JP4851558B2 - 組立治具 - Google Patents
組立治具 Download PDFInfo
- Publication number
- JP4851558B2 JP4851558B2 JP2009105109A JP2009105109A JP4851558B2 JP 4851558 B2 JP4851558 B2 JP 4851558B2 JP 2009105109 A JP2009105109 A JP 2009105109A JP 2009105109 A JP2009105109 A JP 2009105109A JP 4851558 B2 JP4851558 B2 JP 4851558B2
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- Prior art keywords
- crimping
- circuit board
- assembly jig
- shield cover
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000002788 crimping Methods 0.000 claims description 59
- 230000007246 mechanism Effects 0.000 claims description 49
- 238000005452 bending Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 230000001105 regulatory effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 13
- 238000003466 welding Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/02—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0447—Hand tools therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0473—Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53252—Means to simultaneously fasten three or more parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5327—Means to fasten by deforming
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Vehicle Body Suspensions (AREA)
- Auxiliary Devices For And Details Of Packaging Control (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
Description
図7を参照する。図7に示すように、本発明の変形例による圧着部131に設けられる凹溝1311の形状は弧形状などであるが、これだけに限定されるわけではなく、回路基板本体50の表面に各第2の位置決め部301の末端を接触するように折り曲げることができれば如何なる態様にしてもよい。つまり、本実施形態では、まず、各第2の位置決め部301が折り曲げられてから、各第2の位置決め部301が押圧されて平坦にされ、対応する接地部に接触されるが、他の実施形態では、直接に各第2の位置決め部301を押圧して平坦にし、対応する接地部に接触させたり、他の方式により各第1の位置決め部501に各第2の位置決め部301を貫設させた後に押圧して平坦にしてもよい。さらに、この変形例では、折り曲げ部133、第1の位置規制部135、第2の位置規制部137およびその他の細部構造を省略することもできる。また、この変形例では、カバー30の周辺部のみを押圧し、シールドカバー30の中央部分が押圧されないように、シールドカバー30に接触される圧着部131の接触面のサイズおよび形状を調整してもよい。
2 回路基板
2’ 回路基板
11 基台
13 圧着機構
15 駆動機構
20 回路基板本体
22 シールドカバー
24 ダウンフレーム
26 上蓋
30 シールドカバー
50 回路基板本体
111 高さ調節装置
113 搭載部
115 第1のスライド部
131 圧着部
133 折り曲げ部
135 第1の位置規制部
137 第2の位置規制部
139 第2のスライド部
151 駆動部
153 接続部
155 作動部
301 第2の位置決め部
501 第1の位置決め部
503 接地部
1111 操作部
1131 第1の凹溝
1133 第2の凹溝
1311 凹溝
1331 斜面
1333 第3の位置規制部
1371 バネ
1373 接続ロッド
Claims (9)
- 回路基板本体が有する複数の第1の位置決め部に、シールドカバーが有する複数の第2の位置決め部をそれぞれ貫設し、前記シールドカバーと前記回路基板本体とを組み立てるために用いる組立治具であって、前記組立治具は、
前記シールドカバーおよび前記回路基板本体を置く搭載部を有する基台と、
移動自在に前記基台へ接続され、前記搭載部に対向した圧着部を有する圧着機構と、
前記基台に配置され、前記圧着機構に接続された駆動部を有し、前記駆動部により前記圧着機構を駆動させて前記搭載部の方向に移動させ、前記第2の位置決め部それぞれの末端部を折り曲げて係合させる駆動機構と、を備え、
前記圧着機構は、前記搭載部に対応するように設けられた圧着部と、前記第2の位置決め部を折り曲げる折り曲げ部と、前記圧着部の側面に折り曲げ部を挟持させる第1の位置規制部と、前記折り曲げ部の上端部に貫設された第2の位置規制部と、を有することを特徴とする組立治具。 - 前記基台は、底部と、前記底部に対して垂直な立柱と、を含むL字状台座であることを特徴とする請求項1に記載の組立治具。
- 前記基台は、前記底部に配置された高さ調整装置と、前記高さ調整装置上に配置された前記搭載部と、前記立柱に配置された第1のスライド部と、を有することを特徴とする請求項2に記載の組立治具。
- 前記搭載部は、前記基台および前記高さ調整装置の一方と一体成形され、
前記圧着機構は、前記第1のスライド部に対応した第2のスライド部を含み、前記第1のスライド部および前記第2のスライド部は、互いに対応したスライドレールおよびスライドブロックを含むことを特徴とする請求項3に記載の組立治具。 - 前記搭載部は、前記回路基板本体および前記シールドカバーをそれぞれ置く第1の凹溝および第2の凹溝を有することを特徴とする請求項1に記載の組立治具。
- 前記圧着部は、圧着ブロックであり、
前記折り曲げ部は、下端部に設けられた斜面と、側面に設けられた第3の位置規制部と、を有し、前記圧着部の側面に設けられたストッパ板であり、
前記斜面は、前記圧着部の側面から離れるように形成された斜面であり、
前記第1の位置規制部は、ボルトおよびピンの一方であり、
前記第2の位置規制部は、バネが外嵌された接続ロッドであり、
前記第3の位置規制部は、導入溝であることを特徴とする請求項1に記載の組立治具。 - 前記圧着部は、凹溝が設けられていることを特徴とする請求項1に記載の組立治具。
- 前記駆動部は連動ロッドであることを特徴とする請求項1に記載の組立治具。
- 前記駆動機構は、前記駆動部に接続された接続部と、前記接続部に接続された前記基台の作動部と、を含むことを特徴とする請求項1に記載の組立治具。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097140155A TWI359633B (en) | 2008-10-20 | 2008-10-20 | Assembly device |
