JP4905876B2 - 導電性接触子ホルダの製造方法および導電性接触子ホルダ - Google Patents
導電性接触子ホルダの製造方法および導電性接触子ホルダ Download PDFInfo
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Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Manufacture Of Switches (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
2 導電性接触子
3 ホルダ部材
4 基板
4a 中空部
4b ねじ孔
5 ねじ
6 流路
6a ホルダ流路
6b 基板流路
21、22 針状部材
21a、22a フランジ部
23 バネ部材
23a 密巻き部
23b 粗巻き部
31 第1部材
32 第2部材
33、34 ホルダ孔
33a、34a、35b 小径部
33b、34b、35a 大径部
33c、34c 溝部
35 ねじ孔
41 絶縁層
100 半導体集積回路
101 接続用電極
200 回路基板
201 電極
Claims (7)
- 回路構造との間で信号の入出力を行う複数の導電性接触子を保持するホルダ部材と、前
記ホルダ部材を嵌入可能な中空部を有する基板とを備えた導電性接触子ホルダを製造する
導電性接触子ホルダの製造方法であって、
絶縁性材料を用いることによって前記ホルダ部材を形成するホルダ部材形成工程と、
導電性材料を用いることによって前記基板を形成する基板形成工程と、
前記基板形成工程で形成した前記基板が有する前記中空部に対して前記ホルダ部材形成
工程で形成した前記ホルダ部材を嵌入し、前記ホルダ部材と前記基板とをねじでの締結の
みによって固着する固着工程と、
を有することを特徴とする導電性接触子ホルダの製造方法。 - 前記基板形成工程は、前記基板の表面に絶縁層を形成する絶縁層形成工程を含むことを
特徴とする請求項1記載の導電性接触子ホルダの製造方法。 - 前記ホルダ部材形成工程は、当該ホルダ部材を貫通し、前記複数の導電性接触子を個別
に収容する複数のホルダ孔を形成するホルダ孔形成工程を含むことを特徴とする請求項1
または2記載の導電性接触子ホルダの製造方法。 - 前記ホルダ部材形成工程は、前記ホルダ孔形成工程で形成された前記複数のホルダ孔同
士を互いに連通して気体を流動させるホルダ流路を形成するホルダ流路形成工程を含むこ
とを特徴とする請求項3記載の導電性接触子ホルダの製造方法。 - 前記基板形成工程は、前記ホルダ流路形成工程で形成されたホルダ流路を介して当該基
板の異なる側面同士を貫通して気体を流動させる基板流路を形成する基板流路形成工程を
含むことを特徴とする請求項4記載の導電性接触子ホルダの製造方法。 - 回路構造との間で信号の入出力を行う複数の導電性接触子を収容保持する導電性接触子
ホルダであって、
絶縁性材料から成り、当該ホルダ部材を貫通し、前記複数の導電性接触子を個別に収容
する複数のホルダ孔を有するホルダ部材と、
導電性材料から成り、前記ホルダ部材を嵌入可能な中空部を有し、該中空部に嵌入され
た前記ホルダ部材とねじでの締結のみによって固着される基板と、
前記基板の表面に形成された絶縁層と、
を備え、
前記ホルダ部材および前記基板を一括して貫通するとともに前記複数のホルダ孔同士を
互いに連通して気体を流動させる流路が形成されていることを特徴とする導電性接触子ホ
ルダ。 - 前記ホルダ部材は、
第1部材と第2部材とが厚さ方向に積層されて成り、
前記第1および第2部材が積層された状態で対向する端面にはそれぞれ溝部が形成され
ており、両溝部が合わさって前記流路の一部をなしていることを特徴とする請求項6記載
の導電性接触子ホルダ。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317698A JP4905876B2 (ja) | 2005-10-31 | 2005-10-31 | 導電性接触子ホルダの製造方法および導電性接触子ホルダ |
CN2006800407100A CN101300495B (zh) | 2005-10-31 | 2006-10-27 | 导电性触头支架的制造方法及导电性触头支架 |
PCT/JP2006/321514 WO2007052557A1 (ja) | 2005-10-31 | 2006-10-27 | 導電性接触子ホルダの製造方法および導電性接触子ホルダ |
MYPI20081339A MY149110A (en) | 2005-10-31 | 2006-10-27 | Method for manufacturing conductive contact holder, and conductive contact holder |
US12/084,290 US8087955B2 (en) | 2005-10-31 | 2006-10-27 | Method for manufacturing conductive contact holder, and conductive contact holder |
EP06822475.7A EP1950571B1 (en) | 2005-10-31 | 2006-10-27 | Method for manufacturing conductive contact holder, and conductive contact holder |
KR1020087012935A KR101002218B1 (ko) | 2005-10-31 | 2006-10-27 | 도전성 접촉자 홀더의 제조방법 및 도전성 접촉자 홀더 |
TW095140140A TWI318298B (en) | 2005-10-31 | 2006-10-31 | Method for manufacturing a conductive contacter holder, and the conductive contacter holder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005317698A JP4905876B2 (ja) | 2005-10-31 | 2005-10-31 | 導電性接触子ホルダの製造方法および導電性接触子ホルダ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007121247A JP2007121247A (ja) | 2007-05-17 |
JP4905876B2 true JP4905876B2 (ja) | 2012-03-28 |
Family
ID=38005709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005317698A Active JP4905876B2 (ja) | 2005-10-31 | 2005-10-31 | 導電性接触子ホルダの製造方法および導電性接触子ホルダ |
Country Status (8)
Country | Link |
---|---|
US (1) | US8087955B2 (ja) |
EP (1) | EP1950571B1 (ja) |
JP (1) | JP4905876B2 (ja) |
