JP4847198B2 - 電子回路用ハウジングの構成方法 - Google Patents
電子回路用ハウジングの構成方法 Download PDFInfo
- Publication number
- JP4847198B2 JP4847198B2 JP2006120214A JP2006120214A JP4847198B2 JP 4847198 B2 JP4847198 B2 JP 4847198B2 JP 2006120214 A JP2006120214 A JP 2006120214A JP 2006120214 A JP2006120214 A JP 2006120214A JP 4847198 B2 JP4847198 B2 JP 4847198B2
- Authority
- JP
- Japan
- Prior art keywords
- base
- housing
- lid
- electronic circuit
- friction stir
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/066—Hermetically-sealed casings sealed by fusion of the joining parts without bringing material; sealed by brazing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/12—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding
- B23K20/122—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating the heat being generated by friction; Friction welding using a non-consumable tool, e.g. friction stir welding
- B23K20/1265—Non-butt welded joints, e.g. overlap-joints, T-joints or spot welds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Description
Claims (3)
- 開放面を有し、対向した複数の側壁を有し、該複数の側壁間に延びた中間壁を有する金属基体を形成し、
前記基体の開放面に被せられ、かつこれを被覆するように寸法が決められた金属フタ体を形成し、
これにより電子回路を含むように寸法決めされたフタ体と基体の間にチャンバを形成し、前記フタ体を前記基体に摩擦攪拌溶接により接合し、これにより前記チャンバを密閉し、
前記電子回路と電気的に接続され、ハウジングに外部からアクセス可能な電気的ポートを設け、
前記金属基体の少なくとも1つの側壁及び/又は底部に冷却体が流れる銅製冷却体を接触して溶接段階において前記側壁及び/又は底部を冷却し、
これにより前記金属基体の前記フタ体は摩擦攪拌溶接により前記中間壁に対し突き合わされ、かつ固定されている電子回路用ハウジングを製造すること特徴とする電子回路用ハウジングを構成する方法。 - 前記冷却工程は、前記溶接中に前記底部全体を冷却する工程を含むことを特徴とする請求項1記載の方法。
- 前記冷媒は液体を含むことを特徴とする請求項1記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/230,099 US7508682B2 (en) | 2005-09-19 | 2005-09-19 | Housing for an electronic circuit |
US11/230099 | 2005-09-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007084040A JP2007084040A (ja) | 2007-04-05 |
JP4847198B2 true JP4847198B2 (ja) | 2011-12-28 |
Family
ID=37533511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006120214A Expired - Fee Related JP4847198B2 (ja) | 2005-09-19 | 2006-04-25 | 電子回路用ハウジングの構成方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7508682B2 (ja) |
EP (1) | EP1765049B1 (ja) |
JP (1) | JP4847198B2 (ja) |
CN (1) | CN1972577B (ja) |
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-
2005
- 2005-09-19 US US11/230,099 patent/US7508682B2/en not_active Expired - Fee Related
-
2006
- 2006-04-25 JP JP2006120214A patent/JP4847198B2/ja not_active Expired - Fee Related
- 2006-09-08 EP EP06018866A patent/EP1765049B1/en not_active Expired - Fee Related
- 2006-09-12 CN CN2006101536488A patent/CN1972577B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1972577B (zh) | 2012-11-28 |
EP1765049A3 (en) | 2009-06-17 |
EP1765049A2 (en) | 2007-03-21 |
CN1972577A (zh) | 2007-05-30 |
US20070064403A1 (en) | 2007-03-22 |
JP2007084040A (ja) | 2007-04-05 |
EP1765049B1 (en) | 2012-02-22 |
US7508682B2 (en) | 2009-03-24 |
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