JP5024971B2 - 基板保持機構およびこれを備えた基板組立装置 - Google Patents
基板保持機構およびこれを備えた基板組立装置 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/067—Sheet handling, means, e.g. manipulators, devices for turning or tilting sheet glass
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Theoretical Computer Science (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
上記保持体は、基板を保持する保持面を有する。
上記機能性素子は、上記保持面に設けられ電圧の大きさによって保持力が可変である。
上記支持台は、下側基板を支持するためのものである。
上記保持機構は、保持面と、機能性素子とを有する。上記保持面は、上側基板の上面を保持するためのものである。上記機能性素子は、上記保持面に設けられ電圧の大きさによって保持力が可変である。上記保持機構は、上側基板の下面を上記支持台に支持された下側基板の上面に対向させる。
上記保持体は、基板を保持する保持面を有する。
上記機能性素子は、上記保持面に設けられ電圧の大きさによって保持力が可変である。
これにより、基板に対する保持力を電気的に制御することが可能となる。
上記機能性粘着素子は、電気レオロジー効果を利用した粘着素子である。すなわち、この素子は、ゲル状電気絶縁性媒体中に電気レオロジー粒子を分散させ、電圧の大きさで媒体表面における粒子の凝集性を制御するものである。従って、ゲル状媒体を粘着性のある材料で構成すれば、印加電圧の大きさで媒体表面の粘着性が可変となる。
上記粘着性媒体によれば、外部電圧の変化に対して高い追従性をもって電気レオロジー粒子の分散密度を制御することができる。これにより、上記粘着力制御面の粘着力変化を高い応答性で実現できる。
上記支持台は、下側基板を支持するためのものである。
上記保持機構は、保持面と、機能性素子とを有する。上記保持面は、上側基板の上面を保持するためのものである。上記機能性素子は、上記保持面に設けられ電圧の大きさによって保持力が可変である。上記保持機構は、上側基板の下面を上記支持台に支持された下側基板の上面に対向させる。
これにより、基板に対する保持力を電気的に制御することが可能となる。
上記機能性粘着素子は、電気レオロジー効果を利用した粘着素子である。すなわち、この素子は、ゲル状電気絶縁性媒体中に電気レオロジー粒子を分散させ、電圧の大きさで媒体表面における粒子の凝集性を制御するものである。従って、ゲル状媒体を粘着性のある材料で構成すれば、印加電圧の大きさで媒体表面の粘着性が可変となる。
上記粘着性媒体によれば、外部電圧の変化に対して高い追従性をもって電気レオロジー粒子の分散密度を制御することができる。これにより、上記粘着力制御面の粘着力変化を高い応答性で実現できる。
これにより、上側基板の上下を反転させることが可能となり、下側基板に対する上側基板の対向配置が容易となる。
これにより、上側基板を保持した状態で、上側基板を下側基板へ加圧することが可能となり、上側基板と下側基板との接合が容易となる。
21 支持台
22 保持体
23 駆動軸
24 真空チャンバ
25 機能性粘着素子
26 電気絶縁性媒体
27 電気レオロジー粒子
28a,28b 電極
29 電圧源
30 スイッチ
31 真空吸着機構
32 静電チャック機構
33 電磁石
35 機能性素子
51 保持力発生源
53 機能性素子
LW 下側基板
UW 上側基板
W 基板
Claims (4)
- 基板の一表面を保持する保持面を有する保持体と、
電気絶縁性の粘着性媒体と、前記粘着性媒体中に分散された電気レオロジー粒子と、前記粘着性媒体に電圧を印加する電極対とを有し、前記保持面に設けられた機能性素子と
を具備し、
前記粘着性媒体は、前記電極対が配置される第1の面と、前記第1の面と対向し、前記電極対間へ印加される電圧の大きさで粘着力が制御される第2の面とを有し、
前記機能性素子は、
前記電極対間へ印加される電圧がオン状態のときは、前記第2の面に分布した前記電気レオロジー粒子を前記粘着性媒体の内部に埋没させることで、前記第2の面の有する粘着力で前記基板を保持し、
前記電極対間へ印加される電圧がオフ状態のときは、前記第2の面から前記電気レオロジー粒子を突出させることで、前記第2の面の粘着力を消失させる
基板保持機構。 - 下側基板を支持するための支持台と、
上側基板の上面を保持するための保持面と、
電気絶縁性の粘着性媒体と、前記粘着性媒体中に分散された電気レオロジー粒子と、前記粘着性媒体に電圧を印加する電極対とを有し、前記保持面に設けられた機能性素子とを含み、前記上側基板の下面を前記支持台に支持された前記下側基板の上面に対向させる保持機構と
を具備し、
前記粘着性媒体は、前記電極対が配置される第1の面と、前記第1の面と対向し、前記電極対間へ印加される電圧の大きさで粘着力が制御される第2の面とを有し、
前記機能性素子は、
前記電極対間へ印加される電圧がオン状態のときは、前記第2の面に分布した前記電気レオロジー粒子を前記粘着性媒体の内部に埋没させることで、前記第2の面の有する粘着力で前記上側基板の上面を保持し、
前記電極対間へ印加される電圧がオフ状態のときは、前記第2の面から前記電気レオロジー粒子を突出させることで、前記第2の面の粘着力を消失させる
する基板組立装置。 - 請求項2に記載の基板組立装置であって、
前記上側基板の上下を反転させる反転機構をさらに具備する
基板組立装置。 - 請求項2に記載の基板組立装置であって、
前記上側基板を前記下側基板に向けて加圧する加圧機構をさらに具備する
