JP4732699B2 - はんだ付け方法 - Google Patents
はんだ付け方法 Download PDFInfo
- Publication number
- JP4732699B2 JP4732699B2 JP2004040237A JP2004040237A JP4732699B2 JP 4732699 B2 JP4732699 B2 JP 4732699B2 JP 2004040237 A JP2004040237 A JP 2004040237A JP 2004040237 A JP2004040237 A JP 2004040237A JP 4732699 B2 JP4732699 B2 JP 4732699B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- chamber
- melting point
- processed
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 18
- 229910000679 solder Inorganic materials 0.000 claims description 99
- 238000002844 melting Methods 0.000 claims description 26
- 230000008018 melting Effects 0.000 claims description 26
- 239000001257 hydrogen Substances 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 230000004907 flux Effects 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 239000011133 lead Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 20
- 150000003254 radicals Chemical class 0.000 description 19
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 13
- -1 hydrogen radicals Chemical class 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 235000012431 wafers Nutrition 0.000 description 11
- 238000001816 cooling Methods 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
10 被処理物
16 遊離基ガス発生装置
Claims (3)
- 錫単独または、錫と銀、鉛、銅、ビスマス、インジウム、亜鉛の1つまたは2つ以上の成分とを含む固体状のはんだを有する被処理物が配置された真空室を、真空状態に減圧させ、
その後、水素ラジカルを発生させ、はんだの融点よりも低い温度状態で前記はんだの酸化膜を除去した後、
前記水素ラジカルの発生を中止し、この中止の後に無酸化雰囲気で前記はんだをはんだの融点以上の温度にしてはんだを溶融する
はんだ付け方法。 - 請求項1記載のはんだ付け方法において、前記被処理物に対して前記はんだが固定され、この固定は、前記被処理物に窪みを形成し、この窪みに前記はんだを配置したものであるはんだ付け方法。
- 請求項1記載のはんだ付け方法において、前記被処理物に対して前記はんだが固定され、この固定はアルコールまたは有機酸を主成分とするフラックスまたは接着剤を介して行われているはんだ付け方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004040237A JP4732699B2 (ja) | 2004-02-17 | 2004-02-17 | はんだ付け方法 |
TW094104268A TWI346590B (en) | 2004-02-17 | 2005-02-15 | Soldering method |
KR1020067016454A KR101049427B1 (ko) | 2004-02-17 | 2005-02-16 | 납땜 방법 |
PCT/JP2005/002324 WO2005077583A1 (ja) | 2004-02-17 | 2005-02-16 | はんだ付け方法 |
US10/588,868 US20070170227A1 (en) | 2004-02-17 | 2005-02-16 | Soldering method |
CNB2005800052217A CN100455394C (zh) | 2004-02-17 | 2005-02-16 | 焊接方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004040237A JP4732699B2 (ja) | 2004-02-17 | 2004-02-17 | はんだ付け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005230830A JP2005230830A (ja) | 2005-09-02 |
JP4732699B2 true JP4732699B2 (ja) | 2011-07-27 |
Family
ID=34857871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004040237A Expired - Lifetime JP4732699B2 (ja) | 2004-02-17 | 2004-02-17 | はんだ付け方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070170227A1 (ja) |
JP (1) | JP4732699B2 (ja) |
KR (1) | KR101049427B1 (ja) |
CN (1) | CN100455394C (ja) |
TW (1) | TWI346590B (ja) |
WO (1) | WO2005077583A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007180447A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法、半田付け装置、及び半導体装置の製造方法 |
DE102006027027A1 (de) * | 2006-06-08 | 2007-12-13 | Centrotherm Thermal Solutions Gmbh + Co.Kg | Lötverfahren |
JP4991028B2 (ja) * | 2006-10-17 | 2012-08-01 | 国立大学法人九州工業大学 | 鉛フリーはんだ合金の処理方法 |
JP5003551B2 (ja) * | 2008-03-26 | 2012-08-15 | 三菱マテリアル株式会社 | ペースト用Pb−Snはんだ合金粉末およびPb−Snはんだ合金ボール |
US8318585B2 (en) | 2008-05-02 | 2012-11-27 | Shinko Seiki Company, Limited | Bonding method and bonding apparatus |
JP5524541B2 (ja) * | 2009-09-02 | 2014-06-18 | 神港精機株式会社 | 半田バンプ形成方法 |
KR101070022B1 (ko) * | 2009-09-16 | 2011-10-04 | 삼성전기주식회사 | 다층 세라믹 회로 기판, 다층 세라믹 회로 기판 제조방법 및 이를 이용한 전자 디바이스 모듈 |
JP5801047B2 (ja) * | 2010-01-19 | 2015-10-28 | 有限会社ヨコタテクニカ | リフロー半田付け装置及び方法 |
JP5129848B2 (ja) * | 2010-10-18 | 2013-01-30 | 東京エレクトロン株式会社 | 接合装置及び接合方法 |
