JP4883224B2 - 低温焼結セラミック材料およびセラミック基板 - Google Patents
低温焼結セラミック材料およびセラミック基板 Download PDFInfo
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Description
図1は、この発明に係る低温焼結セラミック材料を用いて製造されるセラミック基板の一例としての多層セラミック基板1を図解的に示す断面図である。
図2は、本発明の低温焼結セラミック材料を用いて構成される第2の実施形態によるセラミック基板21を図解的に示す断面図である。
実験例1はこの発明による効果を確認するために実施したものである。
なお、試料No.1〜48のうち、試料No.1〜12および21〜42は、副成分セラミック材料として、MgOを含まない点で、本発明の範囲外の参考例である。また、試料No.25〜28は、副成分セラミック材料として、CeO 2 を含む点で、この発明の範囲外の参考例である。
図2に示す構成において、第1および第2の表層セラミック部22および23を、実験例1における試料No.1に係る組成をもって形成し、内層セラミック部24を、実験例1における試料No.4に係る組成をもって形成して、表層セラミック部22および23と内層セラミック部24とを積層した状態で焼成工程を実施し、試料となるセラミック基板21を得た。なお、実験例1における試料No.1に係る組成および試料No.4に係る組成は、前述したように、MgOを含まない点で、本発明の範囲外の参考例である。
2 セラミック層
3 積層体
4,5 外部導体膜
6 内部導体膜
7 ビアホール導体
21 セラミック基板
22,23 表層セラミック部
24 内層セラミック部
Claims (6)
- SiをSiO2に換算して48〜75重量%、BaをBaOに換算して20〜40重量%、および、AlをAl2O3に換算して5〜20重量%含有する主成分セラミック材料と、前記主成分セラミック材料100重量部に対して、MnをMnOに換算して2〜10重量部、TiおよびFeから選ばれる少なくとも1種をそれぞれTiO2およびFe2O3に換算して合計で0.1〜10重量部、ならびに、MgをMgOに換算して0.1〜6重量部含有する副成分セラミック材料とを含み、実質的にCe酸化物、Cr酸化物およびB酸化物のいずれをも含まないことを特徴とする、低温焼結セラミック材料。
- 前記副成分セラミック材料として、さらに、前記主成分セラミック材料100重量部に対して、Nb、ZrおよびZnから選ばれる少なくとも1種をそれぞれNb2O5 、ZrO2、ZnOに換算して0.1〜6重量部含有する、請求項1に記載の低温焼結セラミック材料。
- SiをSiO2に換算して48〜75重量%、BaをBaOに換算して20〜40重量%、および、AlをAl2O3に換算して5〜20重量%含有する主成分セラミック材料と、前記主成分セラミック材料100重量部に対して、MnをMnOに換算して2〜10重量部、TiおよびFeから選ばれる少なくとも1種をそれぞれTiO2およびFe2O3に換算して合計で0.1〜10重量部、ならびに、MgをMgOに換算して0.1〜6重量部含有する副成分セラミック材料とを含み、実質的にCe酸化物、Cr酸化物およびB酸化物のいずれをも含まない低温焼結セラミック材料、を焼結させてなるセラミック層を備える、セラミック基板。
- 前記低温焼結セラミック材料は、前記副成分セラミック材料として、さらに、前記主成分セラミック材料100重量部に対して、Nb、ZrおよびZnから選ばれる少なくとも1種をそれぞれNb2O5 、ZrO2、ZnOに換算して0.1〜6重量部含有する、請求項3に記載のセラミック基板。
- 複数の前記セラミック層を積層してなる積層体と、前記積層体の表面および/または内部に設けられた、金、銀および銅の少なくとも1種を主成分とする導体パターンとを有する、請求項3または4に記載のセラミック基板。
- 前記低温焼結セラミック材料は、前記副成分セラミック材料としてTiO2を含み、かつ、前記セラミック層にはBa2TiSi2O8結晶が析出している、請求項3ないし5のいずれかに記載のセラミック基板。
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US20110284270A1 (en) | 2011-11-24 |
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