HK1181065A1 - Conductive adhesive agent composition and conductive adhesive film - Google Patents
Conductive adhesive agent composition and conductive adhesive filmInfo
- Publication number
- HK1181065A1 HK1181065A1 HK13108218.4A HK13108218A HK1181065A1 HK 1181065 A1 HK1181065 A1 HK 1181065A1 HK 13108218 A HK13108218 A HK 13108218A HK 1181065 A1 HK1181065 A1 HK 1181065A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- conductive adhesive
- agent composition
- adhesive film
- adhesive agent
- film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010165781 | 2010-07-23 | ||
JP2011095060 | 2011-04-21 | ||
PCT/JP2011/004058 WO2012011265A1 (ja) | 2010-07-23 | 2011-07-15 | 接着剤組成物及び接着フィルム |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1181065A1 true HK1181065A1 (en) | 2013-11-01 |
Family
ID=45496698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13108218.4A HK1181065A1 (en) | 2010-07-23 | 2013-07-12 | Conductive adhesive agent composition and conductive adhesive film |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5002074B2 (ja) |
KR (1) | KR101741292B1 (ja) |
CN (1) | CN102906211B (ja) |
HK (1) | HK1181065A1 (ja) |
TW (1) | TWI496863B (ja) |
WO (1) | WO2012011265A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014511029A (ja) * | 2012-03-27 | 2014-05-01 | エイブルスティック・(シャンハイ)・リミテッド | コンデンサ用導電性コーティングおよびそれを用いたコンデンサ |
KR102055031B1 (ko) * | 2012-06-29 | 2019-12-11 | 타츠타 전선 주식회사 | 도전성 접착제 조성물, 도전성 접착필름, 접착방법 및 회로기판 |
JP6152319B2 (ja) | 2013-08-09 | 2017-06-21 | 日東電工株式会社 | 粘着剤組成物、粘着テープ又はシート |
WO2015068611A1 (ja) * | 2013-11-07 | 2015-05-14 | 東洋インキScホールディングス株式会社 | 導電性接着剤、導電性接着シート、配線デバイス、および配線デバイスの製造方法 |
JP6332458B2 (ja) * | 2014-07-31 | 2018-05-30 | 東亞合成株式会社 | 接着剤層付き積層体、並びに、これを用いたフレキシブル銅張積層板及びフレキシブルフラットケーブル |
CN104497546A (zh) * | 2014-11-10 | 2015-04-08 | 苏州维泰生物技术有限公司 | 一种医用抗静电导磁聚氨酯薄膜及其制备方法 |
KR101797723B1 (ko) | 2014-12-08 | 2017-11-14 | 셍기 테크놀로지 코. 엘티디. | 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체 |
WO2024009969A1 (ja) * | 2022-07-06 | 2024-01-11 | 東亞合成株式会社 | 接着剤組成物、ボンディングフィルム、接着剤組成物層付き積層体、積層体、及び、電磁波シールドフィルム |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2571733B1 (fr) * | 1984-10-16 | 1987-02-06 | Atochem | Compositions adhesives a base d'elastomeres thermoplastiques et de polyetheramides et leurs utilisations |
JPS6386781A (ja) * | 1986-09-30 | 1988-04-18 | Sekisui Chem Co Ltd | 異方導電性接着シ−ト |
FR2662611B1 (fr) * | 1990-06-01 | 1992-08-07 | Salomon Sa | Ski et elements de ski. |
JPH093323A (ja) * | 1995-06-19 | 1997-01-07 | Taisei Plus Kk | 熱融着性に優れた熱可塑性弾性体組成物 |
JP2001354938A (ja) * | 2000-06-12 | 2001-12-25 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置 |
US7015284B2 (en) * | 2004-01-06 | 2006-03-21 | The Goodyear Tire & Rubber Company | Thermoplastic elastomer composition |
ES2453566T3 (es) * | 2005-08-26 | 2014-04-08 | Kuraray Co., Ltd. | Composición de elastómero termoplástico y artículo moldeado compuesto fabricado a partir de la misma |
JP4435253B2 (ja) * | 2008-03-26 | 2010-03-17 | 住友ゴム工業株式会社 | インナーライナーおよび空気入りタイヤ |
JP4580021B2 (ja) * | 2009-01-26 | 2010-11-10 | タツタ電線株式会社 | 接着剤組成物 |
-
2011
- 2011-07-15 KR KR1020127029990A patent/KR101741292B1/ko active IP Right Grant
- 2011-07-15 JP JP2011540991A patent/JP5002074B2/ja active Active
- 2011-07-15 CN CN201180025117.XA patent/CN102906211B/zh active Active
- 2011-07-15 WO PCT/JP2011/004058 patent/WO2012011265A1/ja active Application Filing
- 2011-07-20 TW TW100125646A patent/TWI496863B/zh active
-
2013
- 2013-07-12 HK HK13108218.4A patent/HK1181065A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
JP5002074B2 (ja) | 2012-08-15 |
KR101741292B1 (ko) | 2017-05-29 |
CN102906211B (zh) | 2014-11-05 |
TW201207066A (en) | 2012-02-16 |
JPWO2012011265A1 (ja) | 2013-09-09 |
CN102906211A (zh) | 2013-01-30 |
TWI496863B (zh) | 2015-08-21 |
KR20130096636A (ko) | 2013-08-30 |
WO2012011265A1 (ja) | 2012-01-26 |
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