JP3998003B2 - プラズマエッチング法 - Google Patents
プラズマエッチング法 Download PDFInfo
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- JP3998003B2 JP3998003B2 JP2004127526A JP2004127526A JP3998003B2 JP 3998003 B2 JP3998003 B2 JP 3998003B2 JP 2004127526 A JP2004127526 A JP 2004127526A JP 2004127526 A JP2004127526 A JP 2004127526A JP 3998003 B2 JP3998003 B2 JP 3998003B2
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- etching
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- 238000001020 plasma etching Methods 0.000 title claims description 168
- 238000000034 method Methods 0.000 title claims description 48
- 238000005530 etching Methods 0.000 claims description 188
- 239000007789 gas Substances 0.000 claims description 82
- 239000000463 material Substances 0.000 claims description 34
- 230000008021 deposition Effects 0.000 claims description 33
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 11
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 9
- 229910001882 dioxygen Inorganic materials 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 125000001153 fluoro group Chemical group F* 0.000 claims description 8
- 150000002500 ions Chemical class 0.000 description 37
- 238000000151 deposition Methods 0.000 description 31
- 229910004298 SiO 2 Inorganic materials 0.000 description 30
- 229910052710 silicon Inorganic materials 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 230000008859 change Effects 0.000 description 10
- 238000010494 dissociation reaction Methods 0.000 description 8
- 230000005593 dissociations Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 229910052717 sulfur Inorganic materials 0.000 description 7
- 229910052720 vanadium Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910020175 SiOH Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- 229910020177 SiOF Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C19/00—Bedsteads
- A47C19/02—Parts or details of bedsteads not fully covered in a single one of the following subgroups, e.g. bed rails, post rails
- A47C19/021—Bedstead frames
- A47C19/022—Head or foot boards
-
- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47C—CHAIRS; SOFAS; BEDS
- A47C21/00—Attachments for beds, e.g. sheet holders, bed-cover holders; Ventilating, cooling or heating means in connection with bedsteads or mattresses
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Description
プラズマエッチング装置のプラズマを取り囲む部分に生成物の堆積が生じないように、フルオロカーボン系ガスを構成する炭素原子の総量をC0、フッ素原子の総量をF0としたとき、F0/C0の値に応じて、プラズマエッチング装置の前記部分の最表面に生じるシース電位VSを制御することを特徴とする。
プラズマエッチング装置のプラズマを取り囲む部分に生成物の堆積が生じないように、第m層(但し、m=1,2・・・M)のプラズマエッチングにおいて用いるフルオロカーボン系ガスを構成する炭素原子の総量をCm-0、フッ素原子の総量をFm-0としたとき、Fm-0/Cm-0の値に応じて、第m層のプラズマエッチングにおいてプラズマエッチング装置の前記部分の最表面に生じるシース電位Vm-Sを制御することを特徴とする。
エッチングされる電位(V) 実質的にエッチングされる電位(V)
シリコン 50 450
アルミナ 100 500
石英 100 500
イットリア 150 550
=(ΣFLj・Fj)/(ΣFLj・Cj) (1)
エッチング用ガス :C5F8/Ar/O2=10/600/10sccm
F0/C0(Fc) :1.6
圧力 :2.7Torr
プラズマ密度 :2×1011cm-3
シース電位VS :400ボルト
基板入射イオンエネルギー:1500ボルト
エッチング用ガス :CF4/CH2F2/Ar/O2=5/5/600/20sccm
圧力 :2.7Torr
プラズマ密度 :1×1011cm-3
シース電位VS :100ボルト
基板入射イオンエネルギー:500ボルト
エッチング用ガス :C4F8/Ar/O2=4/600/6sccm
F0/C0(Fc) :2.0
圧力 :2.7Torr
プラズマ密度 :2×1011cm-3
シース電位Vm-S :350ボルト
基板入射イオンエネルギー:1500ボルト
エッチング用ガス :O2=1000sccm
圧力 :2.7Torr
プラズマ密度 :1×1010cm-3
シース電位VS :30ボルト
基板入射イオンエネルギー:200ボルト
エッチング用ガス :C5F8/Ar/O2=3/600/6sccm
F0/C0(Fc) :1.6
圧力 :2.7Torr