TW097140155 | 2008-10-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010098287A JP2010098287A (ja) | 2010-04-30 |
JP4851558B2 true JP4851558B2 (ja) | 2012-01-11 |
Family
ID=40750093
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009105109A Expired - Fee Related JP4851558B2 (ja) | 2008-10-20 | 2009-04-23 | 組立治具 |
Country Status (10)
Country | Link |
---|---|
US (1) | US7958625B2 (ja) |
JP (1) | JP4851558B2 (ja) |
KR (1) | KR101041657B1 (ja) |
DE (1) | DE102009001628A1 (ja) |
ES (1) | ES2370034B1 (ja) |
FR (1) | FR2937495A1 (ja) |
GB (1) | GB2464570A (ja) |
IT (1) | IT1393924B1 (ja) |
NL (1) | NL1036862C2 (ja) |
TW (1) | TWI359633B (ja) |
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CN101738699B (zh) * | 2008-11-14 | 2012-10-17 | 深圳富泰宏精密工业有限公司 | 压合装置 |
KR101114374B1 (ko) * | 2009-06-30 | 2012-02-14 | 기아자동차주식회사 | 압입장치 |
TW201224480A (en) * | 2010-12-14 | 2012-06-16 | Askey Computer Corp | Test device |
TW201248251A (en) * | 2011-05-19 | 2012-12-01 | Askey Computer Corp | Carrier and its lamination apparatus |
CN102646911B (zh) * | 2012-04-06 | 2014-11-12 | 宁波依诺汽车电子有限公司 | 马达接触簧片和电位器连杆同步装配用的工装设备 |
CN102764976A (zh) * | 2012-07-20 | 2012-11-07 | 昆山迈致治具科技有限公司 | 一种摄像头模组压合治具 |
DE102012215885A1 (de) * | 2012-09-07 | 2014-03-13 | Siemens Aktiengesellschaft | Mobile Vorrichtung zum Biegen eines U-förmigen Sicherungsblechs |
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CN104125715A (zh) * | 2013-04-23 | 2014-10-29 | 上海景奕电子科技有限公司 | 一种弯折柔性线路板的装置 |
CN203380573U (zh) * | 2013-06-21 | 2014-01-08 | 纬创资通股份有限公司 | 压合组装设备 |
CN104209899B (zh) * | 2014-09-01 | 2015-11-25 | 苏州市吴中区胥口广博模具加工厂 | 一种l形主板上螺丝用锁闭夹具的侧边式锁闭装置 |
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KR101879424B1 (ko) | 2016-09-21 | 2018-07-17 | 한국컴퓨터주식회사 | 쉴드캔 결합용 지그장치 및 이를 이용한 쉴드캔 결합방법 |
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TWI648149B (zh) * | 2017-03-06 | 2019-01-21 | 仁寶電腦工業股份有限公司 | 壓合治具及其壓合裝置 |
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-
2008
- 2008-10-20 TW TW097140155A patent/TWI359633B/zh not_active IP Right Cessation
-
2009
- 2009-02-05 US US12/365,969 patent/US7958625B2/en not_active Expired - Fee Related
- 2009-03-18 DE DE102009001628A patent/DE102009001628A1/de not_active Withdrawn
- 2009-04-03 GB GB0905845A patent/GB2464570A/en not_active Withdrawn
- 2009-04-09 KR KR1020090031018A patent/KR101041657B1/ko not_active IP Right Cessation
- 2009-04-16 NL NL1036862A patent/NL1036862C2/en not_active IP Right Cessation
- 2009-04-16 FR FR0952483A patent/FR2937495A1/fr not_active Withdrawn
- 2009-04-23 JP JP2009105109A patent/JP4851558B2/ja not_active Expired - Fee Related
- 2009-04-29 ES ES200901121A patent/ES2370034B1/es not_active Expired - Fee Related
- 2009-05-13 IT ITMC2009A000109A patent/IT1393924B1/it active
Also Published As
Publication number | Publication date |
---|---|
NL1036862C2 (en) | 2012-02-28 |
TW201018361A (en) | 2010-05-01 |
ITMC20090109A1 (it) | 2010-11-14 |
KR101041657B1 (ko) | 2011-06-14 |
US20100095518A1 (en) | 2010-04-22 |
KR20100044070A (ko) | 2010-04-29 |
NL1036862A (en) | 2010-04-21 |
TWI359633B (en) | 2012-03-01 |
GB0905845D0 (en) | 2009-05-20 |
DE102009001628A1 (de) | 2010-04-29 |
IT1393924B1 (it) | 2012-05-17 |
ES2370034B1 (es) | 2012-06-19 |
FR2937495A1 (fr) | 2010-04-23 |
GB2464570A (en) | 2010-04-28 |
ES2370034A1 (es) | 2011-12-12 |
US7958625B2 (en) | 2011-06-14 |
JP2010098287A (ja) | 2010-04-30 |
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