KR20060126776A - 납땜 방법 - Google Patents
납땜 방법 Download PDFInfo
- Publication number
- KR20060126776A KR20060126776A KR1020067016454A KR20067016454A KR20060126776A KR 20060126776 A KR20060126776 A KR 20060126776A KR 1020067016454 A KR1020067016454 A KR 1020067016454A KR 20067016454 A KR20067016454 A KR 20067016454A KR 20060126776 A KR20060126776 A KR 20060126776A
- Authority
- KR
- South Korea
- Prior art keywords
- solder
- chamber
- free radical
- vacuum
- temperature
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (3)
- 주석 단독 또는 은, 납, 구리, 비스무스, 인듐, 아연의 1개 또는 2개 이상의 성분과 주석을 포함하는 고체상의 땜납을 갖는 피처리물이 배치된 진공실을 진공 상태로 감압시키고,그 후, 상기 진공실 내에 유리기 가스를 발생시켜서 상기 땜납의 산화막을 제거한 후,상기 유리기 가스의 발생을 중지하여 상기 진공실을 무산화 분위기로 하고, 상기 땜납을 땜납의 융점 이상의 온도로 하여 땜납을 용융하는 것을 특징으로 하는 납땜 방법.
- 제 1 항에 있어서,상기 피처리물에 대하여 상기 땜납이 고정되고, 이 고정은 상기 피처리물에 오목 부분을 형성하고, 이 오목 부분에 상기 땜납을 배치한 것을 특징으로 하는 납땜 방법.
- 제 1 항에 있어서,상기 피처리물에 대하여 상기 땜납이 고정되고, 이 고정은 알코올 또는 유기산을 주성분으로 하는 플럭스 또는 접착제를 통하여 행하여지는 것을 특징으로 하는 납땜 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2004-00040237 | 2004-02-17 | ||
JP2004040237A JP4732699B2 (ja) | 2004-02-17 | 2004-02-17 | はんだ付け方法 |
PCT/JP2005/002324 WO2005077583A1 (ja) | 2004-02-17 | 2005-02-16 | はんだ付け方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060126776A true KR20060126776A (ko) | 2006-12-08 |
KR101049427B1 KR101049427B1 (ko) | 2011-07-14 |
Family
ID=34857871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067016454A KR101049427B1 (ko) | 2004-02-17 | 2005-02-16 | 납땜 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070170227A1 (ko) |
JP (1) | JP4732699B2 (ko) |
KR (1) | KR101049427B1 (ko) |
CN (1) | CN100455394C (ko) |
TW (1) | TWI346590B (ko) |
WO (1) | WO2005077583A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102025514B1 (ko) * | 2018-05-25 | 2019-09-25 | 센주긴조쿠고교 가부시키가이샤 | 땜납 볼, 땜납 조인트 및 접합 방법 |
CN113385763A (zh) * | 2021-07-14 | 2021-09-14 | 成都共益缘真空设备有限公司 | 一种真空回流焊正负压结合焊接工艺 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007180447A (ja) * | 2005-12-28 | 2007-07-12 | Toyota Industries Corp | 半田付け方法、半田付け装置、及び半導体装置の製造方法 |
DE102006027027A1 (de) * | 2006-06-08 | 2007-12-13 | Centrotherm Thermal Solutions Gmbh + Co.Kg | Lötverfahren |
JP4991028B2 (ja) * | 2006-10-17 | 2012-08-01 | 国立大学法人九州工業大学 | 鉛フリーはんだ合金の処理方法 |
JP5003551B2 (ja) * | 2008-03-26 | 2012-08-15 | 三菱マテリアル株式会社 | ペースト用Pb−Snはんだ合金粉末およびPb−Snはんだ合金ボール |
KR101233282B1 (ko) | 2008-05-02 | 2013-02-14 | 야스히데 오노 | 접합 방법 및 접합 장치 |
JP5524541B2 (ja) * | 2009-09-02 | 2014-06-18 | 神港精機株式会社 | 半田バンプ形成方法 |
KR101070022B1 (ko) * | 2009-09-16 | 2011-10-04 | 삼성전기주식회사 | 다층 세라믹 회로 기판, 다층 세라믹 회로 기판 제조방법 및 이를 이용한 전자 디바이스 모듈 |
JP5801047B2 (ja) * | 2010-01-19 | 2015-10-28 | 有限会社ヨコタテクニカ | リフロー半田付け装置及び方法 |
JP5129848B2 (ja) * | 2010-10-18 | 2013-01-30 | 東京エレクトロン株式会社 | 接合装置及び接合方法 |
CN104395999B (zh) * | 2012-05-30 | 2017-03-08 | Ev 集团 E·索尔纳有限责任公司 | 用于接合基片的装置以及方法 |
WO2015011785A1 (ja) * | 2013-07-23 | 2015-01-29 | 千住金属工業株式会社 | はんだ付け装置及び真空はんだ付け方法 |
DE102014004728B4 (de) * | 2014-04-01 | 2016-03-10 | Centrotherm Photovoltaics Ag | Vorrichtung und Verfahren zum Löten von Fügepartnern |
JP2015123503A (ja) * | 2014-08-21 | 2015-07-06 | 千住金属工業株式会社 | 真空はんだ処理装置及びその制御方法 |
US10090626B2 (en) | 2015-03-10 | 2018-10-02 | Commscope Technologies Llc | Method and apparatus for forming interface between coaxial cable and connector |
CN105094159B (zh) * | 2015-07-08 | 2017-08-25 | 哈尔滨工业大学 | 真空舱室气体控制和监测方法 |
CN109877411A (zh) * | 2019-04-10 | 2019-06-14 | 中国电子科技集团公司第十三研究所 | 无助焊剂的微电路焊接组装方法 |
CN117340490A (zh) * | 2023-11-21 | 2024-01-05 | 中科光智(重庆)科技有限公司 | 一种微波等离子辅助的共晶回流焊接方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3231795A (en) * | 1962-10-18 | 1966-01-25 | Bendix Corp | Low inductance and capacitance electrical cartridge and method of manufacture |
