JP4773091B2 - low−k絶縁材料用のCMP組成物 - Google Patents
low−k絶縁材料用のCMP組成物 Download PDFInfo
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- JP4773091B2 JP4773091B2 JP2004511407A JP2004511407A JP4773091B2 JP 4773091 B2 JP4773091 B2 JP 4773091B2 JP 2004511407 A JP2004511407 A JP 2004511407A JP 2004511407 A JP2004511407 A JP 2004511407A JP 4773091 B2 JP4773091 B2 JP 4773091B2
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- polyoxyethylene
- polishing
- nonionic surfactant
- alkyl
- amphiphilic nonionic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
Description
例1
本例は、銅、タンタルおよび二酸化ケイ素材料の除去速度に比較して、low−k誘電率材料除去の基板除去選択性に対する両親媒性非イオン界面活性剤の利点を説明する。
この例は、界面活性剤濃度の関数としてlow−k誘電率材料の基板除去速度に対する両親媒性非イオン界面活性剤の影響を示す。
この例は、界面活性剤HLB値の関数として、low−k誘電率材料の基板除去速度に与える両親媒性非イオン界面活性剤の影響を示している。
この例は、1つのヘッド基および2つのテール基を有する両親媒性非イオン界面活性剤が、タンタルおよび二酸化ケイ素材料の除去速度と比較したlow−k誘電率材料除去の基板除去選択性に与える利点を示している。
この例は、タンタルおよび二酸化ケイ素材料の除去速度と比較しlow−k誘電率材料除去の基板除去選択性に対する両親媒性非イオン界面活性剤の利点を示す。
Claims (20)
- (i)(A)銅、タンタル、チタン、タングステン、ニッケル、白金、ルテニウム、イリジウムおよびロジウムから成る群から選ばれる金属層と(B)絶縁層とを含んでなる基板を、
(a)アルミナ、シリカ、これらの同時形成生成物、ポリマー粒子、およびこれらの組み合わせからなる群から選択される研磨剤;
(b)7以上のHLBを有する両親媒性非イオン界面活性剤;および
(c)液体キャリア
を含む化学的機械的研磨系に接触させる工程;ならびに
(ii)基板の少なくとも1部分を摩耗させて前記絶縁層を研磨する工程
を含んでなる基板の研磨方法であって、
前記絶縁層が3.5以下の誘電率を有している、基板の研磨方法。 - 前記研磨剤が、(1)研磨パッドに固定されているか、(2)微粒子形態にあり、かつ、液体キャリア中に懸濁しているか、または(3)(1)の形態のものと(2)の形態のものとの組み合わせである、請求項1に記載の方法。
- 前記両親媒性非イオン界面活性剤がヘッド基およびテール基を含んでなる、請求項1または2のいずれか一項に記載の方法。
- 前記テール基が4以上のエチレンオキシド反復単位を有するポリオキシエチレン、ソルビタン、またはこれらの混合物を含んでなる、請求項3に記載の方法。
- 前記ヘッド基が、ポリシロキサン、テトラ−C 1-4 −アルキルデシン、飽和または部分的に不飽和のC 6-30 アルキル、ポリオキシプロピレン、C 6-12 アルキルフェニル、C 6-12 アルキルシクロヘキシル、ポリエチレン、またはこれらの混合物を含んでなる、請求項3または4に記載の方法。
- 前記両親媒性非イオン界面活性剤が、2,4,7,9−テトラメチル−5−デシン−4,7−ジオールエトキシレートである、請求項1または2に記載の方法。
- 前記両親媒性非イオン界面活性剤が、アルキルがC 6-30 アルキルであり、飽和でも部分的に不飽和でもよく、任意に分岐している、ポリオキシエチレンアルキルエーテルおよびポリオキシエチレンアルキル酸エステルからなる群から選択される、請求項1または2に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリオキシエチレンラウリルエーテル、ポリオキシエチレンセチルエーテル、ポリオキシエチレンステアリルエーテル、ポリオキシエチレンオレイルエーテル、ポリオキシエチレンモノラウレート、ポリオキシエチレンモノステアレート、ポリオキシエチレンジステアレート、ポリオキシエチレンモノオレエート、またはこれらの組み合わせである、請求項1または2に記載の方法。
- 前記両親媒性非イオン界面活性剤が、アルキルがC 6-30 アルキルであり、飽和でも部分的に不飽和でもよく、任意に分岐していてよい、ポリオキシエチレンアルキルフェニルエーテルまたはポリオキシエチレンアルキルシクロヘキシルエーテルである、請求項1または2に記載の方法。
- 前記両親媒性非イオン界面活性剤が、アルキルがC 6-30 アルキルであり、飽和でも部分的に不飽和でもよく、任意に分岐していてよいポリオキシエチレンソルビタンアルキル酸エステルである、請求項1または2に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリジメチルシロキサンおよびポリオキシエチレンを含んでなるブロックまたはグラフトコポリマーである、請求項1または2に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリオキシエチレンおよびポリオキシプロピレンまたはポリオキシエチレンおよびポリエチレンを含んでなるブロックコポリマーである、請求項1または2に記載の方法。
- 前記両親媒性非イオン界面活性剤が、ポリオキシエチレンアルキルアミン、ポリオキシエチレンアルキルアルカノールアミド、およびこれらの組み合わせからなる群から選択される、請求項1または2に記載の方法。
- 前記系が6以上のpHを有する、請求項1〜13のいずれか一項に記載の方法。
- 前記液体キャリアが水を含んでなる、請求項1〜14のいずれか一項に記載の方法。
- 前記研磨系が、液体キャリアおよびその中に溶解または懸濁している化合物の重量に対して、0.005重量%以上の両親媒性非イオン界面活性剤を含んでなる、請求項1〜15のいずれか一項に記載の方法。
- 前記研磨系が、液体キャリアおよびその中に溶解または懸濁している化合物の重量に対して、0.005重量%〜0.05重量%の両親媒性非イオン界面活性剤を含んでなる、請求項1〜15のいずれか一項に記載の方法。
- 前記絶縁層が有機改質ケイ素ガラスである、請求項1〜17のいずれか一項に記載の方法。
- 前記有機改質ケイ素ガラスが炭素ドープ二酸化ケイ素である、請求項18に記載の方法。
- 前記金属層が銅またはタンタルを含んでなる、請求項1〜19のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/165,100 | 2002-06-07 | ||
US10/165,100 US6974777B2 (en) | 2002-06-07 | 2002-06-07 | CMP compositions for low-k dielectric materials |
PCT/IB2003/002266 WO2003104343A2 (en) | 2002-06-07 | 2003-05-26 | Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005529485A JP2005529485A (ja) | 2005-09-29 |
JP2005529485A5 JP2005529485A5 (ja) | 2009-10-15 |
JP4773091B2 true JP4773091B2 (ja) | 2011-09-14 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004511407A Expired - Fee Related JP4773091B2 (ja) | 2002-06-07 | 2003-05-26 | low−k絶縁材料用のCMP組成物 |
Country Status (11)
Country | Link |
---|---|
US (1) | US6974777B2 (ja) |
EP (1) | EP1534795B1 (ja) |
JP (1) | JP4773091B2 (ja) |
KR (1) | KR100729331B1 (ja) |
CN (1) | CN1305984C (ja) |
AT (1) | ATE334176T1 (ja) |
AU (1) | AU2003274812A1 (ja) |
DE (1) | DE60307111T2 (ja) |
SG (1) | SG108491A1 (ja) |
TW (1) | TWI227728B (ja) |
WO (1) | WO2003104343A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20210121954A (ko) * | 2020-03-31 | 2021-10-08 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법 |
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Also Published As
Publication number | Publication date |
---|---|
SG108491A1 (en) | 2007-01-31 |
TW200401819A (en) | 2004-02-01 |
EP1534795B1 (en) | 2006-07-26 |
AU2003274812A1 (en) | 2003-12-22 |
DE60307111D1 (de) | 2006-09-07 |
TWI227728B (en) | 2005-02-11 |
CN1659249A (zh) | 2005-08-24 |
KR100729331B1 (ko) | 2007-06-15 |
DE60307111T2 (de) | 2006-11-23 |
KR20050005543A (ko) | 2005-01-13 |
WO2003104343A3 (en) | 2004-02-26 |
AU2003274812A8 (en) | 2003-12-22 |
CN1305984C (zh) | 2007-03-21 |
US6974777B2 (en) | 2005-12-13 |
US20030228762A1 (en) | 2003-12-11 |
JP2005529485A (ja) | 2005-09-29 |
ATE334176T1 (de) | 2006-08-15 |
EP1534795A2 (en) | 2005-06-01 |
WO2003104343A2 (en) | 2003-12-18 |
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