基板組立装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009510846A JP5024971B2 (ja) | 2007-04-19 | 2008-04-15 | 基板保持機構およびこれを備えた基板組立装置 |
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Application Number | Priority Date | Filing Date | Title |
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JP2007110372 | 2007-04-19 | ||
JP2007110372 | 2007-04-19 | ||
PCT/JP2008/057367 WO2008129989A1 (ja) | 2007-04-19 | 2008-04-15 | 基板保持機構およびこれを備えた基板組立装置 |
JP2009510846A JP5024971B2 (ja) | 2007-04-19 | 2008-04-15 | 基板保持機構およびこれを備えた基板組立装置 |
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Publication Number | Publication Date |
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JPWO2008129989A1 JPWO2008129989A1 (ja) | 2010-07-22 |
JP5024971B2 true JP5024971B2 (ja) | 2012-09-12 |
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JP2009510846A Active JP5024971B2 (ja) | 2007-04-19 | 2008-04-15 | 基板保持機構およびこれを備えた基板組立装置 |
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Country | Link |
---|---|
US (1) | US20100109220A1 (ja) |
JP (1) | JP5024971B2 (ja) |
KR (2) | KR101248342B1 (ja) |
CN (1) | CN101669199B (ja) |
TW (1) | TW200849454A (ja) |
WO (1) | WO2008129989A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015151257A (ja) * | 2014-02-18 | 2015-08-24 | 藤倉化成株式会社 | 吸着装置 |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120114456A1 (en) * | 2009-03-31 | 2012-05-10 | Musha Kazuhiro | Holding apparatus, conveying apparatus, and rotation-transmitting apparatus |
CN102362341A (zh) * | 2009-03-31 | 2012-02-22 | 株式会社爱发科 | 一种夹持装置、输送装置及旋转传动装置 |
WO2011158444A1 (ja) * | 2010-06-18 | 2011-12-22 | 株式会社アルバック | 搬送処理装置及び処理装置 |
JP5656106B2 (ja) * | 2010-07-22 | 2015-01-21 | 株式会社リコー | 粉体移動装置、プロセスカートリッジおよび画像形成装置 |
JP2014179355A (ja) * | 2011-07-04 | 2014-09-25 | Asahi Glass Co Ltd | ガラス基板の剥離方法及びその装置 |
WO2014021198A1 (ja) * | 2012-07-30 | 2014-02-06 | 芝浦メカトロニクス株式会社 | 基板貼合装置及び貼合方法 |
US20140150952A1 (en) * | 2012-12-04 | 2014-06-05 | Apple Inc. | Lamination Systems With Temperature-Controlled Lamination Rollers |
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Also Published As
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KR20090130200A (ko) | 2009-12-18 |
US20100109220A1 (en) | 2010-05-06 |
KR20120054096A (ko) | 2012-05-29 |
TW200849454A (en) | 2008-12-16 |
KR101159414B1 (ko) | 2012-06-28 |
JPWO2008129989A1 (ja) | 2010-07-22 |
WO2008129989A1 (ja) | 2008-10-30 |
CN101669199B (zh) | 2011-06-15 |
KR101248342B1 (ko) | 2013-04-03 |
CN101669199A (zh) | 2010-03-10 |
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