WO2013178260A1 (de) * | 2012-05-30 | 2013-12-05 | Ev Group E. Thallner Gmbh | Vorrichtung und verfahren zum bonden von substraten |
JP5835533B2 (ja) * | 2013-07-23 | 2015-12-24 | 千住金属工業株式会社 | はんだ付け装置及び真空はんだ付け方法 |
DE102014004728B4 (de) * | 2014-04-01 | 2016-03-10 | Centrotherm Photovoltaics Ag | Vorrichtung und Verfahren zum Löten von Fügepartnern |
JP2015123503A (ja) * | 2014-08-21 | 2015-07-06 | 千住金属工業株式会社 | 真空はんだ処理装置及びその制御方法 |
WO2016144999A1 (en) * | 2015-03-10 | 2016-09-15 | Commscope Technologies Llc | Method and apparatus for forming interface between coaxial cable and connector |
CN105094159B (zh) * | 2015-07-08 | 2017-08-25 | 哈尔滨工业大学 | 真空舱室气体控制和监测方法 |
JP6439893B1 (ja) * | 2018-05-25 | 2018-12-19 | 千住金属工業株式会社 | ハンダボール、ハンダ継手および接合方法 |
CN109877411A (zh) * | 2019-04-10 | 2019-06-14 | 中国电子科技集团公司第十三研究所 | 无助焊剂的微电路焊接组装方法 |
CN113385763B (zh) * | 2021-07-14 | 2022-08-26 | 成都共益缘真空设备有限公司 | 一种真空回流焊正负压结合焊接工艺 |
CN117340490A (zh) * | 2023-11-21 | 2024-01-05 | 中科光智(重庆)科技有限公司 | 一种微波等离子辅助的共晶回流焊接方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59225880A (ja) * | 1983-06-08 | 1984-12-18 | Toyo Radiator Kk | アルミニユ−ム材の真空ろう付方法 |
JPH02190489A (ja) * | 1988-11-30 | 1990-07-26 | Plessey Overseas Plc | 金属表面の清浄化方法 |
JPH0927676A (ja) * | 1995-07-10 | 1997-01-28 | Nec Corp | 半田ボール |
JPH10154766A (ja) * | 1996-11-26 | 1998-06-09 | Matsushita Electric Works Ltd | 半導体パッケージの製造方法及び半導体パッケージ |
JP2001058259A (ja) * | 1999-06-18 | 2001-03-06 | Shinko Seiki Co Ltd | 半田付け方法及び半田付け装置 |
JP2004006818A (ja) * | 2002-04-16 | 2004-01-08 | Tadatomo Suga | リフロー法とソルダペースト |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3231795A (en) * | 1962-10-18 | 1966-01-25 | Bendix Corp | Low inductance and capacitance electrical cartridge and method of manufacture |
US5352629A (en) * | 1993-01-19 | 1994-10-04 | General Electric Company | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules |
US6742701B2 (en) * | 1998-09-17 | 2004-06-01 | Kabushiki Kaisha Tamura Seisakusho | Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
US6935553B2 (en) * | 2002-04-16 | 2005-08-30 | Senju Metal Industry Co., Ltd. | Reflow soldering method |
JP2004022963A (ja) * | 2002-06-19 | 2004-01-22 | Matsushita Electric Ind Co Ltd | 部品接合方法及び部品接合方法を用いた部品実装方法及び部品実装装置 |
-
2004
- 2004-02-17 JP JP2004040237A patent/JP4732699B2/ja not_active Expired - Lifetime
-
2005
- 2005-02-15 TW TW094104268A patent/TWI346590B/zh active
- 2005-02-16 CN CNB2005800052217A patent/CN100455394C/zh active Active
- 2005-02-16 WO PCT/JP2005/002324 patent/WO2005077583A1/ja active Application Filing
- 2005-02-16 KR KR1020067016454A patent/KR101049427B1/ko active IP Right Grant
- 2005-02-16 US US10/588,868 patent/US20070170227A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59225880A (ja) * | 1983-06-08 | 1984-12-18 | Toyo Radiator Kk | アルミニユ−ム材の真空ろう付方法 |
JPH02190489A (ja) * | 1988-11-30 | 1990-07-26 | Plessey Overseas Plc | 金属表面の清浄化方法 |
JPH0927676A (ja) * | 1995-07-10 | 1997-01-28 | Nec Corp | 半田ボール |
JPH10154766A (ja) * | 1996-11-26 | 1998-06-09 | Matsushita Electric Works Ltd | 半導体パッケージの製造方法及び半導体パッケージ |
JP2001058259A (ja) * | 1999-06-18 | 2001-03-06 | Shinko Seiki Co Ltd | 半田付け方法及び半田付け装置 |
JP2004006818A (ja) * | 2002-04-16 | 2004-01-08 | Tadatomo Suga | リフロー法とソルダペースト |
Also Published As
Publication number | Publication date |
---|---|
CN1921977A (zh) | 2007-02-28 |
WO2005077583A1 (ja) | 2005-08-25 |
CN100455394C (zh) | 2009-01-28 |
TWI346590B (en) | 2011-08-11 |
TW200529960A (en) | 2005-09-16 |
KR20060126776A (ko) | 2006-12-08 |
KR101049427B1 (ko) | 2011-07-14 |
JP2005230830A (ja) | 2005-09-02 |
US20070170227A1 (en) | 2007-07-26 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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EXPY | Cancellation because of completion of term |