HK1181065A1 - Conductive adhesive agent composition and conductive adhesive film - Google Patents
Conductive adhesive agent composition and conductive adhesive filmInfo
- Publication number
- HK1181065A1 HK1181065A1 HK13108218.4A HK13108218A HK1181065A1 HK 1181065 A1 HK1181065 A1 HK 1181065A1 HK 13108218 A HK13108218 A HK 13108218A HK 1181065 A1 HK1181065 A1 HK 1181065A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- conductive adhesive
- agent composition
- adhesive film
- adhesive agent
- film
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
- C09J177/12—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010165781 | 2010-07-23 | ||
JP2011095060 | 2011-04-21 | ||
PCT/JP2011/004058 WO2012011265A1 (en) | 2010-07-23 | 2011-07-15 | Adhesive agent composition and adhesive film |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1181065A1 true HK1181065A1 (en) | 2013-11-01 |
Family
ID=45496698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13108218.4A HK1181065A1 (en) | 2010-07-23 | 2013-07-12 | Conductive adhesive agent composition and conductive adhesive film |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5002074B2 (en) |
KR (1) | KR101741292B1 (en) |
CN (1) | CN102906211B (en) |
HK (1) | HK1181065A1 (en) |
TW (1) | TWI496863B (en) |
WO (1) | WO2012011265A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014511029A (en) * | 2012-03-27 | 2014-05-01 | エイブルスティック・(シャンハイ)・リミテッド | Conductive coating for capacitor and capacitor using the same |
KR102055031B1 (en) * | 2012-06-29 | 2019-12-11 | 타츠타 전선 주식회사 | Conductive adhesive composition, conductive adhesive film, bonding method, and circuit board |
JP6152319B2 (en) | 2013-08-09 | 2017-06-21 | 日東電工株式会社 | Adhesive composition, adhesive tape or sheet |
WO2015068611A1 (en) * | 2013-11-07 | 2015-05-14 | 東洋インキScホールディングス株式会社 | Electroconductive adhesive, electroconductive adhesive sheet, wiring device, and method for manufacturing wiring device |
JP6332458B2 (en) * | 2014-07-31 | 2018-05-30 | 東亞合成株式会社 | Laminated body with adhesive layer, flexible copper-clad laminate and flexible flat cable using the same |
CN104497546A (en) * | 2014-11-10 | 2015-04-08 | 苏州维泰生物技术有限公司 | Medical antistatic magnetic conductive polyurethane film and preparation method thereof |
KR101797723B1 (en) | 2014-12-08 | 2017-11-14 | 셍기 테크놀로지 코. 엘티디. | Adhesive composition, adhesive film, and flexible metal laminate |
WO2024009969A1 (en) * | 2022-07-06 | 2024-01-11 | 東亞合成株式会社 | Adhesive composition, bonding film, laminate with adhesive composition layer, laminate, and electromagnetic wave shield film |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2571733B1 (en) * | 1984-10-16 | 1987-02-06 | Atochem | ADHESIVE COMPOSITIONS BASED ON THERMOPLASTIC ELASTOMERS AND POLYETHERAMIDES AND USES THEREOF |
JPS6386781A (en) * | 1986-09-30 | 1988-04-18 | Sekisui Chem Co Ltd | Anisotropically electrically conductive adhesive sheet |
FR2662611B1 (en) * | 1990-06-01 | 1992-08-07 | Salomon Sa | SKI AND SKI ELEMENTS. |
JPH093323A (en) * | 1995-06-19 | 1997-01-07 | Taisei Plus Kk | Thermoplastic elastomer composition excellent in fusibility |
JP2001354938A (en) * | 2000-06-12 | 2001-12-25 | Toray Ind Inc | Adhesive composition for semiconductor device, and adhesive sheet prepared by using the composition, semiconductor-connecting substrate, and semiconductor device prepared by using the composition |
US7015284B2 (en) * | 2004-01-06 | 2006-03-21 | The Goodyear Tire & Rubber Company | Thermoplastic elastomer composition |
ES2453566T3 (en) * | 2005-08-26 | 2014-04-08 | Kuraray Co., Ltd. | Thermoplastic elastomer composition and composite molded article manufactured therefrom |
JP4435253B2 (en) * | 2008-03-26 | 2010-03-17 | 住友ゴム工業株式会社 | Inner liner and pneumatic tire |
JP4580021B2 (en) * | 2009-01-26 | 2010-11-10 | タツタ電線株式会社 | Adhesive composition |
-
2011
- 2011-07-15 KR KR1020127029990A patent/KR101741292B1/en active IP Right Grant
- 2011-07-15 JP JP2011540991A patent/JP5002074B2/en active Active
- 2011-07-15 CN CN201180025117.XA patent/CN102906211B/en active Active
- 2011-07-15 WO PCT/JP2011/004058 patent/WO2012011265A1/en active Application Filing
- 2011-07-20 TW TW100125646A patent/TWI496863B/en active
-
2013
- 2013-07-12 HK HK13108218.4A patent/HK1181065A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP5002074B2 (en) | 2012-08-15 |
KR101741292B1 (en) | 2017-05-29 |
CN102906211B (en) | 2014-11-05 |
TW201207066A (en) | 2012-02-16 |
JPWO2012011265A1 (en) | 2013-09-09 |
CN102906211A (en) | 2013-01-30 |
TWI496863B (en) | 2015-08-21 |
KR20130096636A (en) | 2013-08-30 |
WO2012011265A1 (en) | 2012-01-26 |
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