プラズマ密度 :2×1011cm-3
シース電位Vm-S :400ボルト
基板入射イオンエネルギー:1500ボルト
エッチング用ガス :CF4/CH2F2/Ar/O2=10/5/1000/20sccm
圧力 :2.7Torr
プラズマ密度 :1×1010cm-3
シース電位VS :30ボルト
基板入射イオンエネルギー:200ボルト
Claims (6)
- プラズマエッチング装置を使用し、エッチング用ガスとしてフルオロカーボン系ガスを用いて絶縁層をプラズマエッチングする方法であって、
フルオロカーボン系ガスを構成する炭素原子の総量をC0、フッ素原子の総量をF0としたとき、F0/C0の値に応じて、しかも、プラズマエッチング装置のプラズマを取り囲む部分に生成物の堆積が生じないような電位よりも高い値に、且つ、プラズマエッチング装置の該部分を構成する材料が実質的にエッチングされる電位よりも低い値に、プラズマエッチング装置の該部分の最表面に生じるシース電位を制御することを特徴とするプラズマエッチング法。 - エッチング用ガス中には酸素ガスが含まれ、
エッチング用ガス中における酸素原子の総量をO0としたとき、C0>O0を満たすことを特徴とする請求項1に記載のプラズマエッチング法。 - 絶縁層を構成する材料には、ケイ素原子が含まれることを特徴とする請求項1に記載のプラズマエッチング法。
- プラズマエッチング装置を使用し、少なくとも絶縁層を1層有するM層構造(但し、M≧2)における各層を、エッチング用ガスとしてフルオロカーボン系ガスを用いてプラズマエッチングする方法であって、
第m層(但し、m=1,2・・・M)のプラズマエッチングにおいて用いるフルオロカーボン系ガスを構成する炭素原子の総量をCm-0、フッ素原子の総量をFm-0としたとき、Fm-0/Cm-0の値に応じて、しかも、第m層のプラズマエッチングにおいて、プラズマエッチング装置のプラズマを取り囲む部分に生成物の堆積が生じないような電位よりも高い値に、且つ、プラズマエッチング装置の該部分を構成する材料が実質的にエッチングされる電位よりも低い値に、プラズマエッチング装置の該部分の最表面に生じるシース電位を制御することを特徴とするプラズマエッチング法。 - 少なくとも絶縁層をプラズマエッチングするために用いるエッチング用ガス中には酸素ガスが含まれ、
エッチング用ガス中における酸素原子の総量をO0としたとき、C0>O0を満たすことを特徴とする請求項4に記載のプラズマエッチング法。 - 絶縁層を構成する材料には、ケイ素原子が含まれることを特徴とする請求項4に記載のプラズマエッチング法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004127526A JP3998003B2 (ja) | 2004-04-23 | 2004-04-23 | プラズマエッチング法 |
TW094111211A TWI264775B (en) | 2004-04-23 | 2005-04-08 | Plasma etching method |
US11/110,380 US20050247672A1 (en) | 2004-04-23 | 2005-04-20 | Plasma etching method |
KR1020050033406A KR20060047378A (ko) | 2004-04-23 | 2005-04-22 | 플라즈마 에칭 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004127526A JP3998003B2 (ja) | 2004-04-23 | 2004-04-23 | プラズマエッチング法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005311141A JP2005311141A (ja) | 2005-11-04 |
JP3998003B2 true JP3998003B2 (ja) | 2007-10-24 |
Family
ID=35238512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004127526A Expired - Fee Related JP3998003B2 (ja) | 2004-04-23 | 2004-04-23 | プラズマエッチング法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050247672A1 (ja) |
JP (1) | JP3998003B2 (ja) |
KR (1) | KR20060047378A (ja) |
TW (1) | TWI264775B (ja) |
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---|---|---|---|---|
TWI475594B (zh) * | 2008-05-19 | 2015-03-01 | Entegris Inc | 靜電夾頭 |
KR100890200B1 (ko) * | 2008-12-08 | 2009-03-25 | 은성산업(주) | 플렉시블 플랫 케이블 |
US8861170B2 (en) | 2009-05-15 | 2014-10-14 | Entegris, Inc. | Electrostatic chuck with photo-patternable soft protrusion contact surface |
US9025305B2 (en) * | 2010-05-28 | 2015-05-05 | Entegris, Inc. | High surface resistivity electrostatic chuck |
US9132436B2 (en) | 2012-09-21 | 2015-09-15 | Applied Materials, Inc. | Chemical control features in wafer process equipment |
US10256079B2 (en) | 2013-02-08 | 2019-04-09 | Applied Materials, Inc. | Semiconductor processing systems having multiple plasma configurations |
US11637002B2 (en) | 2014-11-26 | 2023-04-25 | Applied Materials, Inc. | Methods and systems to enhance process uniformity |
US20160225652A1 (en) | 2015-02-03 | 2016-08-04 | Applied Materials, Inc. | Low temperature chuck for plasma processing systems |
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US10504754B2 (en) | 2016-05-19 | 2019-12-10 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
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US10431429B2 (en) | 2017-02-03 | 2019-10-01 | Applied Materials, Inc. | Systems and methods for radial and azimuthal control of plasma uniformity |
