JP4699829B2 - リードフレーム基盤及び基板基盤半導体パッケージ用ボンディング構造とその製造方法 - Google Patents
リードフレーム基盤及び基板基盤半導体パッケージ用ボンディング構造とその製造方法 Download PDFInfo
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- JP4699829B2 JP4699829B2 JP2005214783A JP2005214783A JP4699829B2 JP 4699829 B2 JP4699829 B2 JP 4699829B2 JP 2005214783 A JP2005214783 A JP 2005214783A JP 2005214783 A JP2005214783 A JP 2005214783A JP 4699829 B2 JP4699829 B2 JP 4699829B2
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- Engineering & Computer Science (AREA)
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- Computer Hardware Design (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Applications Claiming Priority (4)
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KR10-2004-0058070 | 2004-07-24 | ||
KR1020040058070A KR100642748B1 (ko) | 2004-07-24 | 2004-07-24 | 리드 프레임과 패키지 기판 및 이들을 이용한 패키지 |
US11/084,529 | 2005-03-18 | ||
US11/084,529 US7566954B2 (en) | 2004-07-24 | 2005-03-18 | Bonding configurations for lead-frame-based and substrate-based semiconductor packages |
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JP2009200253A (ja) * | 2008-02-21 | 2009-09-03 | Powertech Technology Inc | 半導体装置 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62185331A (ja) * | 1986-02-10 | 1987-08-13 | Sumitomo Electric Ind Ltd | 半導体装置 |
JPH04269856A (ja) * | 1991-02-26 | 1992-09-25 | Hitachi Ltd | 半導体集積回路装置 |
JPH11284006A (ja) * | 1998-03-31 | 1999-10-15 | Fujitsu Ltd | 半導体装置 |
JP2003264268A (ja) * | 2002-03-08 | 2003-09-19 | Toshiba Corp | 半導体装置用リードフレーム及び半導体装置 |
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US4195193A (en) * | 1979-02-23 | 1980-03-25 | Amp Incorporated | Lead frame and chip carrier housing |
DE19652395A1 (de) * | 1996-06-13 | 1997-12-18 | Samsung Electronics Co Ltd | Integrierte Schaltkreisanordnung |
JPH10116953A (ja) * | 1996-10-09 | 1998-05-06 | Oki Electric Ind Co Ltd | リードフレーム及びこれを用いた半導体装置 |
DE19704343A1 (de) * | 1997-02-05 | 1998-08-20 | Siemens Ag | Montageverfahren für Halbleiterbauelemente |
JP4626919B2 (ja) * | 2001-03-27 | 2011-02-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS62185331A (ja) * | 1986-02-10 | 1987-08-13 | Sumitomo Electric Ind Ltd | 半導体装置 |
JPH04269856A (ja) * | 1991-02-26 | 1992-09-25 | Hitachi Ltd | 半導体集積回路装置 |
JPH11284006A (ja) * | 1998-03-31 | 1999-10-15 | Fujitsu Ltd | 半導体装置 |
JP2003264268A (ja) * | 2002-03-08 | 2003-09-19 | Toshiba Corp | 半導体装置用リードフレーム及び半導体装置 |
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JP2006041529A (ja) | 2006-02-09 |
DE102005035083B4 (de) | 2007-08-23 |
DE102005035083A1 (de) | 2006-03-16 |
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