JP5154783B2 - 撮像モジュールの製造方法 - Google Patents
撮像モジュールの製造方法 Download PDFInfo
- Publication number
- JP5154783B2 JP5154783B2 JP2006307636A JP2006307636A JP5154783B2 JP 5154783 B2 JP5154783 B2 JP 5154783B2 JP 2006307636 A JP2006307636 A JP 2006307636A JP 2006307636 A JP2006307636 A JP 2006307636A JP 5154783 B2 JP5154783 B2 JP 5154783B2
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- JP
- Japan
- Prior art keywords
- circuit board
- imaging module
- flexible circuit
- substrate
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000003384 imaging method Methods 0.000 title claims description 57
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 33
- 238000005452 bending Methods 0.000 claims description 8
- 238000000926 separation method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 description 15
- 230000005540 biological transmission Effects 0.000 description 5
- 239000006059 cover glass Substances 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/555—Constructional details for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Endoscopes (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Instruments For Viewing The Inside Of Hollow Bodies (AREA)
Description
次に、撮像モジュール100の製造方法について説明する。図2は、撮像モジュール100の製造工程を示すフローチャートである。また、図3の(a)〜(f)は、撮像モジュール100の製造工程を説明する図である。撮像モジュール100は、半導体微細加工技術を用いて製造される。図2、図3を参照しながら、撮像モジュール100の製造方法について説明する。
101 可撓性回路基板
101a 第1の領域
101b 第2の領域
101c 第3の領域
102 電子部品
103 撮像素子
103a 撮像素子受光部
104 金属突起
105 光透過部
106 屈曲部
301 硬質な基板
302 絶縁層
303 配線
304 ランド
305 カバーガラス
601 光透過性基板
601a 不要部分
10 固体撮像素子
11 受光面
13 カバーガラス
20 可撓性基板
21 補強板
22 インナーリード
23 リード
70、80 電気絶縁部材
Claims (2)
- 半導体製造工程を用いて、
硬質な基板上に一体的に絶縁層を形成する絶縁層形成ステップと、
前記絶縁層上に配線を形成する配線形成ステップと、
前記絶縁層により構成された可撓性基板上に撮像素子を含む所定の機能要素を実装する実装ステップと、
前記可撓性基板を前記硬質な基板から分離する分離ステップと、
前記可撓性基板を折り曲げる折り曲げステップと、を有することを特徴とする撮像モジュールの製造方法。 - 前記硬質な基板は、光透過性基板であり、
前記分離ステップにおいて、前記撮像素子の撮像面の領域には前記光透過性基板を残すことを特徴とする請求項1に記載の撮像モジュールの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006307636A JP5154783B2 (ja) | 2006-11-14 | 2006-11-14 | 撮像モジュールの製造方法 |
US11/934,420 US7808551B2 (en) | 2006-11-14 | 2007-11-02 | Imaging module and method of manufacturing imaging module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006307636A JP5154783B2 (ja) | 2006-11-14 | 2006-11-14 | 撮像モジュールの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008119299A JP2008119299A (ja) | 2008-05-29 |
JP5154783B2 true JP5154783B2 (ja) | 2013-02-27 |
Family
ID=39368834
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006307636A Expired - Fee Related JP5154783B2 (ja) | 2006-11-14 | 2006-11-14 | 撮像モジュールの製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7808551B2 (ja) |
JP (1) | JP5154783B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8698887B2 (en) * | 2010-04-07 | 2014-04-15 | Olympus Corporation | Image pickup apparatus, endoscope and manufacturing method for image pickup apparatus |
JP5912058B2 (ja) | 2012-03-30 | 2016-04-27 | 株式会社フジクラ | 撮像モジュール、レンズ付き撮像モジュール、内視鏡、撮像モジュールの製造方法、フレキシブル配線基板成形装置 |
JP6396650B2 (ja) * | 2013-09-30 | 2018-09-26 | オリンパス株式会社 | 撮像ユニットおよび内視鏡装置 |
DE102015002534B4 (de) * | 2015-02-28 | 2016-10-06 | Schölly Fiberoptic GmbH | Verfahren zur Fertigung eines Kameramoduls und Kameramodul |
JP6557162B2 (ja) * | 2016-02-25 | 2019-08-07 | 富士フイルム株式会社 | 内視鏡 |
JP6719941B2 (ja) * | 2016-03-27 | 2020-07-08 | 日本電産コパル株式会社 | 電子部品搭載部材、及び撮像装置 |
US11583171B2 (en) | 2019-08-22 | 2023-02-21 | Omnivision Technologies, Inc. | Surface-mount device platform and assembly |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3207319B2 (ja) * | 1993-05-28 | 2001-09-10 | 株式会社東芝 | 光電変換装置及びその製造方法 |
JP3461368B2 (ja) * | 1993-09-16 | 2003-10-27 | オリンパス光学工業株式会社 | 可撓性薄膜基板を有する電子デバイスの製造方法 |
US6142930A (en) * | 1997-01-13 | 2000-11-07 | Asahi Kogaku Kogyo Kabushiki Kaisha | Electronic endoscope having compact construction |
JP3417777B2 (ja) * | 1997-01-13 | 2003-06-16 | ペンタックス株式会社 | 電子内視鏡 |
JP2000223794A (ja) * | 1999-01-29 | 2000-08-11 | Matsushita Electric Ind Co Ltd | 印刷シート及びその製造方法 |
JP2001257937A (ja) * | 2000-03-13 | 2001-09-21 | Olympus Optical Co Ltd | 固体撮像装置 |
JP4405062B2 (ja) * | 2000-06-16 | 2010-01-27 | 株式会社ルネサステクノロジ | 固体撮像装置 |
US6613597B2 (en) * | 2001-06-29 | 2003-09-02 | Xanoptix, Inc. | Optical chip packaging via through hole |
US7371970B2 (en) * | 2002-12-06 | 2008-05-13 | Flammer Jeffrey D | Rigid-flex circuit board system |
JP4510403B2 (ja) * | 2003-05-08 | 2010-07-21 | 富士フイルム株式会社 | カメラモジュール及びカメラモジュールの製造方法 |
US6943423B2 (en) * | 2003-10-01 | 2005-09-13 | Optopac, Inc. | Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof |
JP2006247081A (ja) * | 2005-03-10 | 2006-09-21 | Pentax Corp | カプセル型装置 |
-
2006
- 2006-11-14 JP JP2006307636A patent/JP5154783B2/ja not_active Expired - Fee Related
-
2007
- 2007-11-02 US US11/934,420 patent/US7808551B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2008119299A (ja) | 2008-05-29 |
US7808551B2 (en) | 2010-10-05 |
US20080111907A1 (en) | 2008-05-15 |
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