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US11276559B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Semiconductor processing chamber for multiple precursor flow |
US11276590B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Multi-zone semiconductor substrate supports |
US10297458B2 (en) | 2017-08-07 | 2019-05-21 | Applied Materials, Inc. | Process window widening using coated parts in plasma etch processes |
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US11328909B2 (en) | 2017-12-22 | 2022-05-10 | Applied Materials, Inc. | Chamber conditioning and removal processes |
US10854426B2 (en) | 2018-01-08 | 2020-12-01 | Applied Materials, Inc. | Metal recess for semiconductor structures |
US10964512B2 (en) | 2018-02-15 | 2021-03-30 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus and methods |
US10319600B1 (en) | 2018-03-12 | 2019-06-11 | Applied Materials, Inc. | Thermal silicon etch |
US10886137B2 (en) | 2018-04-30 | 2021-01-05 | Applied Materials, Inc. | Selective nitride removal |
US11049755B2 (en) | 2018-09-14 | 2021-06-29 | Applied Materials, Inc. | Semiconductor substrate supports with embedded RF shield |
US10892198B2 (en) | 2018-09-14 | 2021-01-12 | Applied Materials, Inc. | Systems and methods for improved performance in semiconductor processing |
US11062887B2 (en) | 2018-09-17 | 2021-07-13 | Applied Materials, Inc. | High temperature RF heater pedestals |
US11417534B2 (en) | 2018-09-21 | 2022-08-16 | Applied Materials, Inc. | Selective material removal |
US11682560B2 (en) | 2018-10-11 | 2023-06-20 | Applied Materials, Inc. | Systems and methods for hafnium-containing film removal |
US11121002B2 (en) | 2018-10-24 | 2021-09-14 | Applied Materials, Inc. | Systems and methods for etching metals and metal derivatives |
US11437242B2 (en) | 2018-11-27 | 2022-09-06 | Applied Materials, Inc. | Selective removal of silicon-containing materials |
US11721527B2 (en) | 2019-01-07 | 2023-08-08 | Applied Materials, Inc. | Processing chamber mixing systems |
US10920319B2 (en) | 2019-01-11 | 2021-02-16 | Applied Materials, Inc. | Ceramic showerheads with conductive electrodes |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5585012A (en) * | 1994-12-15 | 1996-12-17 | Applied Materials Inc. | Self-cleaning polymer-free top electrode for parallel electrode etch operation |
JP2814370B2 (ja) * | 1995-06-18 | 1998-10-22 | 東京エレクトロン株式会社 | プラズマ処理装置 |
TW487983B (en) * | 1996-04-26 | 2002-05-21 | Hitachi Ltd | Manufacturing method for semiconductor device |
US6451703B1 (en) * | 2000-03-10 | 2002-09-17 | Applied Materials, Inc. | Magnetically enhanced plasma etch process using a heavy fluorocarbon etching gas |
-
2004
- 2004-04-23 JP JP2004127526A patent/JP3998003B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-08 TW TW094111211A patent/TWI264775B/zh not_active IP Right Cessation
- 2005-04-20 US US11/110,380 patent/US20050247672A1/en not_active Abandoned
- 2005-04-22 KR KR1020050033406A patent/KR20060047378A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
TWI264775B (en) | 2006-10-21 |
JP2005311141A (ja) | 2005-11-04 |
TW200603281A (en) | 2006-01-16 |
KR20060047378A (ko) | 2006-05-18 |
US20050247672A1 (en) | 2005-11-10 |
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