JP4699829B2 - リードフレーム基盤及び基板基盤半導体パッケージ用ボンディング構造とその製造方法 - Google Patents

リードフレーム基盤及び基板基盤半導体パッケージ用ボンディング構造とその製造方法 Download PDF

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JP4699829B2
JP4699829B2 JP2005214783A JP2005214783A JP4699829B2 JP 4699829 B2 JP4699829 B2 JP 4699829B2 JP 2005214783 A JP2005214783 A JP 2005214783A JP 2005214783 A JP2005214783 A JP 2005214783A JP 4699829 B2 JP4699829 B2 JP 4699829B2
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bonding
die
region
semiconductor device
device package
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JP2006041529A (ja
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景徠 張
稀裼 李
興奎 權
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2005214783A 2004-07-24 2005-07-25 リードフレーム基盤及び基板基盤半導体パッケージ用ボンディング構造とその製造方法 Active JP4699829B2 (ja)

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Publication number Priority date Publication date Assignee Title
JPS62185331A (ja) * 1986-02-10 1987-08-13 Sumitomo Electric Ind Ltd 半導体装置
JPH04269856A (ja) * 1991-02-26 1992-09-25 Hitachi Ltd 半導体集積回路装置
JPH11284006A (ja) * 1998-03-31 1999-10-15 Fujitsu Ltd 半導体装置
JP2003264268A (ja) * 2002-03-08 2003-09-19 Toshiba Corp 半導体装置用リードフレーム及び半導体装置

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US4195193A (en) * 1979-02-23 1980-03-25 Amp Incorporated Lead frame and chip carrier housing
DE19652395A1 (de) * 1996-06-13 1997-12-18 Samsung Electronics Co Ltd Integrierte Schaltkreisanordnung
JPH10116953A (ja) * 1996-10-09 1998-05-06 Oki Electric Ind Co Ltd リードフレーム及びこれを用いた半導体装置
DE19704343A1 (de) * 1997-02-05 1998-08-20 Siemens Ag Montageverfahren für Halbleiterbauelemente
JP4626919B2 (ja) * 2001-03-27 2011-02-09 ルネサスエレクトロニクス株式会社 半導体装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185331A (ja) * 1986-02-10 1987-08-13 Sumitomo Electric Ind Ltd 半導体装置
JPH04269856A (ja) * 1991-02-26 1992-09-25 Hitachi Ltd 半導体集積回路装置
JPH11284006A (ja) * 1998-03-31 1999-10-15 Fujitsu Ltd 半導体装置
JP2003264268A (ja) * 2002-03-08 2003-09-19 Toshiba Corp 半導体装置用リードフレーム及び半導体装置

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