JP5123493B2 - 配線基板及び半導体装置 - Google Patents
配線基板及び半導体装置 Download PDFInfo
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- JP5123493B2 JP5123493B2 JP2006150414A JP2006150414A JP5123493B2 JP 5123493 B2 JP5123493 B2 JP 5123493B2 JP 2006150414 A JP2006150414 A JP 2006150414A JP 2006150414 A JP2006150414 A JP 2006150414A JP 5123493 B2 JP5123493 B2 JP 5123493B2
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- Japan
- Prior art keywords
- wiring
- substrate
- semiconductor device
- connection
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
- H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
Description
図4は、本発明の第1の実施の形態に係る半導体装置の平面図である。図4において、X,X方向は基板15の側面15−1,15−3に対して平行な方向、Y,Y方向は基板15の側面15−2,15−4に対して平行な方向をそれぞれ示している。
図20は、本発明の第2の実施の形態に係る半導体装置の平面図である。図20において、第1の実施の形態の半導体装置10と同一構成部分には同一符号を付す。
11,121 配線基板
12 制御回路部品
13 RF回路部品
15 基板
15A,73A,92A 上面
15B,73B 下面
15C,15D 切り欠き部
15−1〜15−4 側面
16〜19 接続パッド
21,22 端面電極
24〜26,111〜114 配線
29 逆F型アンテナ
31,35 第1のパッド部
32,36 第2のパッド部
33,37,61〜70,171〜178 接続部
41〜45,126〜129 第1の配線部
51〜56,131〜135 第2の配線部
73 基材
74,75 金属箔
77,78 貫通孔
81 金属膜
82,83 レジスト膜
90 電子装置
91 実装基板
92 基板本体
93〜99 パッド
101 ダミー用パッド
102 USB出力用コネクタ
103 スイッチ
104 電源供給用コネクタ
105 マイコン
116 はんだ
124 逆L型アンテナ
A 制御回路実装領域
B RF回路実装領域
F 配線形成領域
G 切断位置
R1 直径
W1〜W19 幅
Claims (6)
- 電子部品が配設される基板と、前記基板に形成され、前記電子部品と電気的に接続されるアンテナパターンと、を有した配線基板であって、
前記アンテナパターンの一部を前記基板の側面に設けており、
前記アンテナパターンは、前記基板の第1の主面に設けられた第1の配線部と、前記第1の主面とは反対側に位置する前記基板の第2の主面に設けられた第2の配線部と、前記基板の側面に設けられ、前記第1の配線部と前記第2の配線部とを交互に電気的に接続する接続部と、を有することを特徴とする配線基板。 - 前記アンテナパターンが逆F型アンテナ、または、逆L型アンテナであることを特徴とする請求項1に記載の配線基板。
- 前記接続部は、前記基板の側面に設けられた切り欠き部に設けられていることを特徴とする請求項1または2に記載の配線基板。
- 電子部品と、
前記電子部品が配設される基板と、前記基板に形成され、前記電子部品と電気的に接続されるアンテナパターンとを備えた配線基板と、を有する半導体装置であって、
前記アンテナパターンの一部を前記基板の側面に設けており、
前記アンテナパターンは、前記基板の第1の主面に設けられた第1の配線部と、前記第1の主面とは反対側に位置する前記基板の第2の主面に設けられた第2の配線部と、前記基板の側面に設けられ、前記第1の配線部と前記第2の配線部とを交互に電気的に接続する接続部と、を有することを特徴とする半導体装置。 - 前記アンテナパターンが逆F型アンテナ、または、逆L型アンテナであることを特徴とする請求項4に記載の半導体装置。
- 前記接続部は、前記基板の側面に設けられた切り欠き部に設けられていることを特徴とする請求項4または5に記載の半導体装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006150414A JP5123493B2 (ja) | 2006-05-30 | 2006-05-30 | 配線基板及び半導体装置 |
US11/754,767 US7542006B2 (en) | 2006-05-30 | 2007-05-29 | Wiring board and semiconductor apparatus |
KR1020070052014A KR20070115682A (ko) | 2006-05-30 | 2007-05-29 | 배선 기판 및 반도체 장치 |
TW096119302A TWI412110B (zh) | 2006-05-30 | 2007-05-30 | 佈線基板及半導體裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006150414A JP5123493B2 (ja) | 2006-05-30 | 2006-05-30 | 配線基板及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007324231A JP2007324231A (ja) | 2007-12-13 |
