JP4990551B2 - ドライエッチング方法 - Google Patents
ドライエッチング方法 Download PDFInfo
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- JP4990551B2 JP4990551B2 JP2006124669A JP2006124669A JP4990551B2 JP 4990551 B2 JP4990551 B2 JP 4990551B2 JP 2006124669 A JP2006124669 A JP 2006124669A JP 2006124669 A JP2006124669 A JP 2006124669A JP 4990551 B2 JP4990551 B2 JP 4990551B2
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- Prior art keywords
- etching
- gas
- silicon plate
- insulating film
- resist mask
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 41
- 238000001312 dry etching Methods 0.000 title claims description 27
- 238000005530 etching Methods 0.000 claims description 144
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 85
- 229910052710 silicon Inorganic materials 0.000 claims description 75
- 239000010703 silicon Substances 0.000 claims description 75
- 239000011229 interlayer Substances 0.000 claims description 52
- 239000000758 substrate Substances 0.000 claims description 37
- 125000001153 fluoro group Chemical group F* 0.000 claims description 36
- 239000003990 capacitor Substances 0.000 claims description 31
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 11
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 claims 1
- 239000007789 gas Substances 0.000 description 97
- 239000000463 material Substances 0.000 description 14
- 229910004298 SiO 2 Inorganic materials 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 239000002305 electric material Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000005686 electrostatic field Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000000026 X-ray photoelectron spectrum Methods 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 244000132059 Carica parviflora Species 0.000 description 1
- 235000014653 Carica parviflora Nutrition 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 101100107923 Vitis labrusca AMAT gene Proteins 0.000 description 1
- 238000005513 bias potential Methods 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
Description
(1)C4F8ガスからなるエッチングガス:総流量100sccm、可変コンデンサーの値:0F
(2)C4F8ガスからなるエッチングガス:総流量100sccm、可変コンデンサーの値:100pF
(3)C4F8ガスとArガスとからなるエッチングガス:C4F8ガス10sccm及びArガス90sccm、可変コンデンサーの値:0pF
(4)実施例1と同一の条件
各場合について、層間絶縁膜及びレジストマスクのエッチングレートを測定し、このエッチングレートから選択比(層間絶縁膜としてのSiO2のエッチングレート/レジストマスクのエッチングレート)を求めた。結果を図5に示す。
4 ガス導入手段 6 シリコンプレート
11 真空チャンバ 12 真空排気手段
25 第1高周波電源 31 天板
32 可変コンデンサー 33 第2高周波電源
34 分岐点 51 磁場コイル
52 高周波アンテナコイル S 処理基板
Claims (4)
- 真空チャンバー内にフルオロカーボンガス及び希ガスからなるエッチングガスを導入し、真空チャンバー内を所定の圧力にしてプラズマを発生させて処理基板上に形成された層間絶縁膜をエッチングするドライエッチング方法において、前記真空チャンバー内に設けられたシリコンプレートに容量が100pFに設定された可変コンデンサーを介して高周波電源から200Vの電圧を印加し、シリコンプレート表面のシリコン原子とフッ素原子とを反応させて真空チャンバー内に存在するフッ素原子を消費しながらエッチングを行なうことを特徴とするドライエッチング方法。
- 前記希ガスの流量が、エッチングガスの総流量の80〜95パーセントであることを特徴とする請求項1記載のドライエッチング方法。
- 前記希ガスが、Ar、Kr及びXeから選ばれた少なくとも一種のガスであることを特徴とする請求項1又は2に記載のドライエッチング方法。
- 前記ドライエッチング方法を1Pa以下の低圧プロセスで行うことを特徴とする請求項1〜3のいずれか1項に記載のドライエッチング方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2006124669A JP4990551B2 (ja) | 2006-04-28 | 2006-04-28 | ドライエッチング方法 |
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JP2006124669A JP4990551B2 (ja) | 2006-04-28 | 2006-04-28 | ドライエッチング方法 |
Publications (2)
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JP2007299818A JP2007299818A (ja) | 2007-11-15 |
JP4990551B2 true JP4990551B2 (ja) | 2012-08-01 |
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JP2006124669A Active JP4990551B2 (ja) | 2006-04-28 | 2006-04-28 | ドライエッチング方法 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102549725B (zh) * | 2009-09-29 | 2016-06-01 | 株式会社爱发科 | 等离子蚀刻装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11191554A (ja) * | 1997-12-26 | 1999-07-13 | Hitachi Ltd | プラズマ処理装置およびプラズマ処理方法 |
JP2001053061A (ja) * | 1999-08-06 | 2001-02-23 | Hitachi Ltd | ドライエッチング方法 |
JP3736795B2 (ja) * | 2001-10-01 | 2006-01-18 | 株式会社アルバック | エッチング装置 |
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