JP4782548B2 - 蒸着方法 - Google Patents
蒸着方法 Download PDFInfo
- Publication number
- JP4782548B2 JP4782548B2 JP2005334172A JP2005334172A JP4782548B2 JP 4782548 B2 JP4782548 B2 JP 4782548B2 JP 2005334172 A JP2005334172 A JP 2005334172A JP 2005334172 A JP2005334172 A JP 2005334172A JP 4782548 B2 JP4782548 B2 JP 4782548B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- mask
- substrate
- frame
- pattern formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000151 deposition Methods 0.000 title claims description 19
- 238000007740 vapor deposition Methods 0.000 claims description 145
- 239000000758 substrate Substances 0.000 claims description 56
- 230000007261 regionalization Effects 0.000 claims description 47
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 claims description 45
- 239000000463 material Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 26
- 230000008021 deposition Effects 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 17
- 229910001374 Invar Inorganic materials 0.000 claims description 12
- 238000004070 electrodeposition Methods 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 230000002093 peripheral effect Effects 0.000 description 23
- 229920002120 photoresistant polymer Polymers 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 238000005323 electroforming Methods 0.000 description 11
- 239000011521 glass Substances 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910000990 Ni alloy Inorganic materials 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 230000002411 adverse Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000005291 magnetic effect Effects 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical group [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
本発明に係る蒸着方法の第1実施形態について以下図面を参照して説明する。図1に示す蒸着マスク1は、ニッケルやニッケル−コバルト等のニッケル合金、その他の電着金属を素材として、電鋳方法により形成されたマスク本体2から成る。このマスク本体2は、例えば36×48mmのパターン形成領域4を複数、本実施形態では3つ備える。パターン形成領域4には、多数独立の蒸着通孔5からなる発光層形成用の蒸着パターン6が形成されている。
次に、本発明に係る蒸着方法の第2実施形態について説明する。なお、前記実施形態と同一部材には同一符号を付して、その説明を省略する。
2 マスク本体
3 枠体
4 パターン形成領域
4a パターン形成領域の外周縁
5 蒸着通孔
6 蒸着パターン
9 電着金属層
10 母型
14 一次パターンレジスト
14a レジスト体
15 一次電着層
16 フォトレジスト層
16a 露光されたフォトレジスト層
16b 未露光のフォトレジスト層
17 パターンフィルム
18 二次パターンレジスト
18a レジスト体
20 おもり
30 基板
50 押さえ治具
70 磁石
Claims (3)
- 蒸着装置内の上方に配置した基板30に蒸着材を蒸着するために、蒸着通孔5が形成されたパターン形成領域4を囲むように枠体3が形成された蒸着マスク1を前記基板30の片側に搭載し、少なくとも前記蒸着マスク1の端部が支持してあって、前記基板30の蒸着マスク1が搭載される側とは反対側に押さえ治具50を介しておもり20を置いており、前記押さえ治具50とおもり20との間には平面板60を介在させ、前記押さえ治具50は、前記枠体3上に配することを特徴とする蒸着方法。
- 前記パターン形成領域4が整列形成された蒸着マスク1であって、前記押さえ治具50を前記各パターン形成領域4を囲むように格子状に形成することを特徴とする請求項1に記載の蒸着方法。
- 前記枠体3はインバー材から成ることを特徴とする請求項1または2に記載の蒸着方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005334172A JP4782548B2 (ja) | 2005-11-18 | 2005-11-18 | 蒸着方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005334172A JP4782548B2 (ja) | 2005-11-18 | 2005-11-18 | 蒸着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007138256A JP2007138256A (ja) | 2007-06-07 |
JP4782548B2 true JP4782548B2 (ja) | 2011-09-28 |
Family
ID=38201491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005334172A Active JP4782548B2 (ja) | 2005-11-18 | 2005-11-18 | 蒸着方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4782548B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5258278B2 (ja) * | 2007-12-13 | 2013-08-07 | キヤノントッキ株式会社 | 成膜用マスク及びマスク密着方法 |
JP5297046B2 (ja) | 2008-01-16 | 2013-09-25 | キヤノントッキ株式会社 | 成膜装置 |
JP6418440B2 (ja) * | 2014-06-03 | 2018-11-07 | Tianma Japan株式会社 | メタルマスク及びメタルマスクの製造方法並びにメタルマスクを用いた成膜方法 |
KR102311586B1 (ko) * | 2014-12-26 | 2021-10-12 | 삼성디스플레이 주식회사 | 증착 장치 및 증착 장치 내 기판 정렬 방법 |
JP7161163B2 (ja) * | 2016-10-17 | 2022-10-26 | 株式会社昭和真空 | 環状成膜方法、環状成膜具および環状成膜用マスク |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4506214B2 (ja) * | 2003-03-13 | 2010-07-21 | 東レ株式会社 | 有機電界発光装置およびその製造方法 |
JP2005158571A (ja) * | 2003-11-27 | 2005-06-16 | Seiko Epson Corp | 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンスパネルの製造装置及び有機エレクトロルミネッセンスパネル |
JP2005206939A (ja) * | 2003-12-26 | 2005-08-04 | Seiko Epson Corp | 薄膜形成方法、薄膜形成装置、有機エレクトロルミネッセンス装置の製造方法、有機エレクトロルミネッセンス装置、及び電子機器 |
JP2005232474A (ja) * | 2004-02-17 | 2005-09-02 | Dainippon Screen Mfg Co Ltd | 蒸着用マスク |
JP2005281746A (ja) * | 2004-03-29 | 2005-10-13 | Seiko Epson Corp | 蒸着装置、蒸着方法、電気光学装置、および電子機器 |
-
2005
- 2005-11-18 JP JP2005334172A patent/JP4782548B2/ja active Active
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Publication number | Publication date |
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JP2007138256A (ja) | 2007-06-07 |
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