50−2の投光部50−2a及び受光部50−2bは、トップリングガイド20の内周側面20a(20−1a〜20−4a)から露出しており、投光部50−2aからウエハトレイ40に着座したウエハWの側面(外周側面)にセンサ光を投光し、該側面で反射した反射光を受光部50−2bで受光することで、ウエハWの着座を検知するようになっている。本実施形態においても、センサ機構50−2を複数(3個以上)設置すれば、ウエハWがウエハ載置部40aに適正に着座したことを検知できる。
図9は、上記の第1,第2実施形態にかかるウエハ受渡装置を備えたポリッシング装置100の平面構成例を示す図である。このポリッシング装置100は、装置全体を収容するハウジング101を備えると共に、該ハウジング101内に複数の隔壁102を備えており、ハウジング101内は、隔壁102によって搬送領域A、洗浄領域B、研磨領域C及び研磨領域Dの各領域に区画されている。
10−2 プッシャー機構
11 シャフト
12 スライド軸受
13 軸受ケース
14 調芯機構
15 ガイドステージ
16 コイルスプリング
17 固定側部材
18 軸受ケース
19 スライド軸受
20 トップリングガイド
21 プッシュロッド
22 スライド軸受
23 シリンダ(エアシリンダ)
24 リミットセンサ
25 リミットセンサ
26 シャフト
27 シリンダ(エアシリンダ)
28 リミットセンサ
29 リミットセンサ
30 プッシュステージ
31 クッション部材
32 ストッパー部材
33 衝撃緩和機構
38 トランスポータ
40 ウエハトレイ
40a ウエハ載置部
41 センタスリーブ
42 ガイドスリーブ
50 センサ機構
50−2 センサ機構
51 投光装置
52 受光装置
60 トップリング(ウエハ保持機構)
60a ウエハ保持面
61 トップリングヘッド
62 回転軸
63 リテーナリング
64 メンブレン(弾性膜)
65 穴
66 流体
100 ポリッシング装置
101 ハウジング
102 隔壁
110 ウエハカセット
111 ロードアンロードステージ
120 走行レール
121 第1搬送ロボット
130 第2搬送ロボット
131,132,133,134 洗浄機
135 ウエハ載置台
140 研磨ユニット
141 研磨テーブル
142 トップリング
143 ドレッサー
145 砥液ノズル
146 反転機
147 リフタ機構
148 プッシャー機構
149 リニアトランスポータ
150 回転軸
151 トップリングヘッド
152 揺動軸
153 回転軸
154 ドレッサーヘッド
155 揺動軸
156 ドレッサー洗浄部
Claims (7)
- 下端面にウエハを保持するウエハ保持機構と、該ウエハ保持機構との間で前記ウエハの受け渡しを行うウエハ受渡機構とを備えたウエハ受渡装置において、
前記ウエハ受渡機構は、前記ウエハを載置するウエハ載置部を備え、前記ウエハ保持機構による前記ウエハの離脱動作で該ウエハ保持機構の下端面から離脱したウエハが前記ウエハ載置部に着座するように構成し、
前記ウエハ受渡機構は、前記ウエハが前記ウエハ載置部に着座したことを検知する着座検知手段を備え、
前記着座検知手段は、前記ウエハ載置部に着座した前記ウエハの外周端部の少なくとも3個所それぞれを検知するセンサ機構と、前記センサ機構による前記ウエハの着座検知から前記ウエハが前記ウエハ載置部に適正に着座したかを判断する制御手段と、備え、
前記センサ機構は、前記ウエハ載置部に適正に着座した前記ウエハの外周端より外側と内側のいずれか一方に配置された投光部から光を投光する投光装置と、前記外側と内側のいずれか他方に配置された受光部で前記投光装置から投光された光を受光する受光装置とを備え、前記投光装置から投光された光が、前記ウエハ載置部に着座した前記ウエハで遮断された状態を着座として検知するように構成し、
前記制御手段は、前記センサ機構のすべてが前記ウエハの着座を検出した場合は、前記ウエハが適正に着座したと判断し、前記センサ機構のうちいずれか1つでも前記ウエハの着座を検知しない場合、前記ウエハが傾き適正に着座していないと判断することを特徴とするウエハ受渡装置。 - 請求項1に記載のウエハ受渡装置において、
前記センサ機構は、各々の検知位置が、鉛直方向において互いに同一の高さ位置になるように設置されていることを特徴とするウエハ受渡装置。 - 請求項1又は2に記載のウエハ受渡装置において、
前記ウエハ受渡機構は、前記ウエハ保持機構の下端外周に係合するガイド部材を備えると共に、前記ウエハ載置部を該ガイド部材に対して相対的に昇降移動させる昇降機構を具備し、
前記ガイド部材側に前記着座検知手段を設置し、前記ウエハ載置部に着座した前記ウエハを検知できるように構成したことを特徴とするウエハ受渡装置。 - 請求項1乃至3のいずれか1項に記載のウエハ受渡装置において、
前記着座検知手段が前記ウエハの着座又は適正な着座を検知しない場合に警報を発する警報手段を備えたことを特徴とするウエハ受渡装置。 - 請求項1乃至4のいずれか1項に記載のウエハ受渡装置において、
前記着座検知手段が前記ウエハの適正な着座を検知しない場合に、再度前記ウエハ保持機構の下端面からの前記ウエハの離脱を試みる再離脱手段を備えたことを特徴とするウエハ受渡装置。 - 請求項5に記載のウエハ受渡装置において、
前記再離脱手段で前記ウエハ保持機構の下端面からの前記ウエハの再度の離脱を試みても、前記着座検知手段が前記ウエハの適正な着座を検知しない場合に、前記ウエハ受渡装置を停止させる装置停止手段を備えたことを特徴とするウエハ受渡装置。 - 研磨テーブルとトップリングを具備し、前記トップリングに保持されたウエハを回転させつつ前記研磨テーブルの回転する研磨面に押圧接触させて該ウエハを研磨する研磨ユニットと、前記ウエハを洗浄する洗浄ユニットとを備えるポリッシング装置において、
前記トップリングを前記ウエハ保持機構とし、該トップリングとの間で前記ウエハの受け渡しを行うウエハ受渡機構を備え、該ウエハ受渡機構を請求項1乃至6のいずれか1項に記載のウエハ受渡装置としたことを特徴とするポリッシング装置。
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PCT/JP2006/308785 WO2006115277A1 (ja) | 2005-04-21 | 2006-04-20 | ウエハ受渡装置、ポリッシング装置、及びウエハ受け取り方法 |
US11/918,254 US8118640B2 (en) | 2005-04-21 | 2006-04-20 | Wafer transferring apparatus, polishing apparatus, and wafer receiving method |
CNB2006800131054A CN100565832C (zh) | 2005-04-21 | 2006-04-20 | 晶片传送装置、研磨装置及晶片接收方法 |
KR1020137019641A KR101374693B1 (ko) | 2005-04-21 | 2006-04-20 | 웨이퍼 수수장치, 폴리싱장치 및 웨이퍼 수취방법 |
EP06732391.5A EP1873820B1 (en) | 2005-04-21 | 2006-04-20 | Wafer transfer apparatus and wafer transfer method |
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TW095114284A TWI373070B (en) | 2005-04-21 | 2006-04-21 | Wafer delivery/reception device, polishing device, and method for receiving wafers |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |