JP4749177B2 - 接続構造体および接続構造体の製造方法 - Google Patents
接続構造体および接続構造体の製造方法 Download PDFInfo
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- JP4749177B2 JP4749177B2 JP2006038443A JP2006038443A JP4749177B2 JP 4749177 B2 JP4749177 B2 JP 4749177B2 JP 2006038443 A JP2006038443 A JP 2006038443A JP 2006038443 A JP2006038443 A JP 2006038443A JP 4749177 B2 JP4749177 B2 JP 4749177B2
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Description
実施形態1では、Si部材の一例としてSi電極を挙げ、Al部材の一例としてAlワイヤを挙げ、Si電極とAlワイヤとの接続構造体およびその接続構造体の製造方法を説明する。
実施形態2にかかる接続構造体では、第2の部分24,24,…および第2の部分34,34,…の構成が上記実施形態1における第2の部分4,4,…および第2の部分14,14,…の構成と異なる。図9(a)は本実施形態にかかる接続構造体の第2の部分24,24,…の構成を示す拡大断面図であり、図9(b)は本実施形態にかかる接続構造体の第2の部分34,34,…の構成を示す拡大断面図である。
実施形態3にかかる接続構造体では、第2の部分44,44,…および第2の部分54,54,…の構成が上記実施形態1における第2の部分4,4,…および第2の部分14,14,…の構成と異なる。図10(a)は本実施形態にかかる接続構造体の第2の部分44,44,…の構成を示す拡大断面図であり、図10(b)は本実施形態にかかる接続構造体の第2の部分54,54,…の構成を示す断面図である。
実施形態4にかかる接続構造体では、第2の部分64,64,…の構成が上記実施形態1における第2の部分4,4,…および第2の部分14,14,…の構成と異なる。図11は、本実施形態にかかる接続構造体の第2の部分64,64,…の構成を示す拡大断面図である。
実施形態5では、Si部材の一例としてSi電極を挙げAl部材の一例としてAlバンプを挙げて、上記実施形態1乃至4のいずれか一つの接続構造体を備えたチップサイズパッケージ(CSP)の製造方法を示す。
上記実施形態1乃至5において、以下の構成であってもよい。
2 第1の部分
4,14,24,34,44,54,64 第2の部分
6 貫通部
7 介在層
10 Si基板
13 Si酸化物層
14a,34a,44a,54a Si部
14b,34b,44b,54b Al部
20 Alワイヤ(Al部材)
23 Al酸化物層
30 接続部分
40 Si電極(Si部材)
50 圧着振動部材
60 Alバンプ(Al部材)
Claims (33)
- SiからなるSi部材とAlからなるAl部材との接続構造体であって、
前記Si部材と前記Al部材との間には、第1の部分および第2の部分が介在しており、該第1の部分および該第2の部分はどちらも該Si部材に接しているとともに該Al部材にも接しており
前記第1の部分には、Si酸化物層およびAl酸化物層が存在しており、該Si酸化物層は前記Si部材に接しており、該Al酸化物層は該Si酸化物層と前記Al部材との間に介在しており、
前記第2の部分には、SiおよびAlの少なくとも一方が存在しており、
前記第1の部分と前記第2の部分とは互いに隣接しており、
前記第2の部分は複数箇所に点在していることを特徴とする接続構造体。 - 前記第2の部分では、前記Si部材からSiが入り込み、前記Al部材からAlが入り込み、該Siが入り込んだ部分と該Alが入り込んだ部分とが接していることを特徴とする請求項1に記載の接続構造体。
- 前記第2の部分は、Alからなることを特徴とする請求項1に記載の接続構造体。
- 前記第2の部分は、Siからなることを特徴とする請求項1に記載の接続構造体。
- 前記第2の部分には、AlからなるAl部とSiからなるSi部とが存在しており、
前記Al部は、前記Al部材から前記Si部材の方へ延びており、
前記Si部は、前記Si部材から前記Al部材の方へ延びているとともに前記Al部に接していることを特徴とする請求項1に記載の接続構造体。 - 前記Al部には、Siが含まれており、
前記Si部には、Alが含まれていることを特徴とする請求項5に記載の接続構造体。 - 前記第2の部分には、AlとSiとが混合されていることを特徴とする請求項1に記載の接続構造体。
- 前記Si部材は、Si電極であり、
前記Al部材は、Siを含むAlワイヤであり、
前記第1の部分および前記第2の部分はどちらも、前記Alワイヤが前記Si電極の表面に接続されている接続部分に存在しており、
前記第2の部分は、前記Si電極の表面における前記接続部分の周縁に点在していることを特徴とする請求項1に記載の接続構造体。 - 前記Si部材は、Si電極であり、
前記Al部材は、Siを含むAlワイヤであり、
前記第1の部分および前記第2の部分はどちらも、前記Alワイヤが前記Si電極の表面に接続されている接続部分に存在しており、
前記Si電極の表面における前記接続部分の外形は、略楕円であり、
前記第2の部分は、接続部分内に、前記接続部分の長軸方向に沿って点在していることを特徴とする請求項1に記載の接続構造体。 - 前記Alワイヤのうち前記第1の部分および前記第2の部分に接している部分は変形しており、