JPS59225880A (ja) * | 1983-06-08 | 1984-12-18 | Toyo Radiator Kk | アルミニユ−ム材の真空ろう付方法 |
GB8827933D0 (en) * | 1988-11-30 | 1989-01-05 | Plessey Co Plc | Improvements relating to soldering processes |
US5352629A (en) * | 1993-01-19 | 1994-10-04 | General Electric Company | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules |
JP2798011B2 (ja) * | 1995-07-10 | 1998-09-17 | 日本電気株式会社 | 半田ボール |
JPH10154766A (ja) * | 1996-11-26 | 1998-06-09 | Matsushita Electric Works Ltd | 半導体パッケージの製造方法及び半導体パッケージ |
US6742701B2 (en) * | 1998-09-17 | 2004-06-01 | Kabushiki Kaisha Tamura Seisakusho | Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
JP2001058259A (ja) * | 1999-06-18 | 2001-03-06 | Shinko Seiki Co Ltd | 半田付け方法及び半田付け装置 |
US6935553B2 (en) * | 2002-04-16 | 2005-08-30 | Senju Metal Industry Co., Ltd. | Reflow soldering method |
JP2004006818A (ja) * | 2002-04-16 | 2004-01-08 | Tadatomo Suga | リフロー法とソルダペースト |
JP2004022963A (ja) * | 2002-06-19 | 2004-01-22 | Matsushita Electric Ind Co Ltd | 部品接合方法及び部品接合方法を用いた部品実装方法及び部品実装装置 |
-
2004
- 2004-02-17 JP JP2004040237A patent/JP4732699B2/ja not_active Expired - Lifetime
-
2005
- 2005-02-15 TW TW094104268A patent/TWI346590B/zh active
- 2005-02-16 CN CNB2005800052217A patent/CN100455394C/zh active Active
- 2005-02-16 US US10/588,868 patent/US20070170227A1/en not_active Abandoned
- 2005-02-16 KR KR1020067016454A patent/KR101049427B1/ko active IP Right Grant
- 2005-02-16 WO PCT/JP2005/002324 patent/WO2005077583A1/ja active Application Filing
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102025514B1 (ko) * | 2018-05-25 | 2019-09-25 | 센주긴조쿠고교 가부시키가이샤 | 땜납 볼, 땜납 조인트 및 접합 방법 |
CN113385763A (zh) * | 2021-07-14 | 2021-09-14 | 成都共益缘真空设备有限公司 | 一种真空回流焊正负压结合焊接工艺 |
Also Published As
Publication number | Publication date |
---|---|
CN1921977A (zh) | 2007-02-28 |
WO2005077583A1 (ja) | 2005-08-25 |
TW200529960A (en) | 2005-09-16 |
KR101049427B1 (ko) | 2011-07-14 |
JP2005230830A (ja) | 2005-09-02 |
TWI346590B (en) | 2011-08-11 |
US20070170227A1 (en) | 2007-07-26 |
CN100455394C (zh) | 2009-01-28 |
JP4732699B2 (ja) | 2011-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101049427B1 (ko) | 납땜 방법 | |
JP3809806B2 (ja) | 半導体装置の製造方法 | |
KR101233282B1 (ko) | 접합 방법 및 접합 장치 | |
JP4864591B2 (ja) | はんだ付け方法およびはんだ付け装置 | |
JP2001058259A (ja) | 半田付け方法及び半田付け装置 | |
JP2010161206A (ja) | 接合方法及びリフロー装置 | |
JP5339232B2 (ja) | 電気部品の接続方法とその接続装置 | |
JP4032899B2 (ja) | 電子部品の製造方法及び該方法に用いるハンダ付け装置 | |
JP2005205418A (ja) | 接合構造体の製造方法 | |
JP5885135B2 (ja) | 加熱溶融処理方法および加熱溶融処理装置 | |
JP2002001253A (ja) | プラズマ洗浄装置及びプラズマ洗浄方法並びに半田付けシステム及び半田付け方法 | |
JP3704113B2 (ja) | ボンディングステージ及び電子部品実装装置 | |
JP2014157858A (ja) | 半導体装置の製造方法 | |
JP2004071611A (ja) | 電子部品装着装置および電子部品装着方法 | |
WO2000017923A1 (fr) | Formation de bosses, procedes et dispositifs de preparation au soudage et de soudage | |
JP5941814B2 (ja) | ダイボンダ装置、及びダイボンド方法 | |
JP2004130351A (ja) | フラックスを使用しない半田接合方法 | |
JP3753524B2 (ja) | 電子部品の製造方法 | |
JP2007053245A (ja) | はんだ付け方法及びはんだ付け装置 | |
JP3159937B2 (ja) | 金属表面の接合前処理装置 | |
JPH11121523A (ja) | 電子部品の実装方法、チップの実装方法及び半導体パッケージ | |
JP3915624B2 (ja) | 電子部品装着装置および電子部品装着方法 | |
JPH11330791A (ja) | 電子部品装着装置 | |
JPH09148347A (ja) | マウンタ | |
JP2007329307A (ja) | 表面改質方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20140603 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20150527 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20160527 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20170529 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20180531 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20190523 Year of fee payment: 9 |