JP5123493B2 true JP5123493B2 (ja) | 2013-01-23 |
Family
ID=38789849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006150414A Active JP5123493B2 (ja) | 2006-05-30 | 2006-05-30 | 配線基板及び半導体装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7542006B2 (ja) |
JP (1) | JP5123493B2 (ja) |
KR (1) | KR20070115682A (ja) |
TW (1) | TWI412110B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009163308A (ja) * | 2007-12-28 | 2009-07-23 | Toshiba Corp | 電子機器 |
EP2267834A1 (en) | 2009-06-19 | 2010-12-29 | Insight sip sas | Efficient integrated miniature antenna structure for multi-GHz wireless applications |
EP2293381B1 (de) * | 2009-08-27 | 2016-11-09 | Delphi International Operations Luxembourg S.à r.l. | Antennenanordnung |
JP6027905B2 (ja) * | 2013-01-31 | 2016-11-16 | 新光電気工業株式会社 | 半導体装置 |
KR20160149882A (ko) * | 2015-06-19 | 2016-12-28 | 엘지이노텍 주식회사 | 표면실장부품 모듈 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3738506A1 (de) * | 1987-11-13 | 1989-06-01 | Dornier System Gmbh | Antennenstruktur |
US5023624A (en) * | 1988-10-26 | 1991-06-11 | Harris Corporation | Microwave chip carrier package having cover-mounted antenna element |
US5608263A (en) * | 1994-09-06 | 1997-03-04 | The Regents Of The University Of Michigan | Micromachined self packaged circuits for high-frequency applications |
JP3472430B2 (ja) * | 1997-03-21 | 2003-12-02 | シャープ株式会社 | アンテナ一体化高周波回路 |
JP2002033419A (ja) | 2000-07-14 | 2002-01-31 | Sharp Corp | 高周波モジュールおよび高周波モジュールの製造方法 |
DE10049844A1 (de) * | 2000-10-09 | 2002-04-11 | Philips Corp Intellectual Pty | Miniaturisierte Mikrowellenantenne |
US7015869B2 (en) * | 2002-11-18 | 2006-03-21 | Visteon Global Technologies, Inc. | High frequency antenna disposed on the surface of a three dimensional substrate |
JP2005086603A (ja) * | 2003-09-10 | 2005-03-31 | Tdk Corp | 電子部品モジュールおよびその製造方法 |
JP2005184577A (ja) * | 2003-12-22 | 2005-07-07 | Casio Comput Co Ltd | アンテナ装置およびそのアンテナ装置を備えた腕時計 |
JP4653440B2 (ja) * | 2004-08-13 | 2011-03-16 | 富士通株式会社 | Rfidタグおよびその製造方法 |
-
2006
- 2006-05-30 JP JP2006150414A patent/JP5123493B2/ja active Active
-
2007
- 2007-05-29 US US11/754,767 patent/US7542006B2/en active Active
- 2007-05-29 KR KR1020070052014A patent/KR20070115682A/ko not_active Application Discontinuation
- 2007-05-30 TW TW096119302A patent/TWI412110B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US7542006B2 (en) | 2009-06-02 |
TW200807667A (en) | 2008-02-01 |
KR20070115682A (ko) | 2007-12-06 |
US20070279879A1 (en) | 2007-12-06 |
TWI412110B (zh) | 2013-10-11 |
JP2007324231A (ja) | 2007-12-13 |
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