変形しているAlワイヤ部分のワイヤ幅は、変形していないAlワイヤ部分のワイヤ幅の1.5倍以上であることを特徴とする請求項8または9に記載の接続構造体。 - 前記Al部材のうち前記第1の部分および前記第2の部分に接している部分は、変形しており、
変形しているAl部材の部分には少なくとも、Siが含まれていることを特徴とする請求項1に記載の接続構造体。 - 前記Si部材のうち前記第1の部分および前記第2の部分に接している部分には少なくとも、Alが含まれていることを特徴とする請求項1に記載の接続構造体。
- 前記Si部材の一部が前記第1の部分および前記第2の部分に接しており、
前記Si部材の表面のうち前記第1の部分および前記第2の部分が接していない表面には自然酸化膜が存在しており、
前記自然酸化膜の厚みは、前記Si酸化物層の厚みよりも大きいことを特徴とする請求項1に記載の接続構造体。 - SiからなるSi部材とAlからなるAl部材との接続構造体であって、
前記Si部材と前記Al部材との間にはSi酸化物層およびAl酸化物層からなる介在層が存在しており、該Si部材、該Si酸化物層、該Al酸化物層および該Al部材がこの順に積み重ねられており、
前記介在層には、該介在層を貫通して前記Al部材から前記Si部材まで到達する貫通部が複数箇所に点在しており、
前記貫通部は、AlおよびSiの少なくとも一方からなることを特徴とする接続構造体。 - 前記貫通部では、前記Si部材からSiが入り込み、前記Al部材からAlが入り込み、該Siが入り込んだ部分と該Alが入り込んだ部分とが接していることを特徴とする請求項14に記載の接続構造体。
- 前記貫通部は、Alからなることを特徴とする請求項14に記載の接続構造体。
- 前記貫通部は、Siからなることを特徴とする請求項14に記載の接続構造体。
- 前記貫通部には、AlからなるAl部とSiからなるSi部とが存在しており、
前記Al部は、前記Al部材から前記Si部材の方へ延びており、
前記Si部は、前記Si部材から前記Al部材の方へ延びているとともに前記Al部に接していることを特徴とする請求項14に記載の接続構造体。 - 前記Al部には、Siが含まれており、
前記Si部には、Alが含まれていることを特徴とする請求項18に記載の接続構造体。 - 前記貫通部には、AlとSiとが混合されていることを特徴とする請求項14に記載の接続構造体。
- 前記Si部材は、Si電極であり、
前記Al部材は、Siを含むAlワイヤであり、
前記介在層は、前記Alワイヤが前記Si電極の表面に接続されている接続部分に存在しており、
前記貫通部は、前記Si電極の表面における前記接続部分の周縁に点在していることを特徴とする請求項14に記載の接続構造体。 - 前記Si部材は、Si電極であり、
前記Al部材は、Siを含むAlワイヤであり、
前記介在層は、前記Alワイヤが前記Si電極の表面に接続されている接続部分に存在しており、
前記Si電極の表面における前記接続部分の形状は、略楕円であり、
前記貫通部は、接続部分内に、前記接続部分の長軸方向に沿って点在していることを特徴とする請求項14に記載の接続構造体。 - 前記Alワイヤのうち前記介在層に接している部分は変形しており、
変形しているAlワイヤ部分のワイヤ幅は、変形していないAlワイヤ部分のワイヤ幅の1.5倍以上であることを特徴とする請求項21または22に記載の接続構造体。 - 前記Al部材のうち前記介在層に接している部分は、変形しており、
変形しているAl部材の部分には少なくとも、Siが含まれていることを特徴とする請求項14に記載の接続構造体。 - 前記Si部材のうち前記介在層に接している部分には少なくとも、Alが含まれていることを特徴とする請求項14に記載の接続構造体。
- 前記Si部材の一部が前記介在層に接しており、
前記Si部材の表面のうち前記介在層が接していない表面には自然酸化膜が存在しており、
前記自然酸化膜の厚みは、前記Si酸化物層の厚みよりも大きいことを特徴とする請求項14に記載の接続構造体。 - 前記Al酸化物層および前記Si酸化物層は、それぞれ、略均一の層厚を有していることを特徴とする請求項1または14に記載の接続構造体。
- 前記Al酸化物層の層厚と前記Si酸化物層の層厚との合計は、0.1nm以上10nm以下であることを特徴とする請求項1または14に記載の接続構造体。
- 前記Siは、多結晶シリコンであることを特徴とする請求項1または14に記載の接続構造体。
- Si部材とAl部材との接続構造体を製造する方法であって、
圧着振動部材を用いて前記Al部材を前記Si部材に押し付け該圧着振動部材に超音波を印加することにより、該Al部材を該Si部材に接合する接合ステップと、
接合された前記Si部材と前記Al部材との間に電圧を印加する電圧印加ステップとを備え、
前記接合ステップでは、前記Al部材と前記Si部材との間にAl酸化物層およびSi酸化物層からなる介在層を形成し、
前記電圧印加ステップでは、前記介在層を点在する複数箇所において除去して前記Al部材と前記Si部材とを接触させることを特徴とする接続構造体の製造方法。 - 前記介在層を除去した前記箇所では、前記Al部材からAlが入り込み、前記Si部材からSiが入り込み、前記Al部材と前記Si部材とが接触することを特徴とする請求項30に記載の接続構造体の製造方法。
- 前記電圧印加ステップでは、1V以上の電圧を印加することを特徴とする請求項30に記載の接続構造体の製造方法。
- 前記Si部材として多結晶シリコンからなる部材を用いることを特徴とする請求項30に記載の接続構造体の製造方法。
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