KR (1) | KR101002218B1 (ja) |
CN (1) | CN101300495B (ja) |
MY (1) | MY149110A (ja) |
TW (1) | TWI318298B (ja) |
WO (1) | WO2007052557A1 (ja) |
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JPWO2008072699A1 (ja) * | 2006-12-15 | 2010-04-02 | 日本発條株式会社 | 導電性接触子ホルダおよび導電性接触子ユニット |
JP5008582B2 (ja) * | 2008-02-04 | 2012-08-22 | 株式会社ヨコオ | コンタクトプローブ |
US8633724B2 (en) | 2008-11-26 | 2014-01-21 | Nhk Spring Co., Ltd. | Probe-unit base member and probe unit |
KR101138297B1 (ko) * | 2009-09-25 | 2012-04-25 | 가부시키가이샤 어드밴티스트 | 프로브 장치 및 시험 장치 |
KR101058146B1 (ko) | 2009-11-11 | 2011-08-24 | 하이콘 주식회사 | 스프링 콘택트 및 스프링 콘택트 내장 소켓 |
WO2011065361A1 (ja) * | 2009-11-24 | 2011-06-03 | 日本発條株式会社 | 接続部材 |
JP5903888B2 (ja) * | 2010-03-15 | 2016-04-13 | 日本電産リード株式会社 | 接続端子及び検査用治具 |
US9404941B2 (en) * | 2010-06-25 | 2016-08-02 | Nhk Spring Co., Ltd. | Contact probe and probe unit |
KR101149759B1 (ko) * | 2011-03-14 | 2012-06-01 | 리노공업주식회사 | 반도체 디바이스의 검사장치 |
SG11201401212TA (en) * | 2011-10-07 | 2014-09-26 | Nhk Spring Co Ltd | Probe unit |
JP2013100994A (ja) * | 2011-11-07 | 2013-05-23 | Nidec-Read Corp | 基板検査治具、治具ベースユニット及び基板検査装置 |
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KR101920822B1 (ko) | 2017-04-21 | 2019-02-13 | 리노공업주식회사 | 프로브 소켓 |
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CN108415596B (zh) * | 2018-02-08 | 2021-05-04 | 深圳市志凌伟业技术股份有限公司 | 一种导电性基板及其制造方法 |
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JP3500105B2 (ja) | 2000-02-10 | 2004-02-23 | 日本発条株式会社 | 導電性接触子用支持体及びコンタクトプローブユニット |
JP4789125B2 (ja) * | 2000-12-07 | 2011-10-12 | 株式会社アドバンテスト | 電子部品試験用ソケットおよびこれを用いた電子部品試験装置 |
EP1400811B1 (en) * | 2001-06-28 | 2015-09-30 | NHK SPRING Co., Ltd. | Support body assembly for conductive contactor |
JPWO2003007435A1 (ja) * | 2001-07-13 | 2004-11-04 | 日本発条株式会社 | コンタクタ |
JP2003236140A (ja) | 2002-02-20 | 2003-08-26 | Maruhon Ind Co Ltd | 遊技機、プログラム、記録媒体 |
CN100543474C (zh) * | 2002-04-16 | 2009-09-23 | 日本发条株式会社 | 导电接触探头保持器 |
WO2003087852A1 (en) * | 2002-04-16 | 2003-10-23 | Nhk Spring Co., Ltd. | Holder for conductive contact |
US20040101666A1 (en) * | 2002-09-11 | 2004-05-27 | Dai Nippon Prtg. Co., Ltd. | Inspection contact sheet and method of fabricating the same |
US6924654B2 (en) | 2003-03-12 | 2005-08-02 | Celerity Research, Inc. | Structures for testing circuits and methods for fabricating the structures |
JP4689196B2 (ja) * | 2003-11-05 | 2011-05-25 | 日本発條株式会社 | 導電性接触子ホルダ、導電性接触子ユニット |
JP4721637B2 (ja) * | 2003-12-25 | 2011-07-13 | 日本発條株式会社 | 導電性接触子ホルダ、導電性接触子ユニット、導電性接触子ホルダの製造方法および検査方法 |
JP4884749B2 (ja) * | 2005-10-31 | 2012-02-29 | 日本発條株式会社 | 導電性接触子ホルダの製造方法および導電性接触子ユニットの製造方法 |
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TWI318298B (en) | 2009-12-11 |
CN101300495A (zh) | 2008-11-05 |
KR101002218B1 (ko) | 2010-12-20 |
TW200728725A (en) | 2007-08-01 |
EP1950571B1 (en) | 2015-09-09 |
JP2007121247A (ja) | 2007-05-17 |
EP1950571A1 (en) | 2008-07-30 |
US8087955B2 (en) | 2012-01-03 |
EP1950571A4 (en) | 2010-09-22 |
CN101300495B (zh) | 2011-03-30 |
US20090183908A1 (en) | 2009-07-23 |
MY149110A (en) | 2013-07-15 |
WO2007052557A1 (ja) | 2007-05-10 |
KR20080063530A (ko) | 2008-07-04 |
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