JP4903723B2 - 配線基板、および電子装置 - Google Patents
配線基板、および電子装置 Download PDFInfo
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- JP4903723B2 JP4903723B2 JP2007556042A JP2007556042A JP4903723B2 JP 4903723 B2 JP4903723 B2 JP 4903723B2 JP 2007556042 A JP2007556042 A JP 2007556042A JP 2007556042 A JP2007556042 A JP 2007556042A JP 4903723 B2 JP4903723 B2 JP 4903723B2
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- insulating layer
- wiring board
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
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- 238000007606 doctor blade method Methods 0.000 description 3
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
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- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 229910052454 barium strontium titanate Inorganic materials 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
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- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C09J7/22—Plastics; Metallised plastics
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- B32B2307/306—Resistant to heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/09045—Locally raised area or protrusion of insulating substrate
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/2072—Anchoring, i.e. one structure gripping into another
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Description
本発明の目的、特色、および利点は、下記の詳細な説明と図面とからより明確になるであろう。
(1)まずコア基板3の一主面3aに無電解めっきおよび電気めっきなどによって導電層6が形成される。
(2)次に、コア基板3の一主面3aおよび導電層6上に、たとえばドクターブレード法によって接着剤層5が形成される。
(3)次に、図9Aに示すように、接着剤層5上に、一主面にのみ突出部10を有する第2実施形態にかかる樹脂フィルム1Aが貼着される。樹脂フィルム1Aは、その突出部10を接着剤層5に接するように配置されている。
(4)次に、図9Bに示すように、樹脂フィルム1Aおよび接着剤層5を貫通する貫通孔8が、たとえばレーザ加工によって導電層6に達するまで形成される。貫通孔8の内面は、その直径がコア基板3に向かって小さくなるように傾斜している。
(5)次に、図9Cに示すように、樹脂フィルム1Aの他主面および貫通孔8の内面を、厚み方向に沿ってドライエッチングする。これによって突出部10が、樹脂フィルム1Aの他主面および貫通孔8の内面の双方に形成され、樹脂フィルム1Aが絶縁層4となる。貫通孔8の内面は、貫通孔8の直径が貫通孔8の深さ方向に向かって小さくなるように傾斜しているため、ドライエッチングされやすく、突出部10を形成し易い。また、貫通孔8より導電層6が露出しているため、導電層6の表面に付着した油脂および樹脂の残渣、ならびに製造時に付着した有機繊維等の異物がドライエッチングによって良好に除去され、導電層6と後に形成される貫通導体7の接続不良を抑制し、歩留まり向上に寄与することができる。
(6)次に、図9Dに示すように、電気めっきによって貫通孔8内に貫通導体7を、絶縁層4上に導電層6がそれぞれ設けられる。
(7)次に、絶縁層4上および導電層6上に、たとえばドクターブレード法によって接着剤層5が形成される。
前述の実施形態では、コア基板3の一主面3aに樹脂フィルム1が積層されて多層配線基板2が実現されているが、これに限ることはなく、コア基板3の一主面のみならず他主面にも樹脂フィルム1を複数積層して多層配線基板2を実現しても良い。このようにコア基板3の両主面を用いる場合、コア基板3を厚み方向に貫通し、コア基板3の両主面側に設けられる導電層同士を電気的に接続するコア貫通導体をコア基板3に形成してもよい。
Claims (12)
- 導電層と、
樹脂材料を含んで構成され、前記導電層上に配置される第1絶縁層と、
フィラと、樹脂材料とを含んで構成され、前記第1絶縁層を介して前記導電層上に配置される第2絶縁層と、
前記第1絶縁層および前記第2絶縁層を貫通するように設けられる貫通孔内に配置され、かつ前記導電層に接続された貫通導体と、を備え、
前記貫通孔の内面は、前記第2絶縁層に相当する位置に、先端部に前記フィラを含んだ複数の突出部が形成された突出部形成領域と、前記第1絶縁層に相当する位置に、前記突出部が形成されていない突出部非形成領域とを有し、
前記突出部形成領域に形成された前記突出部が、前記貫通導体内に埋入されている配線基板。 - 複数の前記突出部は、その突出方向の寸法が互いに異なる請求項1に記載の配線基板。
- 前記フィラは、シリカから成る粒子を含む請求項1に記載の配線基板。
- 前記突出部は、その突出方向と直交する方向の幅が最大となる領域が前記先端部に位置している請求項1に記載の配線基板。
- 前記突出部は、前記第2絶縁層の一方主面に更に設けられる請求項1に記載の配線基板。
- 前記突出部は、前記第2絶縁層の他方主面に更に設けられる請求項5に記載の配線基板。
- 前記第2絶縁層の前記一方主面は、前記第1絶縁層と対向しており、
前記一方主面に設けられた前記突出部が、前記第1絶縁層に埋入している請求項5または6に記載の配線基板。 - 前記突出部は、その先端部と前記貫通孔の内面とを接続する柱状部を有し、前記先端部の幅が前記柱状部の幅よりも大きい請求項1に記載の配線基板。
- 前記第2絶縁層において、前記一方主面は、前記第1絶縁層とは反対側に位置し、
前記第2絶縁層の前記一方主面に対向して、前記導電層に電気的に接続される電極パッドを更に備え、前記電極パッドの直下に、前記突出部が位置している請求項5に記載の配線基板。 - 前記第1絶縁層は接着剤層である請求項1に記載の配線基板。
- 前記導電層、前記第1絶縁層および前記第2絶縁層を支持する基体を更に備える請求項1に記載の配線基板。
- 請求項1に記載の配線基板と、該配線基板に電気的に接続され、前記配線基板上に搭載される電子素子と、を備えた電子装置。
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JP2007556042A JP4903723B2 (ja) | 2006-01-30 | 2007-01-29 | 配線基板、および電子装置 |
PCT/JP2007/051420 WO2007086568A1 (ja) | 2006-01-30 | 2007-01-29 | 樹脂フィルム、接着シート、配線基板および電子装置 |
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JP5585426B2 (ja) | 2010-12-07 | 2014-09-10 | Tdk株式会社 | 配線板、電子部品内蔵基板、配線板の製造方法及び電子部品内蔵基板の製造方法 |
JP2013149810A (ja) * | 2012-01-20 | 2013-08-01 | Ngk Spark Plug Co Ltd | 多層配線基板の製造方法 |
JP6829057B2 (ja) * | 2016-11-22 | 2021-02-10 | 京セラ株式会社 | 配線基板 |
KR20210008038A (ko) * | 2018-06-28 | 2021-01-20 | 교세라 가부시키가이샤 | 반도체 제조 장치용 부재의 제조 방법 및 반도체 제조 장치용 부재 |
CN114830840B (zh) * | 2019-12-17 | 2024-04-05 | 日本发条株式会社 | 层叠体、粘结方法及电路基板用半成品 |
JP2022030289A (ja) * | 2020-08-06 | 2022-02-18 | イビデン株式会社 | 配線基板及び配線基板の製造方法 |
CN118020392A (zh) * | 2021-09-29 | 2024-05-10 | 京瓷株式会社 | 布线基板 |
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US8129623B2 (en) | 2012-03-06 |
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