JP4800149B2 - 半導体製造装置 - Google Patents
半導体製造装置 Download PDFInfo
- Publication number
- JP4800149B2 JP4800149B2 JP2006222401A JP2006222401A JP4800149B2 JP 4800149 B2 JP4800149 B2 JP 4800149B2 JP 2006222401 A JP2006222401 A JP 2006222401A JP 2006222401 A JP2006222401 A JP 2006222401A JP 4800149 B2 JP4800149 B2 JP 4800149B2
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- semiconductor manufacturing
- manufacturing apparatus
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- 238000004519 manufacturing process Methods 0.000 title claims description 62
- 239000004065 semiconductor Substances 0.000 title claims description 60
- 238000012545 processing Methods 0.000 claims description 83
- 230000002265 prevention Effects 0.000 claims description 18
- 230000004308 accommodation Effects 0.000 claims description 13
- 238000005192 partition Methods 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 description 32
- 235000012431 wafers Nutrition 0.000 description 23
- 238000003780 insertion Methods 0.000 description 12
- 230000037431 insertion Effects 0.000 description 12
- 238000009434 installation Methods 0.000 description 8
- 230000002829 reductive effect Effects 0.000 description 8
- 238000009940 knitting Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 4
- 238000012790 confirmation Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/916—Differential etching apparatus including chamber cleaning means or shield for preventing deposits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
3 キャリア 4 キャリア搬入出モジュール
5 バッチ 6 バッチ編成モジュール
7,8,9 処理モジュール 10 筐体
11 ウエハ搬送機構 12,13,14 処理ユニット
15,16,17 踏み台 18 脚立
19 天板部 20 脚部
21 手摺部 22,23 内側フレーム
24 支持フレーム 25 ヒンジ
26 支持枠 27 天板
28,29 外側フレーム 30,31 ダンパー
32,33 ブラケット 34,35 ブラケット
36 ロック機構 37 ロックピン
38 支持片 39 ピン挿通孔
40,41 脚体 42,43,44 連結体
45,46 脚座 47 ロック機構
48 姿勢保持機構 49 ピン支持体
50 ロックピン 51 ピン挿通孔
52 ブラケット 53 回動片
54 ブラケット 55 回動片
57 回動軸 58,59 支持体
60 連結体 61 手摺フレーム
62 姿勢保持機構 63 ロックピン
64,65 ピン挿通孔 66 姿勢保持機構
67 脱落防止機構 68,69 回動片
70 ロックピン 71 ロック溝
72 脱落防止壁 73 脱落防止壁
74,75 連結片 76 収容空間
77 仕切壁 78,79,80,81 開閉扉
82 空間 83 配管
84 開閉センサ 85 床
Claims (6)
- 筐体の内部に半導体の製造を行うための処理ユニットを配設するとともに、筐体の外部に作業用の踏み台を設けた半導体製造装置において、
前記踏み台を折畳み可能に形成し、前記筐体に上側の開閉扉と下側の開閉扉とを上下に設けるとともに、前記上側及び下側の開閉扉の内側に形成された収容空間に前記踏み台を収容し、前記上側及び下側の開閉扉を開いて前記踏み台を収容した状態と前記踏み台を設置した状態とに変更可能とし、前記踏み台を収容した状態と前記踏み台を設置した状態のいずれの状態でも前記上側の開閉扉を開閉可能とし、前記上側の開閉扉の開閉を開閉センサで検出し、前記上側の開閉扉の開放を検出した場合には前記処理ユニットの動作状態を駆動不可能な状態に移行させ、一方、前記上側の開閉扉の閉塞を検出した場合には前記処理ユニットの動作状態を駆動可能な状態に移行させることを特徴とする半導体製造装置。 - 前記踏み台は、筐体に天板部の前端を起倒自在に取付け、天板部の下側後端に脚部を起倒自在に取付けるとともに、天板部の上側後端に手摺部を起倒自在に取付け、天板部と脚部と手摺部とを重ねた状態で折畳めるように構成したことを特徴とする請求項1に記載の半導体製造装置。
- 前記踏み台は、天板部の上側後端に手摺部を起倒自在に取付けるとともに、天板部の上側後端縁に前記手摺部に連動して起倒する脱落防止壁を形成したことを特徴とする請求項1又は請求項2に記載の半導体製造装置。
