JP5082542B2 - 固体撮像装置 - Google Patents
固体撮像装置 Download PDFInfo
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- JP5082542B2 JP5082542B2 JP2007089256A JP2007089256A JP5082542B2 JP 5082542 B2 JP5082542 B2 JP 5082542B2 JP 2007089256 A JP2007089256 A JP 2007089256A JP 2007089256 A JP2007089256 A JP 2007089256A JP 5082542 B2 JP5082542 B2 JP 5082542B2
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Description
先ず、図7Aに示すように、絶縁基板37の中央部に貫通孔49を有し、絶縁基板36の表面に所要パターンの回路配線36が形成された基板モジュール38に対して、固体撮像素子チップ34を接着すべき部分に、図2Bに示すような2つの線状体46a,46bによる接着剤層46、本例ではダイボンドペーストを塗布する。
その他の構成は、図1の第1実施の形態の固体撮像装置31と同様であるので、図1と対応する部分には同一符号を付して重複説明を省略する。
従って、パッケージ型の固体撮像装置の信頼性、耐久性を大幅に向上することができる。
その他の構成は、図1の第1実施の形態の固体撮像装置31と同様であるので、図1と対応する部分には同一符号を付して重複説明を省略する。
従って、パッケージ型の固体撮像装置の信頼性、耐久性を大幅に向上することができる。
その他の構成は、図11の第3実施の形態の固体撮像装置74と同様であるので、図11と対応する部分には同一符号を付して重複説明を省略する。
このようにして、本実施の形態では、パッケージ型の固体撮像装置の信頼性、耐久性を大幅に向上することができる。
その他の構成については、図1の第1実施の形態で説明したと同様であるので、詳細説明を省略する。
その他の構成は、図1、図13で説明したと同様であるので、図1、図13と対応する部分には同一符号を付して重複説明を省略する。
従って、パッケージ型の固体撮像装置の信頼性、耐久性を大幅に向上することができる。
その他の構成は、図1と同様であるので、対応する部分には同一符号を付して重複説明を省略する。
従って、パッケージ型の固体撮像装置の信頼性、耐久性を大幅に向上することができる。
Claims (11)
- 光透過性部材を有するパッケージ内に固体撮像素子チップが封入され、
前記パッケージの内面に粘着剤層が形成され、
前記パッケージの底部に前記パッケージ内の空間と連通する貫通孔が形成され、
前記パッケージに静電気を誘起するための電極部材が埋め込まれている
ことを特徴とする固体撮像装置。 - 光透過性部材を有するパッケージ内に固体撮像素子チップが封入され、
前記パッケージの内面に粘着剤層が形成され、
前記パッケージにおける前記光透過性部材の接合部の一部に、パッケージ内の空間と連通する通気孔が形成され、
前記パッケージに静電気を誘起するための電極部材が埋め込まれている
ことを特徴とする固体撮像装置。 - 前記パッケージの底部に前記パッケージ内の空間と連通する貫通孔が形成されている
ことを特徴とする請求項2記載の固体撮像装置。 - 前記貫通孔が、前記パッケージ底部の前記固体撮像素子チップの直下部分に形成されている
ことを特徴とする請求項1または3記載の固体撮像装置。 - 前記固体撮像素子チップが局部的に接着剤層を介して前記パッケージ底部に接着され、
前記接着剤層の介在で固体撮像素子チップと前記パッケージ底部間に、外部からの塵埃の侵入を阻止し得る間隙が形成されている
ことを特徴とする請求項1〜4の何れか記載の固体撮像装置。 - 前記パッケージ底部に、前記貫通孔を塞ぐように通気性を有しかつ外部からの塵埃の侵入を阻止するフィルタが形成されている
ことを特徴とする請求項1,3〜5の何れか記載の固体撮像装置。 - 前記パッケージ底部と前記固体撮像素子チップとの間に介在する接着剤層は、2つの線状体が前記貫通孔を挟んで互いに対向する形状に形成されている
ことを特徴とする請求項1,3〜6の何れか記載の固体撮像装置。 - 前記パッケージ底部と前記固体撮像素子チップとの間に介在する接着剤層は、前記貫通孔を囲み一部に連通孔が形成された形状に形成されている
ことを特徴とする請求項1,3〜6の何れか記載の固体撮像装置。 - 前記パッケージ底部と前記固体撮像素子チップとの間に介在する接着剤層は、2つのL字状体が前記貫通孔を囲うように少許の間隔を置いて対向する形状に形成されている
ことを特徴とする請求項8記載の固体撮像装置。 - 前記パッケージが、基板モジュールとカバー部材と光透過性部材からなり、
前記パッケージの底部となる前記基板モジュール上に前記固体撮像素子チップが実装されている
ことを特徴とする請求項1〜9の何れか記載の固体撮像装置。 - 前記粘着剤層が、前記パッケージにおける前記基板モジュールの表面、前記カバー部材の内壁面及び前記固体撮像素子チップの撮像面を除く表面に形成されている
ことを特徴とする請求項10記載の固体撮像装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007089256A JP5082542B2 (ja) | 2007-03-29 | 2007-03-29 | 固体撮像装置 |
US12/051,331 US8680636B2 (en) | 2007-03-29 | 2008-03-19 | Package-type solid-state imaging apparatus with exhausting means |
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Application Number | Priority Date | Filing Date | Title |
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JP2007089256A JP5082542B2 (ja) | 2007-03-29 | 2007-03-29 | 固体撮像装置 |
Publications (2)
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JP2008251712A JP2008251712A (ja) | 2008-10-16 |
JP5082542B2 true JP5082542B2 (ja) | 2012-11-28 |
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JP2007089256A Expired - Fee Related JP5082542B2 (ja) | 2007-03-29 | 2007-03-29 | 固体撮像装置 |
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JP (1) | JP5082542B2 (ja) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5175620B2 (ja) * | 2008-05-29 | 2013-04-03 | シャープ株式会社 | 電子素子ウェハモジュールおよびその製造方法、電子素子モジュール、電子情報機器 |
JP2010245337A (ja) * | 2009-04-07 | 2010-10-28 | Elpida Memory Inc | 半導体装置及びその製造方法 |
JP5326904B2 (ja) * | 2009-07-24 | 2013-10-30 | パナソニック株式会社 | レンズ鏡筒 |
CN102375297B (zh) * | 2010-08-12 | 2014-12-03 | 鸿富锦精密工业(深圳)有限公司 | 相机模组 |
JP5541088B2 (ja) * | 2010-10-28 | 2014-07-09 | ソニー株式会社 | 撮像素子パッケージ、撮像素子パッケージの製造方法、及び、電子機器 |
KR101779498B1 (ko) * | 2010-11-16 | 2017-09-18 | 엘지이노텍 주식회사 | 카메라 모듈 |
JP5818455B2 (ja) * | 2011-02-17 | 2015-11-18 | キヤノン株式会社 | 固体撮像装置およびその製造方法 |
US8891007B2 (en) * | 2011-03-07 | 2014-11-18 | Digitaloptics Corporation | Camera module with protective air ventilation channel |
JP5946520B2 (ja) * | 2011-05-19 | 2016-07-06 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス装置及びオプトエレクトロニクス装置の製造方法 |
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