HK1181065A1 - Conductive adhesive agent composition and conductive adhesive film - Google Patents

Conductive adhesive agent composition and conductive adhesive film

Info

Publication number
HK1181065A1
HK1181065A1 HK13108218.4A HK13108218A HK1181065A1 HK 1181065 A1 HK1181065 A1 HK 1181065A1 HK 13108218 A HK13108218 A HK 13108218A HK 1181065 A1 HK1181065 A1 HK 1181065A1
Authority
HK
Hong Kong
Prior art keywords
conductive adhesive
agent composition
adhesive film
adhesive agent
film
Prior art date
Application number
HK13108218.4A
Other languages
Chinese (zh)
Inventor
木下淳
寺田恆彥
Original Assignee
大自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大自達電線股份有限公司 filed Critical 大自達電線股份有限公司
Publication of HK1181065A1 publication Critical patent/HK1181065A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/06—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)
HK13108218.4A 2010-07-23 2013-07-12 Conductive adhesive agent composition and conductive adhesive film HK1181065A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010165781 2010-07-23
JP2011095060 2011-04-21
PCT/JP2011/004058 WO2012011265A1 (en) 2010-07-23 2011-07-15 Adhesive agent composition and adhesive film

Publications (1)

Publication Number Publication Date
HK1181065A1 true HK1181065A1 (en) 2013-11-01

Family

ID=45496698

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13108218.4A HK1181065A1 (en) 2010-07-23 2013-07-12 Conductive adhesive agent composition and conductive adhesive film

Country Status (6)

Country Link
JP (1) JP5002074B2 (en)
KR (1) KR101741292B1 (en)
CN (1) CN102906211B (en)
HK (1) HK1181065A1 (en)
TW (1) TWI496863B (en)
WO (1) WO2012011265A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014511029A (en) * 2012-03-27 2014-05-01 エイブルスティック・（シャンハイ）・リミテッド Conductive coating for capacitor and capacitor using the same
KR102055031B1 (en) * 2012-06-29 2019-12-11 타츠타 전선 주식회사 Conductive adhesive composition, conductive adhesive film, bonding method, and circuit board
JP6152319B2 (en) 2013-08-09 2017-06-21 日東電工株式会社 Adhesive composition, adhesive tape or sheet
WO2015068611A1 (en) * 2013-11-07 2015-05-14 東洋インキＳｃホールディングス株式会社 Electroconductive adhesive, electroconductive adhesive sheet, wiring device, and method for manufacturing wiring device
JP6332458B2 (en) * 2014-07-31 2018-05-30 東亞合成株式会社 Laminated body with adhesive layer, flexible copper-clad laminate and flexible flat cable using the same
CN104497546A (en) * 2014-11-10 2015-04-08 苏州维泰生物技术有限公司 Medical antistatic magnetic conductive polyurethane film and preparation method thereof
KR101797723B1 (en) 2014-12-08 2017-11-14 셍기 테크놀로지 코. 엘티디. Adhesive composition, adhesive film, and flexible metal laminate
WO2024009969A1 (en) * 2022-07-06 2024-01-11 東亞合成株式会社 Adhesive composition, bonding film, laminate with adhesive composition layer, laminate, and electromagnetic wave shield film

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2571733B1 (en) * 1984-10-16 1987-02-06 Atochem ADHESIVE COMPOSITIONS BASED ON THERMOPLASTIC ELASTOMERS AND POLYETHERAMIDES AND USES THEREOF
JPS6386781A (en) * 1986-09-30 1988-04-18 Sekisui Chem Co Ltd Anisotropically electrically conductive adhesive sheet
FR2662611B1 (en) * 1990-06-01 1992-08-07 Salomon Sa SKI AND SKI ELEMENTS.
JPH093323A (en) * 1995-06-19 1997-01-07 Taisei Plus Kk Thermoplastic elastomer composition excellent in fusibility
JP2001354938A (en) * 2000-06-12 2001-12-25 Toray Ind Inc Adhesive composition for semiconductor device, and adhesive sheet prepared by using the composition, semiconductor-connecting substrate, and semiconductor device prepared by using the composition
US7015284B2 (en) * 2004-01-06 2006-03-21 The Goodyear Tire & Rubber Company Thermoplastic elastomer composition
ES2453566T3 (en) * 2005-08-26 2014-04-08 Kuraray Co., Ltd. Thermoplastic elastomer composition and composite molded article manufactured therefrom
JP4435253B2 (en) * 2008-03-26 2010-03-17 住友ゴム工業株式会社 Inner liner and pneumatic tire
JP4580021B2 (en) * 2009-01-26 2010-11-10 タツタ電線株式会社 Adhesive composition

Also Published As

Publication number Publication date
JP5002074B2 (en) 2012-08-15
KR101741292B1 (en) 2017-05-29
CN102906211B (en) 2014-11-05
TW201207066A (en) 2012-02-16
JPWO2012011265A1 (en) 2013-09-09
CN102906211A (en) 2013-01-30
TWI496863B (en) 2015-08-21
KR20130096636A (en) 2013-08-30
WO2012011265A1 (en) 2012-01-26

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