- 前記筐体を複数個の処理モジュールに分割可能に構成し、各処理モジュールごとに前記踏み台を設けて、各処理モジュールごとに前記踏み台を設置状態にできるようにしたことを特徴とする請求項1〜請求項3のいずれかに記載の半導体製造装置。
- 前記踏み台と前記処理ユニットとの間に仕切壁を形成したことを特徴とする請求項1〜請求項4のいずれかに記載の半導体製造装置。
- 前記収容空間に収容した状態の前記踏み台の下方に形成される空間に前記処理ユニットに接続する配管又は配線を配設したことを特徴とする請求項1〜請求項5のいずれかに記載の半導体製造装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006222401A JP4800149B2 (ja) | 2006-08-17 | 2006-08-17 | 半導体製造装置 |
US11/889,615 US7972468B2 (en) | 2006-08-17 | 2007-08-15 | Semiconductor device fabricating system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006222401A JP4800149B2 (ja) | 2006-08-17 | 2006-08-17 | 半導体製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008047728A JP2008047728A (ja) | 2008-02-28 |
JP4800149B2 true JP4800149B2 (ja) | 2011-10-26 |
Family
ID=39100251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006222401A Active JP4800149B2 (ja) | 2006-08-17 | 2006-08-17 | 半導体製造装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7972468B2 (ja) |
JP (1) | JP4800149B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040031167A1 (en) * | 2002-06-13 | 2004-02-19 | Stein Nathan D. | Single wafer method and apparatus for drying semiconductor substrates using an inert gas air-knife |
JP5350692B2 (ja) * | 2008-07-03 | 2013-11-27 | 東京エレクトロン株式会社 | 基板処理装置及びそれに用いられる支持フレーム |
KR102103545B1 (ko) * | 2018-11-02 | 2020-04-22 | 세메스 주식회사 | 발판 유닛 및 이를 포함하는 기판 처리 장치 |
JP7177130B2 (ja) * | 2020-11-30 | 2022-11-22 | キヤノントッキ株式会社 | 成膜装置及び足場ユニット |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5868599U (ja) * | 1981-10-31 | 1983-05-10 | 松下電工株式会社 | 折り畳み踏台 |
JPS59100U (ja) * | 1982-06-19 | 1984-01-05 | 梶浦 春夫 | 手摺つき脚立 |
JPH03122846A (ja) * | 1989-10-05 | 1991-05-24 | Sony Corp | 光磁気記録媒体 |
US5443642A (en) * | 1993-10-22 | 1995-08-22 | Wagner Systems Inc. | Apparatus for electrostatic spray painting |
FR2722458B1 (fr) * | 1994-07-18 | 1996-09-13 | Giat Ind Sa | Engin motorise de depannage, en particulier de char |
US6091498A (en) * | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
JP3521330B2 (ja) | 1997-01-21 | 2004-04-19 | 東京エレクトロン株式会社 | 基板搬送処理装置 |
JP4021118B2 (ja) * | 1999-04-28 | 2007-12-12 | 東京エレクトロン株式会社 | 基板処理装置 |
JP2002198343A (ja) * | 2000-12-25 | 2002-07-12 | Tokyo Electron Ltd | 基板処理装置 |
JP2002217162A (ja) * | 2001-01-22 | 2002-08-02 | Tokyo Electron Ltd | 液処理装置 |
-
2006
- 2006-08-17 JP JP2006222401A patent/JP4800149B2/ja active Active
-
2007
- 2007-08-15 US US11/889,615 patent/US7972468B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080041525A1 (en) | 2008-02-21 |
US7972468B2 (en) | 2011-07-05 |
JP2008047728A (ja) | 2008-02-28 |
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